Thermal contact conductance of typical interfaces in electronic packages under low contact pressures

2002 ◽  
Author(s):  
K.C. Toh ◽  
K.K. Ng
Keyword(s):  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Electronic Packages ◽  
Contact Conductance ◽  
Contact Pressures

Effect of Metallic Coatings on the Thermal Contact Conductance of Turned Surfaces

1990 ◽  
Vol 112 (4) ◽  
pp. 864-871 ◽  
Author(s):  
T. K. Kang ◽  
G. P. Peterson ◽  
L. S. Fletcher
Keyword(s):  
Experimental Data ◽  
Thermal Contact ◽  
Coating Material ◽  
Thermal Contact Conductance ◽  
Enhancement Effect ◽  
Metallic Coatings ◽  
Coating Materials ◽  
Contact Conductance ◽  
Significant Parameter ◽  
Contact Pressures

An experimental investigation was conducted to determine the degree to which the thermal contact conductance at the interface of contacting Aluminum 6061 T6 surfaces could be enhanced through the use of vapor-deposited metallic coatings. Three different coating materials (lead, tin, and indium) were evaluated using four different thicknesses for each coating material. The results verified the existence of an optimum coating thickness, shown to be in the range of 2.0 to 3.0 μm for indium, 1.5 to 2.5 μm for lead, and 0.2 to 0.5 μm for tin. The enhancement factors for thermal contact conductance were found to be on the order of 700, 400, and 50 percent, respectively. Based upon the experimental data, the hardness of the coating materials appears to be the most significant parameter in ranking the substrate and coating material combinations; however, additional experimental data are needed to substantiate this hypothesis. Finally, it was apparent that the thermal contact conductance enhancement effect was greatest at low contact pressures and decreased significantly with increases in the contact pressure.

scholarly journals Thermal Contact Conductance at Low Contact Pressures

2004 ◽  
Vol 18 (1) ◽  
pp. 37-44 ◽  
Author(s):  
Fernando H. Milanez ◽  
Michael M. Yovanovich ◽  
Marcia B. H. Mantelli
Keyword(s):  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance ◽  
Contact Pressures

Thermal Contact Conductance Across Gold-Coated OFHC Copper Contacts in Different Media

2005 ◽  
Vol 127 (6) ◽  
pp. 657-659 ◽  
Author(s):  
Bapurao Kshirsagar, ◽  
Prashant Misra, ◽  
Nagaraju Jampana, and ◽  
M. V. Krishna Murthy
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
Contact Pressure ◽  
Thermal Contact ◽  
High Conductivity ◽  
Thermal Contact Conductance ◽  
Ofhc Copper ◽  
Contact Conductance ◽  
Contact Pressures ◽  
Good Agreement

The thermal contact conductance studies across gold-coated oxygen-free high-conductivity copper contacts have been conducted at different contact pressures in vacuum, nitrogen, and helium environments. It is observed that the thermal contact conductance increases not only with the increase in contact pressure but also with the increase in thermal conductivity of interstitial medium. The experimental data are found to be in good agreement with the literature.

An Experimental Study to Show the Effect of Thermal Stress on Thermal Contact Conductance at Sub-megapascal Contact Pressures

2010 ◽  
Vol 132 (9) ◽  
Author(s):  
Prashant Misra ◽  
J. Nagaraju
Keyword(s):  
Thermal Stress ◽  
Contact Pressure ◽  
Thermal Stresses ◽  
Thermal Contact ◽  
Experimental Studies ◽  
Thermal Contact Conductance ◽  
Large Temperature ◽  
Contact Conductance ◽  
Closed Contact ◽  
Contact Pressures

Experimental studies are presented to show the effect of thermal stresses on thermal contact conductance (TCC) at low contact pressures. It is observed that in a closed contact assembly, contact pressure acting on the interface changes with the changing temperature of contact members. This change in contact pressure consequently causes variations in the TCC of the junction. A relationship between temperature change and the corresponding magnitude of developed thermal stress in a contact assembly is determined experimentally. Inclusion of a term called temperature dependent load correction factor is suggested in the theoretical model for TCC to make it capable of predicting TCC values more accurately in contact assemblies that experience large temperature fluctuations.

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