First demonstration of reliable copper-plated 30μm diameter through-package-vias in ultra-thin bare glass interposers
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2014 ◽
Vol 2014
(1)
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pp. 000402-000408
2011 ◽
Vol 284-286
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pp. 348-352
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2002 ◽
Vol 37
(4)
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pp. 340-352
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2017 ◽
Vol 7
(6)
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pp. 829-837
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