2012 IEEE 62nd Electronic Components and Technology Conference
Latest Publications

TOTAL DOCUMENTS

354

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H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781467319652, 9781467319669, 9781467319645

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Highly-reliable silicon and glass interposers-to-printed wiring board SMT interconnections: Modeling, design, fabrication and reliability

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249072 ◽

2012 ◽

Cited By ~ 11

Author(s):

Xian Qin ◽

Nitesh Kumbhat ◽

Venky Sundaram ◽

Rao Tummala

Keyword(s):

Printed Wiring Board ◽

Wiring Board

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Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6248992 ◽

2012 ◽

Cited By ~ 7

Author(s):

Jae-Woong Nah ◽

Michael Gaynes ◽

Eric Perfecto ◽

Claudius Feger

Keyword(s):

Flip Chip ◽

Organic Substrates ◽

Wafer Level ◽

Cu Pillar ◽

Area Array ◽

Flip Chip Packaging ◽

Low K

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Interlayer dielectric cracking in back end of line (BEOL) stack

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249030 ◽

2012 ◽

Cited By ~ 9

Author(s):

Sathyanarayanan Raghavan ◽

Ilko Schmadlak ◽

Suresh K. Sitaraman

Keyword(s):

Interlayer Dielectric

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Characterization of Al wire wedge bonding in power electronics package

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249096 ◽

2012 ◽

Cited By ~ 2

Author(s):

Yumin Liu ◽

Yong Liu ◽

Daren Keller ◽

Suresh Belani ◽

Michael Dube

Keyword(s):

Power Electronics ◽

Wedge Bonding

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Design, modeling, and fabrication of mm3 three-dimensional integrated antennas

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249081 ◽

2012 ◽

Cited By ~ 1

Author(s):

Peter Gadfort ◽

Paul D. Franzon

Keyword(s):

Three Dimensional ◽

Integrated Antennas

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Robust TSV via-middle and via-reveal process integration accomplished through characterization and management of sources of variation

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6248922 ◽

2012 ◽

Cited By ~ 19

Author(s):

Niranjan Kumar ◽

Sesh Ramaswami ◽

John Dukovic ◽

Jennifer Tseng ◽

Ran Ding ◽

...

Keyword(s):

Process Integration ◽

Sources Of Variation

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High productivity and damage-free ultrasonic anisotropic conductive film (ACF) bonding for touch screen panel (TSP) assemblies

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249077 ◽

2012 ◽

Cited By ~ 1

Author(s):

Seung-Ho Kim ◽

Young-Jae Kim ◽

Ho Joon Park ◽

Kyung-Wook Paik

Keyword(s):

Touch Screen ◽

Anisotropic Conductive Film ◽

High Productivity ◽

Conductive Film

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Metrology and inspection rquirements for 3D stacking of ICs

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6248894 ◽

2012 ◽

Author(s):

Sandip Halder ◽

Andy Miller ◽

Mireille Maenhoudt ◽

Gerald Beyer ◽

Bart Swinnen ◽

...

Keyword(s):

3D Stacking

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Design and process development of a stacked SRAM memory chip module with TSV interconnection

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249101 ◽

2012 ◽

Cited By ~ 4

Author(s):

Shenglin Ma ◽

Xin Sun ◽

Yunhui Zhu ◽

Zhiyuan Zhu ◽

Qinghu Cui ◽

...

Keyword(s):

Process Development ◽

Memory Chip ◽

Sram Memory

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Using polymer and ionic liquid as liquid droplet study in single-plate electrowetting system

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249046 ◽

2012 ◽

Author(s):

Edward K L Chan ◽

Matthew M F Yuen

Keyword(s):

Ionic Liquid ◽

Liquid Droplet ◽

Single Plate

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2012 IEEE 62nd Electronic Components and Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Highly-reliable silicon and glass interposers-to-printed wiring board SMT interconnections: Modeling, design, fabrication and reliability

Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates

Interlayer dielectric cracking in back end of line (BEOL) stack

Characterization of Al wire wedge bonding in power electronics package

Design, modeling, and fabrication of mm3 three-dimensional integrated antennas

Robust TSV via-middle and via-reveal process integration accomplished through characterization and management of sources of variation

High productivity and damage-free ultrasonic anisotropic conductive film (ACF) bonding for touch screen panel (TSP) assemblies

Metrology and inspection rquirements for 3D stacking of ICs

Design and process development of a stacked SRAM memory chip module with TSV interconnection

Using polymer and ionic liquid as liquid droplet study in single-plate electrowetting system

2012 IEEE 62nd Electronic Components and Technology Conference
Latest Publications