copper cmp
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Understanding the Reasons Behind Defect Levels in Post-Copper-CMP Cleaning Processes with Different Chemistries and PVA Brushes

2021 ◽  
Author(s):  
Yasa Sampurno ◽  
Ara Philipossian ◽  
Abigail N Linhart ◽  
Katherine M Wortman-Otto ◽  
Wei-Tsu Tseng ◽  
...  
Keyword(s):  
Defect Levels ◽  
Copper Cmp

Effect of FA/O II Surfactant as a Complex Non-Ionic Surfactant on Copper CMP

2021 ◽  
Author(s):  
Yinchan Zhang ◽  
Xinhuan Niu ◽  
Jiakai Zhou ◽  
Chenghui Yang ◽  
Ziyang Hou ◽  
...  
Keyword(s):  
Ionic Surfactant ◽  
Copper Cmp

Study on chemical effects of H2O2 and glycine in the Copper CMP process using ReaxFF MD

2020 ◽  
Vol 508 ◽  
pp. 145262 ◽  
Author(s):  
Xiaoguang Guo ◽  
Song Yuan ◽  
Yongjun Gou ◽  
Xiaoli Wang ◽  
Jiang Guo ◽  
...  
Keyword(s):  
Chemical Effects ◽  
Copper Cmp

Effect of Slurry Characteristics on the Surface Tribology During Copper CMP Process

2019 ◽  
Vol 3 (41) ◽  
pp. 45-56 ◽  
Author(s):  
Subrahmanya R. Mudhivarthi ◽  
Veera Raghava Kakireddy ◽  
Ashok Kumar ◽  
Y. Obeng
Keyword(s):  
Copper Cmp

An Experimental Characterization of Dissolution and Complexation Kinetics in Copper CMP

2019 ◽  
Vol 2 (6) ◽  
pp. 427-438 ◽  
Author(s):  
Ravichandra Palaparthi ◽  
Gregory Muldowney
Keyword(s):  
Experimental Characterization ◽  
Copper Cmp ◽  
Complexation Kinetics

Study of Inhibition Characteristics of Slurry Additives in Copper CMP Using Force Spectroscopy

2019 ◽  
Vol 2 (2) ◽  
pp. 515-522 ◽  
Author(s):  
Manish K. Keswani ◽  
Hyosang Lee ◽  
Suryadevara Babu ◽  
Udaya Patri ◽  
Youngki Hong ◽  
...  
Keyword(s):  
Force Spectroscopy ◽  
Copper Cmp

Effect of Copper CMP Slurry Chemistry on the Rate of Agglomeration of Alumina Particles

2019 ◽  
Vol 19 (7) ◽  
pp. 25-30 ◽  
Author(s):  
Neil Brahma ◽  
Mike Chan ◽  
Jan Talbot
Keyword(s):  
Alumina Particles ◽  
Copper Cmp ◽  
Effect Of Copper

Ultra-High Removal Rate Copper CMP Slurry Development for 3D Application

2019 ◽  
Vol 18 (1) ◽  
pp. 479-484 ◽  
Author(s):  
Bin Hu ◽  
H. Kim ◽  
R. Wen ◽  
Deepak Mahulikar
Keyword(s):  
Removal Rate ◽  
Copper Cmp ◽  
High Removal Rate

Slurry Development Challenges and Solutions for Advanced Node Copper CMP

2019 ◽  
Vol 18 (1) ◽  
pp. 541-546 ◽  
Author(s):  
Deepak Mahulikar
Keyword(s):  
Copper Cmp
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