ac coupled interconnect
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AC Coupled Interconnect for Low Power Spaceborne Electronics

10.21236/ada554302 ◽

2012 ◽

Author(s):

Paul D. Franzon ◽

Steve Lipa

Keyword(s):

Low Power ◽

Ac Coupled Interconnect

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Use of AC Coupled Interconnect in Contactless Packaging

Integrated Circuits and Systems - Coupled Data Communication Techniques for High-Performance and Low-Power Computing ◽

10.1007/978-1-4419-6588-2_5 ◽

2010 ◽

pp. 127-153

Author(s):

Paul Franzon

Keyword(s):

Ac Coupled Interconnect

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Fully Integrated AC Coupled Interconnect Using Buried Bumps

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2007.896920 ◽

2007 ◽

Vol 30 (2) ◽

pp. 191-199 ◽

Cited By ~ 6

Author(s):

John Wilson ◽

Stephen Mick ◽

Jian Xu ◽

Lei Luo ◽

Salvatore Bonafede ◽

...

Keyword(s):

Fully Integrated ◽

Ac Coupled Interconnect

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AC Coupled Interconnect for Low Power Spaceborne Electronics

10.21236/ada462801 ◽

2006 ◽

Author(s):

Paul D. Franzon

Keyword(s):

Low Power ◽

Ac Coupled Interconnect

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AC Coupled Interconnect using Buried Bumps for Laminated Organic Packages

56th Electronic Components and Technology Conference 2006 ◽

10.1109/ectc.2006.1645624 ◽

2006 ◽

Cited By ~ 4

Author(s):

J. Wilson ◽

Lei Luo ◽

Jian Xu ◽

S. Mick ◽

E. Erickson ◽

...

Keyword(s):

Organic Packages ◽

Ac Coupled Interconnect

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Considerations for Transmission Line Design on MCMs using AC Coupled Interconnect with Buried Solder Bumps

2006 IEEE Workship on Signal Propagation on Interconnects ◽

10.1109/spi.2006.289245 ◽

2006 ◽

Author(s):

J.M. Wilson ◽

S. E. Mick ◽

J. Xu ◽

L. Luo ◽

E. L. Erickson ◽

...

Keyword(s):

Transmission Line ◽

Solder Bumps ◽

Ac Coupled Interconnect ◽

Line Design

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Fully integrated AC coupled interconnect using buried bumps

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. ◽

10.1109/epep.2005.1563686 ◽

2006 ◽

Cited By ~ 8

Author(s):

J. Wilson ◽

S. Mick ◽

Jian Xu ◽

Lei Luo ◽

S. Bonafede ◽

...

Keyword(s):

Fully Integrated ◽

Ac Coupled Interconnect

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AC coupled interconnect for dense 3-D ICs

2003 IEEE Nuclear Science Symposium. Conference Record (IEEE Cat. No.03CH37515) ◽

10.1109/nssmic.2003.1352013 ◽

2005 ◽

Author(s):

Jian Xu ◽

S. Mick ◽

J. Wilson ◽

Lei Luo ◽

K. Chandrasekar ◽

...

Keyword(s):

Ac Coupled Interconnect

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AC coupled interconnect for dense 3-D ICs

IEEE Transactions on Nuclear Science ◽

10.1109/tns.2004.834712 ◽

2004 ◽

Vol 51 (5) ◽

pp. 2156-2160 ◽

Cited By ~ 19

Author(s):

Jian Xu ◽

S. Mick ◽

J. Wilson ◽

L. Luo ◽

K. Chandrasekar ◽

...

Keyword(s):

Ac Coupled Interconnect

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AC-coupled interconnect for high-density high-bandwidth packaging

10.1117/12.528076 ◽

2004 ◽

Author(s):

Paul D. Franzon ◽

Stephen Mick ◽

John M. Wilson ◽

Lei Luo ◽

Karthik Chandrasakhar

Keyword(s):

High Density ◽

High Bandwidth ◽

Ac Coupled Interconnect

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ac coupled interconnectRecently Published Documents

TOTAL DOCUMENTS

H-INDEX

AC Coupled Interconnect for Low Power Spaceborne Electronics

Use of AC Coupled Interconnect in Contactless Packaging

Fully Integrated AC Coupled Interconnect Using Buried Bumps

AC Coupled Interconnect for Low Power Spaceborne Electronics

AC Coupled Interconnect using Buried Bumps for Laminated Organic Packages

Considerations for Transmission Line Design on MCMs using AC Coupled Interconnect with Buried Solder Bumps

Fully integrated AC coupled interconnect using buried bumps

AC coupled interconnect for dense 3-D ICs

AC coupled interconnect for dense 3-D ICs

AC-coupled interconnect for high-density high-bandwidth packaging

ac coupled interconnect
Recently Published Documents