Assembly and packaging of non-bumped 3D chip stacks on bumped substrates

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897471 ◽

2014 ◽

Cited By ~ 2

Author(s):

Bing Dang ◽

Joana Maria ◽

Qianwen Chen ◽

Jae-Woong Nah ◽

Paul Andry ◽

...

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