2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Latest Publications

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Published By IEEE

9782355000287, 9782355000270

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Microwave atomic force microscope: MG63 osteoblast-like cells analysis on nanometer scale

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ◽

10.1109/dtip.2014.7056644 ◽

2014 ◽

Author(s):

Lan Zhang ◽

Yuanhui Song ◽

Atsushi Hosoi ◽

Yasuyuki Morita ◽

Yang Ju

Keyword(s):

Atomic Force Microscope ◽

Nanometer Scale ◽

Atomic Force

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Piezoelectric PVDF film switch to activate event-driven system for chicken health monitoring

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ◽

10.1109/dtip.2014.7056689 ◽

2014 ◽

Cited By ~ 1

Author(s):

Hirfoumi Nogami ◽

Hironao Okada ◽

Seiichi Takamatsu ◽

Takeshi Kobayashi ◽

Ryutaro Maeda ◽

...

Keyword(s):

Health Monitoring ◽

Pvdf Film ◽

Driven System ◽

Event Driven

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Creep in MEMS

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ◽

10.1109/dtip.2014.7056680 ◽

2014 ◽

Author(s):

A. Soma ◽

G. De Pasquale ◽

M. M. Saleem

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Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ◽

10.1109/dtip.2014.7056631 ◽

2014 ◽

Author(s):

Nicolas Lietaer ◽

Anand Summanwar ◽

Sara Rund Herum ◽

Leny Nazareno

Keyword(s):

Dry Film

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A high resolution vibrating beam accelerometer working in nonlinear region for seismic ground sensor application

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ◽

10.1109/dtip.2014.7056683 ◽

2014 ◽

Cited By ~ 2

Author(s):

R. Levy ◽

G. Papin ◽

O. Le Traon ◽

D. Janiaud ◽

J. Guerard

Keyword(s):

High Resolution ◽

Nonlinear Region ◽

Sensor Application

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Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ◽

10.1109/dtip.2014.7056679 ◽

2014 ◽

Cited By ~ 2

Author(s):

A. Lucibello ◽

G. Capoccia ◽

E. Proietti ◽

R. Marcelli ◽

B. Margesin ◽

...

Keyword(s):

Thermal Stress ◽

Rf Mems

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Controllable S-doping of graphene through annealing with hydrogen sulfide

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ◽

10.1109/dtip.2014.7056646 ◽

2014 ◽

Author(s):

Chen Liang ◽

Yi Wang ◽

Yuelin Wang ◽

Tie Li

Keyword(s):

Hydrogen Sulfide

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Developing MEMS DC electric current sensor for end-use monitoring of DC power supply: Part IV — Cantilever-based magnetic field sensor device

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ◽

10.1109/dtip.2014.7056702 ◽

2014 ◽

Cited By ~ 2

Author(s):

Daisuke Terasawa ◽

Dong F. Wang ◽

Takahiro Kizaki ◽

Toshihiro Itoh ◽

Ryutaro Maeda

Keyword(s):

Magnetic Field ◽

Electric Current ◽

Power Supply ◽

Magnetic Field Sensor ◽

Current Sensor ◽

Dc Power ◽

Sensor Device ◽

Field Sensor ◽

Dc Power Supply ◽

End Use

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Determination of the severity of thermal stress using model data calculated from thermal transient results

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ◽

10.1109/dtip.2014.7056701 ◽

2014 ◽

Author(s):

Zoltan Sarkany ◽

Marta Rencz

Keyword(s):

Thermal Stress ◽

Model Data ◽

Thermal Transient

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Packaging of a multifunctional implantable heart monitoring device

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ◽

10.1109/dtip.2014.7056657 ◽

2014 ◽

Cited By ~ 2

Author(s):

Anh-Tuan T. Nguyen ◽

Fjodors Tjulkins ◽

E Knut ◽

Aasmundtveit ◽

Nils Hoivik ◽

...

Keyword(s):

Monitoring Device ◽

Heart Monitoring

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2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Microwave atomic force microscope: MG63 osteoblast-like cells analysis on nanometer scale

Piezoelectric PVDF film switch to activate event-driven system for chicken health monitoring

Creep in MEMS

Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs

A high resolution vibrating beam accelerometer working in nonlinear region for seismic ground sensor application

Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress

Controllable S-doping of graphene through annealing with hydrogen sulfide

Developing MEMS DC electric current sensor for end-use monitoring of DC power supply: Part IV — Cantilever-based magnetic field sensor device

Determination of the severity of thermal stress using model data calculated from thermal transient results

Packaging of a multifunctional implantable heart monitoring device

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Latest Publications