AC-coupled interconnect for high-density high-bandwidth packaging

2004 ◽  
Author(s):  
Paul D. Franzon ◽  
Stephen Mick ◽  
John M. Wilson ◽  
Lei Luo ◽  
Karthik Chandrasakhar
Keyword(s):  
High Density ◽  
High Bandwidth ◽  
Ac Coupled Interconnect

AC Coupled Interconnect for High-Density High-Bandwidth Packaging

2003 ◽  
Author(s):  
Paul Franzon ◽  
Stephen Mick ◽  
John Wilson ◽  
Lei Luo ◽  
Karthik Chandrasakhar
Keyword(s):  
High Density ◽  
High Bandwidth ◽  
Ac Coupled Interconnect

Advanced Packaging Solution for High Density FCCSP Molding Warpage

2019 ◽  
Author(s):  
Shuai-Lin Liu ◽  
Ward Ye ◽  
Yu-Po Wang ◽  
Long-Yuan Wang ◽  
Fred Lin
Keyword(s):  
High Performance ◽  
Consumer Products ◽  
High Density ◽  
Influential Factor ◽  
Molding Process ◽  
Vacuum Suction ◽  
Packaging Technology ◽  
Advanced Packaging ◽  
High Bandwidth ◽  
Warpage Deformation

Abstract In recent years, the IC industry continues to drive demand in the consumer market, and more global sales of smart-phones, smart-watches and tablets have continued to grow. In order to continuously enhance high performance computing, the consumer products pursued began to integrate HBM (High Bandwidth Memory) and AI (Artificial Intelligence) to strong and powerful mainstream market. With the shrinking use space pursued by consumer products, it is necessary to continuously develop lighter and thinner products, and under such product conditions, it seems that the risks and difficulties of advanced packaging technology will be expected. Due to the ministration application, the warpage issue is the most influential factor in the following development of packaging technology. In this paper, we would like to overcome the poor strip warpage, not only to choose the EMC material form CTE property, but to think about improving the warpage from the machine process. The residual stress generated by the molding process of thermosetting resins exerts serious influences upon the mechanical properties, so we use Laser area beam processing to reheat the EMC and use the vacuum suction to reshape the warpage deformation. In this case, we verify the laser radiation time and peak temperature control of different strip types (including molded, thermal taped and ball attached molded strip) and EMC wafer form. We succeed to improve the maximum strip warpage from 17 um to 1um; wafer form from 13um to 3.5um. This laser beam reshape technology is proven to solve the warpage significantly for high density assembly.

Polytrodes: High-Density Silicon Electrode Arrays for Large-Scale Multiunit Recording

2005 ◽  
Vol 93 (5) ◽  
pp. 2987-3000 ◽  
Author(s):  
Timothy J. Blanche ◽  
Martin A. Spacek ◽  
Jamille F. Hetke ◽  
Nicholas V. Swindale
Keyword(s):  
Large Scale ◽  
High Density ◽  
Clustering Methods ◽  
Electrode Arrays ◽  
Large Numbers ◽  
High Bandwidth ◽  
Electrode Positioning ◽  
Multiunit Recording ◽  
Silicon Based

We developed a variety of 54-channel high-density silicon electrode arrays (polytrodes) designed to record from large numbers of neurons spanning millimeters of brain. In cat visual cortex, it was possible to make simultaneous recordings from >100 well-isolated neurons. Using standard clustering methods, polytrodes provide a quality of single-unit isolation that surpasses that attainable with tetrodes. Guidelines for successful in vivo recording and precise electrode positioning are described. We also describe a high-bandwidth continuous data-acquisition system designed specifically for polytrodes and an automated impedance meter for testing polytrode site integrity. Despite having smaller interconnect pitches than earlier silicon-based electrodes of this type, these polytrodes have negligible channel crosstalk, comparable reliability, and low site impedances and are capable of making high-fidelity multiunit recordings with minimal tissue damage. The relatively benign nature of planar electrode arrays is evident both histologically and in experiments where the polytrode was repeatedly advanced and retracted hundreds of microns over periods of many hours. It was possible to maintain stable recordings from active neurons adjacent to the polytrode without change in their absolute positions, neurophysiological or receptive field properties.

Analysis on Signal and Power Integrity of 2.3D Structure Organic Package

2019 ◽  
Vol 2019 (1) ◽  
pp. 000381-000386 ◽  
Author(s):  
Kosuke Tsukamoto ◽  
Atsunori Kajiki ◽  
Yuji Kunimoto ◽  
Masayuki Mizuno ◽  
Manabu Nakamura ◽  
...  
Keyword(s):  
Power Distribution ◽  
Signal Integrity ◽  
High Density ◽  
Point Of View ◽  
Power Delivery ◽  
Power Integrity ◽  
Power Distribution Network ◽  
Organic Packages ◽  
High Bandwidth ◽  
Vertical Interconnection

Abstract Heterogeneous packaging is one of the advanced technologies. Especially for high-end applications such as data center server, HPC and Artificial-Intelligence (AI), High-Bandwidth Memory (HBM) integration is a key and strongly required. As we know, the 2.5D silicon interposer packaging is an expanded solution for HBM interconnections. However, we developed 2.1D high density organic package called i-THOP® (integrated-Thin film High density Organic Package) to take advantages of an organic solution. Furthermore, we are now focusing on 2.3D i-THOP® to have more benefits in the manufacturing. The 2.3D structure consists of two substrates. One is a thin i-THOP® interposer, the other one is a conventional build-up (BU) substrate. These two substrates are combined as the interposer placed onto the build-up substrate. In this paper, the electrical properties of 2.3D i-THOP® are studied to confirm the possibility of the 2.3D structure organic packages from the perspective of signal and power integrity. Firstly, the signal integrity between two devices is simulated, comparing the differences between i-THOP® and the 2.5D silicon interposer. Secondly, the signal integrity in die-to-substrate vertical interconnection is simulated, comparing between 2.1D, 2.3D i-THOP® and the 2.5D silicon interposer. Finally, as for the power delivery point of view, power distribution network (PDN) impedance is compared between 2.1D and 2.3D i-THOP®.

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