fluxless bonding Latest Research Papers

Fluxless Bonding of Large Area (≥ 900 mm2) Dies-Opportunities and Challenges

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00083 ◽

2021 ◽

Author(s):

Adeel Bajwa ◽

Tom Colosimo ◽

Tim Grant ◽

Bob Chylak

Keyword(s):

Large Area ◽

Fluxless Bonding

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Fluxless Bonding Technique of Diamond to Copper Using Silver-Indium Multilayer Structure

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2019.00030 ◽

2019 ◽

Cited By ~ 1

Author(s):

Roozbeh Sheikhi ◽

Yongjun Huo ◽

Chin C. Lee

Keyword(s):

Multilayer Structure ◽

Fluxless Bonding ◽

Bonding Technique

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Formation behavior of intermetallic compound in solder joint assembly within fluxless bonding

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2018.8625845 ◽

2018 ◽

Author(s):

Yung-Ta Li ◽

Yuan-Hung Xu ◽

Jiao-Dong Ji ◽

Chang-Fu Lin ◽

C. Key Chung

Keyword(s):

Intermetallic Compound ◽

Solder Joint ◽

Fluxless Bonding ◽

Formation Behavior ◽

Joint Assembly

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Reliability performance of 30μm-pitch solder micro bump fluxless bonding interconnections

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374337 ◽

2018 ◽

Author(s):

Shin-Yi Huang ◽

Tao-Chih Chang ◽

Yu-Min Lin ◽

Su-Ching Chung ◽

Su-Yu Fun

Keyword(s):

Fluxless Bonding ◽

Reliability Performance

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Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 µm Pitch SnAg Solder 3-D Interconnections

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.191 ◽

2016 ◽

Cited By ~ 2

Author(s):

Katsuyuki Sakuma ◽

Buck Webb ◽

Xiao Hu Liu ◽

John Knickerbocker ◽

Thomas Weiss ◽

...

Keyword(s):

Bonding Process ◽

Fluxless Bonding ◽

Snag Solder

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Development of fluxless bonding using deposited Gold-indium multi-layer composite for heterogeneous silicon micro-cooler stacking

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2014.7028275 ◽

2014 ◽

Cited By ~ 2

Author(s):

B. L. Lau ◽

Yong Han ◽

H. Y. Zhang ◽

L. Zhang ◽

X. W. Zhang

Keyword(s):

Fluxless Bonding ◽

Layer Composite

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Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-014-2014-z ◽

2014 ◽

Vol 25 (8) ◽

pp. 3276-3284 ◽

Cited By ~ 2

Author(s):

Shou-Jen Hsu ◽

Chu-Hsuan Sha ◽

Chin C. Lee

Keyword(s):

Fluxless Bonding

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Study of low temperature and high heat-resistant fluxless bonding via nanoscale thin film control toward wafer-level multiple chip stacking for 3D LSI

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6248799 ◽

2012 ◽

Cited By ~ 3

Author(s):

Eiji Morinaga ◽

Yuichi Oka ◽

Hiroaki Nishimori ◽

Haruhiko Miyagawa ◽

Ryohei Satoh ◽

...

Keyword(s):

Thin Film ◽

Low Temperature ◽

High Heat ◽

Wafer Level ◽

Fluxless Bonding ◽

Heat Resistant ◽

Nanoscale Thin Film

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Fluxless Bonding of Bismuth Telluride Chips to Alumina Using Ag–In System for High Temperature Thermoelectric Devices

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2011.2160944 ◽

2011 ◽

Vol 1 (9) ◽

pp. 1311-1318 ◽

Cited By ~ 12

Author(s):

Wen P. Lin ◽

Chin C. Lee

Keyword(s):

High Temperature ◽

Bismuth Telluride ◽

Thermoelectric Devices ◽

Fluxless Bonding

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Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898483 ◽

2011 ◽

Cited By ~ 14

Author(s):

K. Sakuma ◽

K. Toriyama ◽

H. Noma ◽

K. Sueoka ◽

N. Unami ◽

...

Keyword(s):

Fluxless Bonding ◽

Fine Pitch ◽

Low Volume

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fluxless bonding
Recently Published Documents

TOTAL DOCUMENTS

H-INDEX

Fluxless Bonding of Large Area (≥ 900 mm2) Dies-Opportunities and Challenges

Fluxless Bonding Technique of Diamond to Copper Using Silver-Indium Multilayer Structure

Formation behavior of intermetallic compound in solder joint assembly within fluxless bonding

Reliability performance of 30μm-pitch solder micro bump fluxless bonding interconnections

Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 µm Pitch SnAg Solder 3-D Interconnections

Development of fluxless bonding using deposited Gold-indium multi-layer composite for heterogeneous silicon micro-cooler stacking

Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder

Study of low temperature and high heat-resistant fluxless bonding via nanoscale thin film control toward wafer-level multiple chip stacking for 3D LSI

Fluxless Bonding of Bismuth Telluride Chips to Alumina Using Ag–In System for High Temperature Thermoelectric Devices

Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

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fluxless bondingRecently Published Documents

TOTAL DOCUMENTS

H-INDEX

Fluxless Bonding of Large Area (≥ 900 mm2) Dies-Opportunities and Challenges

Fluxless Bonding Technique of Diamond to Copper Using Silver-Indium Multilayer Structure

Formation behavior of intermetallic compound in solder joint assembly within fluxless bonding

Reliability performance of 30μm-pitch solder micro bump fluxless bonding interconnections

Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 µm Pitch SnAg Solder 3-D Interconnections

Development of fluxless bonding using deposited Gold-indium multi-layer composite for heterogeneous silicon micro-cooler stacking

Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder

Study of low temperature and high heat-resistant fluxless bonding via nanoscale thin film control toward wafer-level multiple chip stacking for 3D LSI

Fluxless Bonding of Bismuth Telluride Chips to Alumina Using Ag–In System for High Temperature Thermoelectric Devices

Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

fluxless bonding
Recently Published Documents