Creep in MEMS

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ◽

10.1109/dtip.2014.7056680 ◽

2014 ◽

Author(s):

A. Soma ◽

G. De Pasquale ◽

M. M. Saleem

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