IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.
Latest Publications

TOTAL DOCUMENTS

107

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Published By IEEE

0780392205

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A finite-volume method for on-package IR drop characterization

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. ◽

10.1109/epep.2005.1563733 ◽

2006 ◽

Author(s):

Xin Wu ◽

C. Desai

Keyword(s):

Finite Volume Method ◽

Finite Volume ◽

Ir Drop ◽

Volume Method

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Multi-level parametric model order reduction for interconnect networks

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. ◽

10.1109/epep.2005.1563746 ◽

2006 ◽

Author(s):

Min Ma ◽

Alfred Tze-Mun Leung ◽

R. Khazaka

Keyword(s):

Model Order Reduction ◽

Order Reduction ◽

Parametric Model ◽

Model Order ◽

Parametric Model Order Reduction ◽

Interconnect Networks ◽

Multi Level

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Multi-Gb/s I/O link model to hardware correlation

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. ◽

10.1109/epep.2005.1563725 ◽

2006 ◽

Cited By ~ 2

Author(s):

T.J. Timpane ◽

B.A. Fox ◽

M.O. Maxson ◽

G.K. Bartley

Keyword(s):

Link Model

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Differential current-mode signaling for robust and power efficient on-chip global interconnects

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. ◽

10.1109/epep.2005.1563768 ◽

2006 ◽

Cited By ~ 2

Author(s):

Liang Zhang ◽

J. Wilson ◽

R. Bashirullah ◽

P. Franzon

Keyword(s):

Current Mode ◽

Power Efficient ◽

Global Interconnects ◽

On Chip ◽

Differential Current

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Turbo-SPICE with latency insertion method (LIM)

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. ◽

10.1109/epep.2005.1563772 ◽

2006 ◽

Author(s):

Zhichao Deng ◽

J.E. Schutt-Aine

Keyword(s):

Insertion Method ◽

Latency Insertion

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Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. ◽

10.1109/epep.2005.1563690 ◽

2006 ◽

Cited By ~ 4

Author(s):

T. Winkel ◽

A. Deutsch ◽

G.A. Katopis ◽

G.V. Kopcsay ◽

E. Klink ◽

...

Keyword(s):

Frequency Domain ◽

Transmission Lines ◽

Measurement Results

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Electrical / optical high speed scalability link implementation

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. ◽

10.1109/epep.2005.1563688 ◽

2006 ◽

Cited By ~ 2

Author(s):

D. Kuchta ◽

C. Baks ◽

Y. Kwark ◽

E. Mintarno ◽

D.N. de Araujo ◽

...

Keyword(s):

High Speed

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A new method to achieve improved accuracy with IBIS models

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. ◽

10.1109/epep.2005.1563716 ◽

2006 ◽

Cited By ~ 2

Author(s):

A. Varma ◽

M. Steer ◽

P. Franzon

Keyword(s):

New Method ◽

Improved Accuracy

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Crosstalk analysis by fast computational algorithms

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. ◽

10.1109/epep.2005.1563782 ◽

2006 ◽

Cited By ~ 8

Author(s):

Z.G. Qian ◽

J. Xiong ◽

L. Sun ◽

I.T. Chiang ◽

W.C. Chew ◽

...

Keyword(s):

Computational Algorithms

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On chip circuit model for accurate mid-frequency simultaneous switching noise prediction

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. ◽

10.1109/epep.2005.1563757 ◽

2006 ◽

Cited By ~ 1

Author(s):

Tingdong Zhou ◽

T. Strach ◽

W.D. Becker

Keyword(s):

Circuit Model ◽

Noise Prediction ◽

Switching Noise ◽

Simultaneous Switching Noise ◽

On Chip ◽

Simultaneous Switching

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IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A finite-volume method for on-package IR drop characterization

Multi-level parametric model order reduction for interconnect networks

Multi-Gb/s I/O link model to hardware correlation

Differential current-mode signaling for robust and power efficient on-chip global interconnects

Turbo-SPICE with latency insertion method (LIM)

Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz

Electrical / optical high speed scalability link implementation

A new method to achieve improved accuracy with IBIS models

Crosstalk analysis by fast computational algorithms

On chip circuit model for accurate mid-frequency simultaneous switching noise prediction

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.
Latest Publications