scholarly journals Low Dielectric Constant Polyimide Obtained by Four Kinds of Irradiation Sources

Polymers ◽  
2020 ◽  
Vol 12 (4) ◽  
pp. 879 ◽  
Author(s):  
Hongxia Li ◽  
Jianqun Yang ◽  
Shangli Dong ◽  
Feng Tian ◽  
Xingji Li
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Electrical Properties ◽  
Photoelectron Spectroscopy ◽  
Polymer Materials ◽  
Testing System ◽  
Paramagnetic Resonance ◽  
Low Dielectric ◽  
Modification Technique ◽  
The Fourier Transform

Irradiation is a good modification technique, which can be used to modify the electrical properties, mechanical properties, and thermal properties of polymer materials. The effects of irradiation on the electrical properties, mechanical properties, and structure of polyimide (PI) films were studied. PI films were irradiated by a 1 MeV electron, 3 MeV proton, 10 MeV proton, and 25 MeV carbon ion. Dielectric constant, dielectric loss, and resistance measurements were carried out to evaluate the changes in the electrical properties; moreover, the mechanical properties of the pristine and irradiated PI were analyzed by the tensile testing system. The irradiation induced chemical bonds and free radicals changes of the PI films were confirmed by the Fourier transform infrared (FTIR) spectra, X-ray photoelectron spectroscopy (XPS), and electron paramagnetic resonance (EPR). The dielectric constant of the PI films decreases with the increase of fluences by the four kinds of irradiation sources.

A New Low Dielectric Constant Polymer Material (k < 2): Microstructure, Electrical Properties, and Mechanical Properties

1999 ◽  
Vol 565 ◽  
Author(s):  
Yi-Pin Tsai ◽  
C. N. Liao ◽  
Yuhuan Xu ◽  
K. N. Tu ◽  
Bin Zhao ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Electrical Properties ◽  
Pore Size ◽  
Leakage Current ◽  
Polymer Material ◽  
Porous Polymer ◽  
Low Dielectric Constant ◽  
Two Phase ◽  
Low Dielectric

AbstractA porous polymer material, which is made of a two-phase composite and contains 35% porosity with a pore size less than 50Å, is found to have a dielectric constant of 1.8. It absorbs almost no water. The electrical properties, such as capacitance and leakage current, do not change with time and temperature.

Characterization of Polysiloxane Modified Polysilsesquioxane Films for Low Dielectric Applications: Microstructure, Electrical Properties and Mechanical Properties

2002 ◽  
Vol 716 ◽  
Author(s):  
Jingyu Hyeon-Lee ◽  
Yi Yeol Lyu ◽  
Sang Kook Mah ◽  
Jin-Hyeong Yim ◽  
Hyun-Dam Jeong ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Electrical Properties ◽  
Film Thickness ◽  
Nanoporous Structure ◽  
Low Dielectric ◽  
Sem Micrograph

AbstractPoly(ε-caprolactone) (PCL) / poly(siloxane-silsesquioxane) (PSQ-PSSQ) nanohybrid films were fabricated. The dielectric constant of the film was scaled down from 2.66 to 2.28 when the 30% PCL was added into poly(siloxane-silsesquioxane) matrix. The FE-SEM micrograph of poly(ε-caprolactone) / poly(siloxane-silsesquioxane) (PSQ-PSSQ) nanohybrid film shows nanoporous structure. The modulus and hardness of the film decrease with increasing film thickness. As PCL content increases, modulus and hardness of the films decreases.

The characterization and preparation of porous low dielectric films using various cyclodextrins as template materials

2003 ◽  
Vol 766 ◽  
Author(s):  
Jin-Heong Yim ◽  
Jung-Bae Kim ◽  
Hyun-Dam Jeong ◽  
Yi-Yeoul Lyu ◽  
Sang Kook Mah ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Dielectric Constant ◽  
Pore Structure ◽  
Pore Diameter ◽  
Dielectric Films ◽  
Low Dielectric Constant ◽  
Cyclodextrin Derivatives ◽  
Low Dielectric ◽  
Low K

AbstractPorous low dielectric films containing nano pores (∼20Å) with low dielectric constant (<2.2), have been prepared by using various kinds of cyclodextrin derivatives as porogenic materials. The pore structure such as pore size and interconnectivity can be controlled by changing functional groups of the cyclodextrin derivatives. We found that mechanical properties of porous low-k thin film prepared with mCSSQ (modified cyclic silsesquioxane) precursor and cyclodextrin derivatives were correlated with the pore interconnection length. The longer the interconnection length of nanopores in the thin film, the worse the mechanical properties of the thin film (such as hardness and modulus) even though the pore diameter of the films were microporous (∼2nm).

Electrical properties of low-dielectric-constant films prepared by PECVD in O2/CH4/HMDSO

2002 ◽  
Vol 5 (2-3) ◽  
pp. 279-284 ◽  
Author(s):  
G Borvon ◽  
A Goullet ◽  
X Mellhaoui ◽  
N Charrouf ◽  
A Granier
Keyword(s):  
Dielectric Constant ◽  
Electrical Properties ◽  
Low Dielectric Constant ◽  
Low Dielectric

Robust spin-on-glass poly(methyl)silsesquioxane-based low-k materials derived from a cyclic siloxane precursor

RSC Advances ◽  
2015 ◽  
Vol 5 (82) ◽  
pp. 66511-66517 ◽  
Author(s):  
Albert S. Lee ◽  
Sung Yeoun Oh ◽  
Seung-Sock Choi ◽  
He Seung Lee ◽  
Seung Sang Hwang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Cyclic Siloxane ◽  
Low Dielectric ◽  
Methyl Silsesquioxane ◽  
Low K

Low dielectric constant poly(methyl)silsesquioxane spin-on-glass resins incorporating a cyclic precursor exhibited exceptional mechanical properties to withstand CMP processes.

Characterization of Nanoporous Low Dielectric Polysilsesquioxane Thin Films

2005 ◽  
Vol 277-279 ◽  
pp. 907-911
Author(s):  
Jingyu Hyeon Lee ◽  
Yi Yeol Lyu ◽  
Mong Sup Lee ◽  
Jin Heong Yim ◽  
Sang Youl Kim
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Dielectric Constant ◽  
Refractive Index ◽  
Elastic Modulus ◽  
Polymer Matrix ◽  
Low Dielectric

Poly(methyl-co-cyclosiloxane bearing silsesquioxane)s (P(M-co-CSSQs)) were prepared. Using poly(e-caprolactone) (PCL) as a template, PCL / P(M-co-CSSQ) nanohybrid films were fabricated. The electrical, morphological, and mechanical properties of the PCL / P(M-co-CSSQ) films were investigated. The dielectric constant of a cured PCL / P(M-co-CSSQ) film at 420°C scaled down from 2.55 to 2.05 and refractive index from 1.41 to 1.33 when 20 vol. % of the PCL was admixed with the polymer matrix. The elastic modulus and hardness of the cured PCL / P(Mco- CSSQ) (2:8, vol./vol.) film were 2.50 and 0.32 GPa, respectively, showing dependency on the PCL content.

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