gigascale integration Latest Research Papers

Special Issue on Compact Interconnect Models for Gigascale Integration

IEEE Transactions on Electron Devices ◽

10.1109/ted.2009.2026838 ◽

2009 ◽

Vol 56 (9) ◽

pp. 1784-1786 ◽

Cited By ~ 1

Author(s):

SAMAR SAHA ◽

JAMAL DEEN ◽

HIROO MASUDA

Keyword(s):

Special Issue ◽

Gigascale Integration

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Compact physical models for chip and package power and ground distribution networks for gigascale integration (GSI)

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550040 ◽

2008 ◽

Cited By ~ 3

Author(s):

Gang Huang ◽

Azad Naeemi ◽

Tingdong Zhou ◽

Dan O'Connor ◽

Andrew Muszynski ◽

...

Keyword(s):

Distribution Networks ◽

Physical Models ◽

Gigascale Integration

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Analysis and optimization of shielded RLC global interconnects for gigascale integration

International Journal of Electronics ◽

10.1080/00207210601113992 ◽

2007 ◽

Vol 94 (3) ◽

pp. 263-276 ◽

Cited By ~ 1

Author(s):

L.-L. Jiang ◽

J.-F. Mao ◽

M. Tang

Keyword(s):

Gigascale Integration ◽

Global Interconnects

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Compact Physical Models for Power Supply Noise and Chip/Package Co-Design of Gigascale Integration

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.374017 ◽

2007 ◽

Cited By ~ 13

Author(s):

Gang Huang ◽

Deepak C. Sekar ◽

Azad Naeemi ◽

Kaveh Shakeri ◽

James D. Meindl

Keyword(s):

Power Supply ◽

Physical Models ◽

Power Supply Noise ◽

Gigascale Integration ◽

Supply Noise

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Opportunities for Gigascale Integration (GSI) Beyond 2003

10.1109/asmc.1993.682465 ◽

2005 ◽

Author(s):

J.D. Meindl

Keyword(s):

Gigascale Integration

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Wave-pipelined multiplexed (WPM) routing for gigascale integration (GSI)

IEEE Transactions on Very Large Scale Integration (VLSI) Systems ◽

10.1109/tvlsi.2005.853611 ◽

2005 ◽

Vol 13 (8) ◽

pp. 899-910 ◽

Cited By ~ 10

Author(s):

A.J. Joshi ◽

J.A. Davis

Keyword(s):

Gigascale Integration

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Compact Physical IR-Drop Models for Chip/Package Co-Design of Gigascale Integration (GSI)

IEEE Transactions on Electron Devices ◽

10.1109/ted.2005.848125 ◽

2005 ◽

Vol 52 (6) ◽

pp. 1087-1096 ◽

Cited By ~ 51

Author(s):

K. Shakeri ◽

J.D. Meindl

Keyword(s):

Gigascale Integration ◽

Ir Drop

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Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI)

IEEE Electron Device Letters ◽

10.1109/led.2004.841440 ◽

2005 ◽

Vol 26 (2) ◽

pp. 84-86 ◽

Cited By ~ 232

Author(s):

A. Naeemi ◽

R. Sarvari ◽

J.D. Meindl

Keyword(s):

Carbon Nanotube ◽

Performance Comparison ◽

Copper Interconnects ◽

Gigascale Integration

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The urgency of deep sub-ambient cooling for gigascale integration

2005 International Conference on Integrated Circuit Design and Technology, 2005. ICICDT 2005. ◽

10.1109/icicdt.2005.1502623 ◽

2005 ◽

Cited By ~ 3

Author(s):

A. Naeemi ◽

Y. Joshi ◽

A. Fedorov ◽

P. Kohl ◽

J.D. Meindl

Keyword(s):

Gigascale Integration

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VLSI design challenges for gigascale integration

18th International Conference on VLSI Design held jointly with 4th International Conference on Embedded Systems Design ◽

10.1109/icvd.2005.171 ◽

2005 ◽

Cited By ~ 5

Author(s):

S. Borkar

Keyword(s):

Vlsi Design ◽

Gigascale Integration ◽

Design Challenges

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Special Issue on Compact Interconnect Models for Gigascale Integration

Compact physical models for chip and package power and ground distribution networks for gigascale integration (GSI)

Analysis and optimization of shielded RLC global interconnects for gigascale integration

Compact Physical Models for Power Supply Noise and Chip/Package Co-Design of Gigascale Integration

Opportunities for Gigascale Integration (GSI) Beyond 2003

Wave-pipelined multiplexed (WPM) routing for gigascale integration (GSI)

Compact Physical IR-Drop Models for Chip/Package Co-Design of Gigascale Integration (GSI)

Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI)

The urgency of deep sub-ambient cooling for gigascale integration

VLSI design challenges for gigascale integration

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gigascale integrationRecently Published Documents

TOTAL DOCUMENTS

H-INDEX

Special Issue on Compact Interconnect Models for Gigascale Integration

Compact physical models for chip and package power and ground distribution networks for gigascale integration (GSI)

Analysis and optimization of shielded RLC global interconnects for gigascale integration

Compact Physical Models for Power Supply Noise and Chip/Package Co-Design of Gigascale Integration

Opportunities for Gigascale Integration (GSI) Beyond 2003

Wave-pipelined multiplexed (WPM) routing for gigascale integration (GSI)

Compact Physical IR-Drop Models for Chip/Package Co-Design of Gigascale Integration (GSI)

Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI)

The urgency of deep sub-ambient cooling for gigascale integration

VLSI design challenges for gigascale integration

gigascale integration
Recently Published Documents