Study of low temperature and high heat-resistant fluxless bonding via nanoscale thin film control toward wafer-level multiple chip stacking for 3D LSI

2012 ◽  
Author(s):  
Eiji Morinaga ◽  
Yuichi Oka ◽  
Hiroaki Nishimori ◽  
Haruhiko Miyagawa ◽  
Ryohei Satoh ◽  
...  
Keyword(s):  
Thin Film ◽  
Low Temperature ◽  
High Heat ◽  
Wafer Level ◽  
Fluxless Bonding ◽  
Heat Resistant ◽  
Nanoscale Thin Film

Growth of ZnO Nanostructures by Wet Oxidation of Zn Thin Film Deposited on Heat-Resistant Flexible Substrates at Low Temperature

2020 ◽  
Vol 54 (10) ◽  
pp. 1220-1223
Author(s):  
O. F. Farhat ◽  
M. Hisham ◽  
M. Bououdina ◽  
Ammar A. Oglat ◽  
Nyan J. Mohammed
Keyword(s):  
Thin Film ◽  
Low Temperature ◽  
Flexible Substrates ◽  
Wet Oxidation ◽  
Zno Nanostructures ◽  
Heat Resistant

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

2013 ◽  
Vol 23 (7) ◽  
pp. 075007 ◽  
Author(s):  
R Straessle ◽  
Y Pétremand ◽  
D Briand ◽  
M Dadras ◽  
N F de Rooij
Keyword(s):  
Thin Film ◽  
Low Temperature ◽  
Wafer Level ◽  
Mems Packaging

Low Temperature Al-Al Thermo-compression Bonding with Sn Oxidation Protect Layer for Wafer-level Hermetic Sealing

2016 ◽  
Vol 136 (6) ◽  
pp. 237-243 ◽  
Author(s):  
Shiro Satoh ◽  
Hideyuki Fukushi ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Hermetic Sealing

CRONIFER II EXTRA, CRONIFER 45, CRONIFER III EXTRA, CRONIFER IV EXTRA

Alloy Digest ◽  
1992 ◽  
Vol 41 (6) ◽  
Keyword(s):  
Physical Properties ◽  
Tensile Properties ◽  
High Heat ◽  
Heat Resistant

Abstract CRONIFER II EXTRA, 45, III EXTRA AND IV EXTRA alloys are high heat resistant alloys, some with resistance to green rot and hardening environments. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. Filing Code: Ni-405. Producer or source: VDM Technologies Corporation.

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