Solder joint inspection with induction thermography

2014 ◽  
Author(s):  
Johannes Bohm ◽  
Klaus-Juergen Wolter ◽  
Henning Heuer
Keyword(s):  
Solder Joint ◽  
Solder Joint Inspection

Vibration Analysis Based Modeling and Defect Recognition for Flip Chip Solder Joint Inspection

2000 ◽  
Author(s):  
Sheng Liu ◽  
Dathan Erdahl ◽  
I. Charles Ume
Keyword(s):  
Solder Joint ◽  
Vibration Analysis ◽  
Flip Chip ◽  
Process Development ◽  
Great Promise ◽  
Quality Inspection ◽  
Vibration Frequencies ◽  
Vibration Responses ◽  
Solder Joint Inspection ◽  
Joint Quality

Abstract A novel approach for flip chip solder joint quality inspection based on vibration analysis is presented. Traditional solder joint inspection methods have their limitations when applied to flip chip solder joint quality inspection. The vibration detection method is a new approach which has advantages such as being non-contact, non-destructive, fast and can be used on-line or during process development. In this technique, a flip chip was modeled as a thick plate supported by solder bumps. Changes in solder joint quality produce different vibration responses of flip chip, and change its natural vibration frequencies. In this paper, the vibration frequencies of a flip chip on a ceramic substrate were calculated using the finite element method. Based on vibration analysis, a laser ultrasound and interferometric system was developed for flip chip solder joint quality inspection. In this system, chips with good solder joints can be distinguished from chips with bad joints using their vibration responses and frequencies. Defects recognition methods were developed and tested. Results indicate this approach offers great promise for solder bump inspection in flip chip, BGA and chip scale packages.

An Efficient Method for Solder Joint Inspection Based on Statistical Learning

2011 ◽  
Vol 121-126 ◽  
pp. 4931-4935
Author(s):  
Yong Cong Kuang ◽  
Gao Fei Ouyang ◽  
Hong Wei Xie ◽  
Xian Min Zhang
Keyword(s):  
Feature Selection ◽  
Solder Joint ◽  
Statistical Learning ◽  
Efficient Method ◽  
Solder Joints ◽  
Sampling Algorithm ◽  
Inspection Method ◽  
Defect Type ◽  
Imbalance Problem ◽  
Solder Joint Inspection

To improve the performance of current solder joint inspection method, an efficient method based on statistical learning is proposed in this paper. In the method, the solder was divided into several sub-regions to determine the defect type. To resolve imbalance problem, an improved over-sampling algorithm was proposed in which the synthetics samples are generated between the boundary samples and their neighbors. AdaBoost was used for feature selection and classification for every sub-region. Experiments results showed that the defects of solder joints can be identified properly using the proposed algorithm.

Solder Joint Inspection Using Imaginary Part of Gabor Features

2021 ◽  
Author(s):  
Hao Wu ◽  
Tianya You ◽  
Xiangrong Xu ◽  
Aleksandar Rodic ◽  
Petar B. Petrovic
Keyword(s):  
Solder Joint ◽  
Imaginary Part ◽  
Gabor Features ◽  
Solder Joint Inspection

SMT Solder Joint Inspection via a Novel Cascaded Convolutional Neural Network

2018 ◽  
Vol 8 (4) ◽  
pp. 670-677 ◽  
Author(s):  
Nian Cai ◽  
Guandong Cen ◽  
Jixiu Wu ◽  
Feiyang Li ◽  
Han Wang ◽  
...  
Keyword(s):  
Neural Network ◽  
Solder Joint ◽  
Convolutional Neural Network ◽  
Solder Joint Inspection
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