Application of moire interferometry in electronics packaging

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) ◽

10.1109/eptc.1997.723922 ◽

2002 ◽

Cited By ~ 4

Author(s):

H.M. Ho ◽

K.E. Oh ◽

E.H. Wong ◽

T.B. Lim

Keyword(s):

Electronics Packaging ◽

Moiré Interferometry ◽

Moire Interferometry

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Application of the moire interferometry to thermal strain analysis for electronics packaging

10.1117/12.474040 ◽

2003 ◽

Cited By ~ 2

Author(s):

Zhaowei Zhong

Keyword(s):

Thermal Strain ◽

Strain Analysis ◽

Electronics Packaging ◽

Moiré Interferometry ◽

Moire Interferometry

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Moire Interferometry Studies of PBX 9501

10.1063/1.1483664 ◽

2002 ◽

Cited By ~ 2

Author(s):

Philip J. Rae

Keyword(s):

Moiré Interferometry ◽

Moire Interferometry

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Developments In Moire Interferometry

Optical Engineering ◽

10.1117/12.7972930 ◽

1982 ◽

Vol 21 (3) ◽

Cited By ~ 74

Author(s):

Daniel Post

Keyword(s):

Moiré Interferometry ◽

Moire Interferometry

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Measuring corrosion using field-shifting moire interferometry

10.1117/12.230403 ◽

1996 ◽

Author(s):

Mark A. Michniewicz

Keyword(s):

Moiré Interferometry ◽

Moire Interferometry

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Evaluation of thermal deformation model for BGA packages using moiré interferometry

KSME International Journal ◽

10.1007/bf03184732 ◽

2004 ◽

Vol 18 (2) ◽

pp. 230-239 ◽

Cited By ~ 1

Author(s):

Jinwon Joo ◽

Seungmin Cho

Keyword(s):

Thermal Deformation ◽

Moiré Interferometry ◽

Deformation Model ◽

Moire Interferometry ◽

Bga Packages

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An Investigation of CO2 Laser Scleral Buckling Using Moiré Interferometry

Ophthalmic Surgery Lasers and Imaging Retina ◽

10.3928/1542-8877-20020501-09 ◽

2002 ◽

Vol 33 (3) ◽

pp. 221-227

Author(s):

Saher M Maswadi ◽

Peter E Dyer ◽

Dinesh Verma ◽

Wadah Jalabi ◽

Dinesh Dave

Keyword(s):

Co2 Laser ◽

Scleral Buckling ◽

Moiré Interferometry ◽

Moire Interferometry

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Analysis of the Thermal Loading on Electronics Packages by Enhanced Moiré Interferometry

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_8 ◽

1993 ◽

pp. 272-304 ◽

Cited By ~ 2

Author(s):

Arkady Voloshin

Keyword(s):

Thermal Loading ◽

Moiré Interferometry ◽

Moire Interferometry ◽

Electronics Packages

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Measurement of Residual Stresses in Diamond Coated Substrates Utilizing Coherent Light Projection Moiré Interferometry

Optical Measurements, Modeling, and Metrology, Volume 5 - Conference Proceedings of the Society for Experimental Mechanics Series ◽

10.1007/978-1-4614-0228-2_25 ◽

2011 ◽

pp. 209-217 ◽

Cited By ~ 1

Author(s):

C. A. Sciammarella ◽

A. Boccaccio ◽

M. C. Frassanito ◽

L. Lamberti ◽

C. Pappalettere

Keyword(s):

Residual Stresses ◽

Moiré Interferometry ◽

Moire Interferometry ◽

Coherent Light ◽

Projection Moire

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Study on superelastic characteristic of polycrystalline NiTi shape memory alloys using moiré interferometry

10.1117/12.839264 ◽

2008 ◽

Author(s):

Guo-biao Yang ◽

Wei-ming Zeng ◽

Yi Ding

Keyword(s):

Shape Memory Alloys ◽

Shape Memory ◽

Moiré Interferometry ◽

Moire Interferometry ◽

Niti Shape Memory Alloys

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Precision strain standard by moiré interferometry for strain-gage calibration

Experimental Mechanics ◽

10.1007/bf02326390 ◽

1982 ◽

Vol 22 (7) ◽

pp. 256-261 ◽

Cited By ~ 11

Author(s):

R. B. Watson ◽

D. Post

Keyword(s):

Strain Gage ◽

Moiré Interferometry ◽

Moire Interferometry

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