2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2018.8625756 ◽

2018 ◽

Cited By ~ 1

Author(s):

Kosuke Yamada ◽

Hiroyuki Kuwae ◽

Takumi Kamibayashi ◽

Wataru Momose ◽

Shuichi Shoji ◽

...

Keyword(s):

Low Temperature ◽

Atomic Layer Deposition ◽

Intermediate Layer ◽

Atomic Layer ◽

Layer Deposition

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A Novel Die Attach Material Having High Die Shear Strength and High Heat Resistance for Brighter LED Device

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2018.8625780 ◽

2018 ◽

Author(s):

Tadatomo Yamada ◽

Manabu Miyawaki ◽

Susumu Miura ◽

Akiko Umeda ◽

Hironori Shizuhata

Keyword(s):

Shear Strength ◽

Heat Resistance ◽

High Heat ◽

High Heat Resistance ◽

Die Attach

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An Wide Locking Range Injection-Locked Frequency Divider by Dual Resonance Tank

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2018.8625785 ◽

2018 ◽

Author(s):

Wen-Cheng Lai ◽

Sheng-Lyang Jang ◽

Shih-Jie Jian

Keyword(s):

Frequency Divider ◽

Locking Range ◽

Dual Resonance ◽

Wide Locking Range

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The Proximity Capacitive Gesture Recognition for Recursive Chebyshev Neural Network

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2018.8625742 ◽

2018 ◽

Cited By ~ 1

Author(s):

Chao-Ting Chu ◽

Wei-Lung Mao ◽

Chung-Wen Hung

Keyword(s):

Neural Network ◽

Gesture Recognition ◽

Chebyshev Neural Network

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Board Level Reliability of Thinner Stacking Chips Package with Through Silicon Via Interposer

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2018.8625837 ◽

2018 ◽

Author(s):

Wen Shan Tsai ◽

Bruce Hsu ◽

Fred Chang ◽

Yun Long Huang ◽

Joe Lin ◽

...

Keyword(s):

Through Silicon Via ◽

Board Level ◽

Board Level Reliability

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Study of wafer cleaning process safety using Inherently Safer Design Strategies

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2018.8625796 ◽

2018 ◽

Cited By ~ 6

Author(s):

Kuo-Chi Chang ◽

Kai-Chun Chu ◽

Der-Juinn Horng ◽

Jerry Chao-Lee Lin ◽

Vivien Yi-Chun Chen

Keyword(s):

Process Safety ◽

Cleaning Process ◽

Design Strategies ◽

Wafer Cleaning ◽

Inherently Safer Design

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The Best EMC Mold Flow Behavior Simulation by Spiral Flow Benchmarking

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2018.8625754 ◽

2018 ◽

Author(s):

Xi Hong Chen ◽

Chin Tien Yen ◽

Yu Ting Yang ◽

Wei Ling Ma ◽

Yi-Hsiu Tseng ◽

...

Keyword(s):

Flow Behavior ◽

Spiral Flow ◽

Behavior Simulation ◽

Mold Flow

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Stress Analysis for SiC Power Devices Packaging by Raman Spectroscopy

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2018.8625846 ◽

2018 ◽

Author(s):

Tomoyuki Uchida ◽

Ryuichi Sugie

Keyword(s):

Raman Spectroscopy ◽

Stress Analysis ◽

Power Devices

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Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2018.8625849 ◽

2018 ◽

Author(s):

Yu-Ming Pan ◽

Yu-Tao Yang ◽

Tzu-Chieh Chou ◽

Ting-Yang Yu ◽

Kai-Ming Yang ◽

...

Keyword(s):

Low Temperature ◽

Simulation Analysis ◽

Structure Design ◽

Heterogeneous Integration ◽

Advanced Packaging

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Studies of Silver Catalyst System in Print-Circuit Board Application

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2018.8625818 ◽

2018 ◽

Author(s):

Hung Tat CHAN ◽

Yuk Nam HUNG ◽

Kin Cheung LO ◽

Kit Ho TONG ◽

Ping Ling LI ◽

...

Keyword(s):

Print Circuit Board ◽

Catalyst System ◽

Circuit Board ◽

Silver Catalyst

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2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

A Novel Die Attach Material Having High Die Shear Strength and High Heat Resistance for Brighter LED Device

An Wide Locking Range Injection-Locked Frequency Divider by Dual Resonance Tank

The Proximity Capacitive Gesture Recognition for Recursive Chebyshev Neural Network

Board Level Reliability of Thinner Stacking Chips Package with Through Silicon Via Interposer

Study of wafer cleaning process safety using Inherently Safer Design Strategies

The Best EMC Mold Flow Behavior Simulation by Spiral Flow Benchmarking

Stress Analysis for SiC Power Devices Packaging by Raman Spectroscopy

Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems

Studies of Silver Catalyst System in Print-Circuit Board Application

Export Citation Format

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

A Novel Die Attach Material Having High Die Shear Strength and High Heat Resistance for Brighter LED Device

An Wide Locking Range Injection-Locked Frequency Divider by Dual Resonance Tank

The Proximity Capacitive Gesture Recognition for Recursive Chebyshev Neural Network

Board Level Reliability of Thinner Stacking Chips Package with Through Silicon Via Interposer

Study of wafer cleaning process safety using Inherently Safer Design Strategies

The Best EMC Mold Flow Behavior Simulation by Spiral Flow Benchmarking

Stress Analysis for SiC Power Devices Packaging by Raman Spectroscopy

Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems

Studies of Silver Catalyst System in Print-Circuit Board Application

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications