The optimum thermal design of microchannel heat sinks

2002 ◽  
Author(s):  
W. Zhimin ◽  
C.K. Fah
Keyword(s):  
Thermal Design ◽  
Heat Sinks ◽  
Microchannel Heat Sinks

Thermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink

2010 ◽  
Vol 2 (4) ◽  
Author(s):  
Dylan Farnam ◽  
Bahgat Sammakia ◽  
Kanad Ghose
Keyword(s):  
Contact Area ◽  
Heat Sink ◽  
Heat Removal ◽  
Thermal Design ◽  
Heat Sinks ◽  
Design Criteria ◽  
Microchannel Heat Sink ◽  
Device Architecture ◽  
Microchannel Heat Sinks ◽  
Thermal Solution

Increasing power dissipation in microprocessors and other devices is leading to the consideration of more capable thermal solutions than the traditional air-cooled fin heat sinks. Microchannel heat sinks (MHSs) are promising candidates for long-term thermal solution given their simplicity, performance, and the development of MHS-compatible 3D device architecture. As the traditional methods of cooling generally have uniform heat removal on the contact area with the device, thermal consequences of design have traditionally been considered only after the layout of components on a device is finalized in accordance with connection and other criteria. Unlike traditional cooling solutions, however, microchannel heat sinks provide highly nonuniform heat removal on the contact area with the device. This feature is of utmost importance and can actually be used quite advantageously, if considered during the design phase of a device. In this study, simple thermal design criteria governing the general placement of components on devices to be cooled by microchannel heat sink are developed and presented. These thermal criteria are not meant to supersede connection and other important design criteria but are intended as a necessary and valuable supplement. Full-scale numerical simulations of a device with a realistic power map cooled by microchannel heat sink prove the effectiveness of the criteria, showing large reduction in maximum operating temperature and harmful temperature gradients. The simulations further show that the device and microchannel heat sink can dissipate a comparatively high amount of power, with little thermal danger, when design considers the criteria developed herein.

Thermal Design of Microchannel Heat Sinks for Low-Orbit Micro-Satellites

2005 ◽  
Author(s):  
Amaury J. H. Heresztyn ◽  
Nicole C. DeJong Okamoto
Keyword(s):  
Heat Flux ◽  
Fluid Model ◽  
High Heat ◽  
Thermal Design ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Propulsion Systems ◽  
Pressure Drops ◽  
Nuclear Propulsion ◽  
Microchannel Heat Sinks

As reduction in the size of electronics creates demand for smaller, less expensive and faster-to-produce spacecraft, the use of high heat flux electronics or advanced nuclear propulsion systems will increase the stress on the thermal subsystem. This work presents a thermal management solution to this problem using liquid-cooled microchannel heat sinks. First, a simple computer model is used to illustrate the need for an atypical cooling method when high-heat flux electronics are used. Second, a thermal/fluid model of microchannel heat sinks is developed and applied to address the satellite thermal need. The total thermal resistances and pressure drops show excellent comparison with published experimental and analytical results. Finally, the model of the microchannel heat sink is optimized to remove 25 W/cm2 over a footprint of 3.7cm2. The mass flow rate needed was significantly lower (almost 5–10 times lower) when compared to other published results, which means that micro-pumps available on the market will be sufficient. The integration of the microchannel system with the satellite is also discussed.

MICROCHANNEL HEAT SINKS: AN OVERVIEW OF THE STATE-OF-THE-ART

2004 ◽  
Vol 8 (3) ◽  
pp. 183-205 ◽  
Author(s):  
I. Hassan ◽  
P. Phutthavong ◽  
M. Abdelgawad
Keyword(s):  
State Of The Art ◽  
The State ◽  
Heat Sinks ◽  
Microchannel Heat Sinks
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