Effect of Copper CMP Slurry Chemistry on the Rate of Agglomeration of Alumina Particles

2019 ◽  
Vol 19 (7) ◽  
pp. 25-30 ◽  
Author(s):  
Neil Brahma ◽  
Mike Chan ◽  
Jan Talbot
Keyword(s):  
Alumina Particles ◽  
Copper Cmp ◽  
Effect Of Copper

Amorphous silica coating on α-alumina particles

1995 ◽  
Vol 53 ◽  
pp. 210-211
Author(s):  
J. W. Mellowes ◽  
C. M. Chun ◽  
I. A. Aksay
Keyword(s):  
Amorphous Silica ◽  
Heterogeneous Nucleation ◽  
Homogeneous Nucleation ◽  
Silica Coating ◽  
Full Density ◽  
Optimal Conditions ◽  
Fine Grained ◽  
Alumina Particles ◽  
Complete Mullitization ◽  
Powder Compacts

Mullite (3Al2O32SiO2) can be fabricated by transient viscous sintering using composite particles which consist of inner cores of a-alumina and outer coatings of amorphous silica. Powder compacts prepared with these particles are sintered to almost full density at relatively low temperatures (~1300°C) and converted to dense, fine-grained mullite at higher temperatures (>1500°C) by reaction between the alumina core and the silica coating. In order to achieve complete mullitization, optimal conditions for coating alumina particles with amorphous silica must be achieved. Formation of amorphous silica can occur in solution (homogeneous nucleation) or on the surface of alumina (heterogeneous nucleation) depending on the degree of supersaturation of the solvent in which the particles are immersed. Successful coating of silica on alumina occurs when heterogeneous nucleation is promoted and homogeneous nucleation is suppressed. Therefore, one key to successful coating is an understanding of the factors such as pH and concentration that control silica nucleation in aqueous solutions. In the current work, we use TEM to determine the optimal conditions of this processing.

The Effect of Copper Ions on Clot Lysis Time in the Fibrinolytic Assay of Streptokinase

1965 ◽  
Vol 13 (02) ◽  
pp. 477-483
Author(s):  
Alwin B. Bogert
Keyword(s):  
Copper Ions ◽  
Borate Buffer ◽  
Fibrinolytic System ◽  
Clot Lysis ◽  
Distilled Water ◽  
Naturally Occurring ◽  
Lysis Time ◽  
Low Levels ◽  
Effect Of Copper ◽  
Clot Lysis Time

SummaryExperiments were conducted to determine why different lots of Borate Buffer reagent affect the clot lysis times obtained in the fibrinolytic assay of Streptokinase. Minerals naturally occurring in distilled water were screened individually to determine their influence on lysis. Copper was found to have a very pronounced effect in this regard on the fibrinolytic system in that low levels reduce the lysis time and high levels increase it.

Effect of Copper Slag as a Fine Aggregate on the Durability Characteristics of High-Performance Concrete (HPC) Containing Silica Fume

2020 ◽  
Vol 07 (02) ◽  
pp. 1-10
Author(s):  
Rizwan Ahmad Khan ◽  
Keyword(s):  
Silica Fume ◽  
High Performance ◽  
High Performance Concrete ◽  
Copper Slag ◽  
Chloride Penetration ◽  
Interfacial Transition Zone ◽  
Fine Aggregate ◽  
Fresh Properties ◽  
Fine Aggregates ◽  
Effect Of Copper

This paper investigates the fresh and durability properties of the high-performance concrete by replacing cement with 15% Silica fume and simultaneously replacing fine aggregates with 25%, 50%, 75% and 100% copper slag at w/b ratio of 0.23. Five mixes were analysed and compared with the standard concrete mix. Fresh properties show an increase in the slump with the increase in the quantity of copper slag to the mix. Sorptivity, chloride penetration, UPV and carbonation results were very encouraging at 50% copper slag replacement levels. Microstructure analysis of these mixes shows the emergence of C-S-H gel for nearly all mixes indicating densification of the interfacial transition zone of the concrete.

Root Cause Analyses of Metal Bridging for Copper Damascene Process

2005 ◽  
Author(s):  
Z. G. Song ◽  
S. P. Neo ◽  
S. K. Loh ◽  
C. K. Oh
Keyword(s):  
Failure Mechanisms ◽  
Copper Corrosion ◽  
Microelectronic Device ◽  
Root Cause ◽  
Damascene Process ◽  
New Process ◽  
Copper Cmp

Abstract New process will introduce new failure mechanisms during microelectronic device manufacturing. Even if the same defect, its root causes can be different for different processes. For aluminum(Al)-tungsten(W) metallization, the root cause of metal bridging is quite simple and mostly it is blocked etch or under-etch. But, for copper damascene process, the root causes of metal bridging are complicated. This paper has discussed the various root causes of metal bridging for copper damascene process, such as those related to litho-etch issue, copper CMP issue, copper corrosion issue and so on.

Effect of Copper and Lead as Water Pollutants on Ectoparasitic Infested Oreochromis niloticus

2016 ◽  
Vol 44 (2) ◽  
pp. 156-166 ◽  
Author(s):  
Zeinab El-Bouhy ◽  
Rasha Reda ◽  
Asmaa El-Azony
Keyword(s):  
Oreochromis Niloticus ◽  
Water Pollutants ◽  
Effect Of Copper
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