scholarly journals Preparation and Characterization of Narrow Size Distribution PMSQ Microspheres for High-Frequency Electronic Packaging

Materials ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4233
Author(s):  
Guodong Meng ◽  
Yimeng Li ◽  
Zhengdong Wang ◽  
Cheng Pan ◽  
Wenwu Gao ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Size Distribution ◽  
Electronic Packaging ◽  
High Frequency ◽  
Electronic Circuit ◽  
Dielectric Constants ◽  
Circuit Board ◽  
Narrow Particle Size Distribution ◽  
Excellent Thermal Stability

Polymethylsilsesquioxane (PMSQ) has become a kind of widely studied filler used in the electronic circuit board substrates due to its organic–inorganic hybrid structure, low dielectric constant, and good thermal stability, among other factors. Herein, the PMSQ microspheres were prepared by a two-step acid–base-catalyzed sol–gel method; the influences of reaction conditions including the ratio of water/methyltrimethoxysilane (MTMS), reaction temperature, concentration of the catalyst, and stirring time were systematically investigated; and the optimized reaction condition was then obtained towards a narrow particle size distribution and good sphericity. The microstructure of PMSQ microspheres was analyzed by the infrared spectrum and X-ray diffraction (XRD), which indicated that the as-prepared PMSQ had a ladder-dominant structure. The thermogravimetric analysis (TGA) demonstrated an excellent thermal stability of as-prepared PMSQ microspheres. More specifically, the dielectric constants at high frequency (1~20 GHz) of as-prepared PMSQ microspheres were measured to be about 3.7, which turned out a lower dielectric constant compared to SiO2 powder (≈4.0). This study paves the way to further improve the performance of the electronic circuit board substrates for the application of high-frequency electronic packaging.

Material Properties and Process Compatibility of Spin-on Nano-foamed Polybenzoxazole for Copper Damascene Process

2002 ◽  
Vol 740 ◽  
Author(s):  
Takashi Enoki ◽  
Kenzo Maejima ◽  
Hidenori Saito ◽  
Akifumi Katsumura
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Chemical Stability ◽  
Material Properties ◽  
Smooth Surface ◽  
Excellent Thermal Stability ◽  
Damascene Process ◽  
Process Compatibility ◽  
Foaming Technology

ABSTRACTWe have developed nano-foamed OxD which has good properties such as dielectric constant=2.2, homogeneous distributed nano pores, smooth surface based on polybenzoxazole chemistry and nano-foaming technology. The nano-foamed OxD also has excellent thermal stability, chemical stability and etching property. The developed nano-foamed OxD is one of good candidates for copper damascene structure to achieve shrinking dimensions of future semi-conductor devices.

Diamondlike Carbon Materials as Low-k Dielectrics for Multilevel Interconnects in Ulsi

1996 ◽  
Vol 443 ◽  
Author(s):  
A. Grill ◽  
V. Patel ◽  
K.L. Saenger ◽  
C. Jahnes ◽  
S.A. Cohen ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Dielectric Constants ◽  
Internal Stresses ◽  
Diamondlike Carbon ◽  
Potential Applications ◽  
Etch Stop ◽  
Si Content ◽  
Low K ◽  
Thermal Stability Of

AbstractA variety of diamondlike carbon (DLC) materials were investigated for their potential applications as low-k dielectrics for the back end of the line (BEOL) interconnect structures in ULSI circuits. Hydrogenated DLC and fluorine containing DLC (FDLC) were studied as a low-k interlevel and intralevel dielectrics (ILD), while silicon containing DLC (SiDLC) was studied as a potential low-k etch stop material between adjacent DLC based ILD layers, which can be patterned by oxygen-based plasma etchingIt was found that the dielectric constant (k) of the DLC films can be varied between >3.3 and 2.7 by changing the deposition conditions. The thermal stability of these DLC films was found to be correlated to the values of the dielectric constant, decreasing with decreasing k. While DLC films having dielectric constants k>3.3 appeared to be stable to anneals of 4 hours at 400 °C in He, a film having a dielectric constant of 2.7 was not, losing more than half of its thickness upon exposure to the same anneal. The stresses in the DLC films were found to decrease with decreasing dielectric constant, from 700 MPa to about 250 MPa. FDLC films characterized by a dielectric constant of about 2.8 were found to have similar thermal stability as DLC films with k >3.3. The thermally stable FDLC films have internal stresses <300 MPa and are thus promising candidates as a low-k ILD.For the range of Si contents examined (0-9% C replacement by Si), SiDLC films with a Si content of around 5% appear to provide an effective etch-stop for oxygen RIE of DLC or FDLC films, while retaining desirable electrical characteristics. These films showed a steady state DLC/SiDLC etch rate ratio of about 17, and a dielectric constant only about 30% higher than the 3.3 of DLC.

Epoxy/benzoxazinyl POSS nanocomposite resin with low dielectric constant and excellent thermal stability

2020 ◽  
Vol 138 (8) ◽  
pp. 49887
Author(s):  
Xiaodan Li ◽  
Jiacheng Feng ◽  
Shuai Zhang ◽  
Ying Tang ◽  
Xinyu Hu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Excellent Thermal Stability ◽  
Low Dielectric

Dielectric Properties of PMN/CB/CIIR Composites

2009 ◽  
Vol 66 ◽  
pp. 234-237 ◽  
Author(s):  
Hao Yan ◽  
Zhi Xiong Huang ◽  
Yan Bing Wang
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
Carbon Black ◽  
Lead Titanate ◽  
High Frequency ◽  
Dielectric Constants ◽  
Frequency Range ◽  
Magnesium Niobate ◽  
Chlorobutyl Rubber

The Magnesium Niobate-Lead Titanate (PMN) / conductive carbon black (CB)/ chlorobutyl rubber(CIIR) composites were prepared by blending-vulcanization method, and the dielectric properties were studied. The results showed that the dielectric constant and dielectric loss of composites increased nonlinearly when increasing the content of PMN or CB. From the curve of dielectric constant vs frequency, it is obtained that in the frequency range from 103 to 106 Hz, the dielectric constant of PMN/CB/CIIR composites decreased with the frequency increasing and the dielectric constants are more stable under high frequency.

Pulsed Plasma Synthesis of Low Dielectric Constant Materials

1998 ◽  
Vol 511 ◽  
Author(s):  
Licheng M. Han ◽  
Richard B. Timmons ◽  
Wei W. Lee
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Dielectric Constants ◽  
Low Dielectric Constant ◽  
Plasma Synthesis ◽  
Pulsed Plasma ◽  
Plasma Polymers ◽  
Low Dielectric ◽  
Duty Cycles ◽  
Low Dielectric Constant Materials

ABSTRACTThe utility of a variable duty cycle, pulsed plasma polymerization technique to produce low dielectric constant materials (k < 2.3) is described. The molecular compositions (and thus the dielectric constants) of the plasma polymers are controllable via changes in the plasma duty cycles employed during synthesis, all other reaction variables being held constant. In the present study, this compositional controllability under pulsed conditions is illustrated with two fluoroaromatic monomers. The dielectric constants of the films decrease as the plasma duty cycles employed during polymerization are decreased. Although the as deposited films exhibit relatively poor thermal stability, it was discovered that post-plasma annealing of the films, particularly at 400 °C under N2, provides dramatic improvements in the thermal stability of these materials. Most importantly, this enhanced thermal stability is achieved with relatively minor changes in the dielectric properties of these materials. In fact, synthesis of high thermal stability films having k < 2.0 is demonstrated in this work using the perfluoroaromatic monomer perfluoroallyl benzene.

Dielectric and thermal characterization of fluorinated polyimides containing heterocyclic moieties

1993 ◽  
Vol 5 (2) ◽  
pp. 97-106 ◽  
Author(s):  
Frank W Mercer ◽  
Martin T McKenzie
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Thermal Properties ◽  
Relative Humidity ◽  
Thermal Characterization ◽  
Dielectric Constants ◽  
Aromatic Diamines ◽  
Fluorinated Polyimides

A series of fluorinated polyinides and fluorinated polyimides containing heterocyclic moieties were prepared and investigated to determine their dielectric constants, dielectric constants as a function of relative humidity (RH) and thermal properties. Thle fluorinated polyimides containing heterocyclic moieties were prepared from diamines containing pyridine, pyridazine, oxadiazole or benzoxazole moieties. The properties of the fluorinated heterocyclic-containing polyimides were compared with those of fluorinated polyimides prepared from aromatic diamines. In most cases, the introduction of heterocyclic moieties caused an increase in dielectric constant, an increase in the dielectric constant as a function of relative humidity and a decrease in thermal stability compared with the polyimides prepared with aromatic diamines.

Poly(Enaminonitriles): Novel Materials For Use In Microelectronics

1991 ◽  
Vol 227 ◽  
Author(s):  
J. A. Moore ◽  
Ji-Heung Kim
Keyword(s):  
Thermal Stability ◽  
Molecular Weight ◽  
High Temperature ◽  
Dielectric Constants ◽  
Condensation Polymerization ◽  
Aromatic Diamines ◽  
Excellent Thermal Stability ◽  
Good Solubility ◽  
Flexible Films ◽  
By Products

ABSTRACTA series of new poly(enaminonitriles) were synthesized by the condensation polymerization of three different bis(chlorodicyano-vinyl) aromatic monomers with various aromatic diamines. These polymers have moderate to high molecular weight with intrinsic viscosities ranging from 0.35 to 0.77 dl/g and form flexible films. These polymers exhibit good solubility in many organic solvents and excellent thermal stability, retaining their weight up to 400 °C in air. Poly(enaminonitriles) undergo ‘curing’ reactions at high temperature (˜300 °C) to provide insoluble, infusible material without emission of volatile by-products. Dielectric constants of these polymers ranged from 3.5 to 5.2 depending on the structure. Their thermal and dielectric properties are correlated to the structures.

scholarly journals Preparation and Characterization of Electrospun Fluoro-Containing Poly(imide-benzoxazole) Nano-Fibrous Membranes with Low Dielectric Constants and High Thermal Stability

Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 537
Author(s):  
Meng-Ge Huangfu ◽  
Deng-Xiong Shen ◽  
Xin-Xin Zhi ◽  
Yan Zhang ◽  
Yan-Jiang Jia ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Properties ◽  
High Frequency ◽  
Rapid Development ◽  
Dielectric Constants ◽  
Polymer Materials ◽  
Aromatic Diamines ◽  
Low Dielectric ◽  
Fibrous Membranes ◽  
Poly Imide

The rapid development of advanced high-frequency mobile communication techniques has advanced urgent requirements for polymer materials with high-temperature resistance and good dielectric properties, including low dielectric constants (low-Dk) and low dielectric dissipation factors (low-Df). The relatively poor dielectric properties of common polymer candidates, such as standard polyimides (PIs) greatly limited their application in high-frequency areas. In the current work, benzoxazole units were successfully incorporated into the molecular structures of the fluoro-containing PIs to afford the poly(imide-benzoxazole) (PIBO) nano-fibrous membranes (NFMs) via electrospinning fabrication. First, the PI NFMs were prepared by the electrospinning procedure from organo-soluble PI resins derived from 2,2′-bis(3,4-dicarboxy-phenyl)hexafluoropropane dianhydride (6FDA) and aromatic diamines containing ortho-hydroxy-substituted benzamide units, including 2,2-bis[3-(4-aminobenzamide)-4-hydroxylphenyl]hexafluoropropane (p6FAHP) and 2,2-bis[3-(3-aminobenzamide)-4-hydroxyphenyl]hexafluoropropane (m6FAHP). Then, the PI NFMs were thermally dehydrated at 350 °C in nitrogen to afford the PIBO NFMs. The average fiber diameters (dav) for the PIBO NFMs were 1225 nm for PIBO-1 derived from PI-1 (6FDA-p6FAHP) precursor and 816 nm for PIBO-2 derived from PI-2 (6FDA-m6FAHP). The derived PIBO NFMs showed good thermal stability with the glass transition temperatures (Tgs) over 310 °C and the 5% weight loss temperatures (T5%) higher than 500 °C in nitrogen. The PIBO NFMs showed low dielectric features with the Dk value of 1.64 for PIBO-1 and 1.82 for PIBO-2 at the frequency of 1 MHz, respectively. The Df values were in the range of 0.010~0.018 for the PIBO NFMs.

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