Poly(Enaminonitriles): Novel Materials For Use In Microelectronics

1991 ◽  
Vol 227 ◽  
Author(s):  
J. A. Moore ◽  
Ji-Heung Kim

ABSTRACTA series of new poly(enaminonitriles) were synthesized by the condensation polymerization of three different bis(chlorodicyano-vinyl) aromatic monomers with various aromatic diamines. These polymers have moderate to high molecular weight with intrinsic viscosities ranging from 0.35 to 0.77 dl/g and form flexible films. These polymers exhibit good solubility in many organic solvents and excellent thermal stability, retaining their weight up to 400 °C in air. Poly(enaminonitriles) undergo ‘curing’ reactions at high temperature (˜300 °C) to provide insoluble, infusible material without emission of volatile by-products. Dielectric constants of these polymers ranged from 3.5 to 5.2 depending on the structure. Their thermal and dielectric properties are correlated to the structures.

2017 ◽  
Vol 30 (7) ◽  
pp. 872-886 ◽  
Author(s):  
Qing Li ◽  
Shulai Zhang ◽  
Guangfu Liao ◽  
Changfeng Yi ◽  
Zushun Xu

A novel fluorinated aromatic triamine, named 1,3,5-tris (4-(2-trifluoromethyl-4-aminophenoxy)phenyl) benzene (TTFAPOPB), with several –CF3 groups, prolonged chain segments, and ether bonds was first successfully synthesized via a three-step reaction. Then a series of fluorinated hyperbranched polyimides (FHBPIs) with terminal amino or anhydride groups were prepared by condensation polymerization, which were derived from three commercial dianhydrides and the obtained triamine. The prepared FHBPIs showed excellent optical properties with the transmittance reaching 94.5% at 800 nm, favorable ultraviolet (UV)-shielding property with only 27% photodegradation of methylene blue solution after intense UV irradiation for 50 min, good thermal stability with glass transition temperature between 225°C and 264°C, and 10% weight loss temperature of 520–555°C and 509–541°C, respectively, in nitrogen and air atmosphere. They also exhibited relatively good mechanical properties with tensile strength, tensile modulus, and elongation at break values of 64.2–84.2 MPa, 1.2–1.5 GPa, and 6–10%, respectively. Moreover, the introduction of –CF3 and hyperbranched architecture reduced the dielectric constants of the FHBPIs to 2.69–2.92 and increased the surface contact angles to more than 98°. Thus, the FHBPIs are promising dielectric or UV-shielding materials.


2014 ◽  
Vol 941-944 ◽  
pp. 1203-1207 ◽  
Author(s):  
Qiang Xiao ◽  
Wen Fa Xiao ◽  
Xin Xin Liu

A novel cement fluid loss additive P1402, which synthesized using the monomers of 2-acrylamido-2-methyl-propane sulphonic acid (AMPS), acrylic acid (AA), N,N dimethyl acrylamide (DMAM) and N-Vinyl-2-pyrrolidone (NVP) by the method of aqueous solution polymerization. The ratio of monomers AMPS:AA:DMAM:NVP at 2:1.5:1:1, reaction PH at 10.8, reaction temperature at 65°Cand reaction time about 5 hours. The IR spectrum of P1402 show that the polymer with the structure of all the monomers .The fluid loss performance testing show that the forpolymers P1402 has an excellent thermal stability. The fluid loss additive P1402 has an excellent tolerance to salt and high temperature.


RSC Advances ◽  
2018 ◽  
Vol 8 (63) ◽  
pp. 36025-36033 ◽  
Author(s):  
Hua Zhao ◽  
Lennox O. Afriyie ◽  
Nathaniel E. Larm ◽  
Gary A. Baker

New glycol-functionalized ionic liquids exhibit high thermal stability and are lipase-compatible, leading to a high molecular weight of polyester in the enzymatic ring-opening polymerization reaction.


e-Polymers ◽  
2020 ◽  
Vol 20 (1) ◽  
pp. 500-509
Author(s):  
Dayong Zhang ◽  
Xiaohui Liu ◽  
Xuefeng Bai ◽  
Yinyin Zhang ◽  
Gang Wang ◽  
...  

AbstractA new type of phthalonitrile-etherified resole resin (PNR) was synthesized from resole resin and 4-nitrophthalonitrile. The differential scanning calorimetry results showed that the curing temperature of PNR is lower than that of phthalonitrile resin. Excellent thermal stability and bonding properties were obtained after curing at 220°C. TGA showed that in air, the temperature of 5% weight loss (T5%) of the cured PNR was 446°C, approximately 41°C higher than that of resole resin (RS), and the char yield at 800°C increased from 4% for RS to 33% for PNR. The shear strengths of PNR at room temperature and high temperature were increased by 8% and 133%, respectively, over those of RS, and after aging at 350°C for 2 h, these values were increased by 262% and 198%, respectively, over those of RS. Its excellent curing behavior, heat resistance and high bonding strength show that PNR can be used as a high temperature-resistant adhesive.


Materials ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4233
Author(s):  
Guodong Meng ◽  
Yimeng Li ◽  
Zhengdong Wang ◽  
Cheng Pan ◽  
Wenwu Gao ◽  
...  

Polymethylsilsesquioxane (PMSQ) has become a kind of widely studied filler used in the electronic circuit board substrates due to its organic–inorganic hybrid structure, low dielectric constant, and good thermal stability, among other factors. Herein, the PMSQ microspheres were prepared by a two-step acid–base-catalyzed sol–gel method; the influences of reaction conditions including the ratio of water/methyltrimethoxysilane (MTMS), reaction temperature, concentration of the catalyst, and stirring time were systematically investigated; and the optimized reaction condition was then obtained towards a narrow particle size distribution and good sphericity. The microstructure of PMSQ microspheres was analyzed by the infrared spectrum and X-ray diffraction (XRD), which indicated that the as-prepared PMSQ had a ladder-dominant structure. The thermogravimetric analysis (TGA) demonstrated an excellent thermal stability of as-prepared PMSQ microspheres. More specifically, the dielectric constants at high frequency (1~20 GHz) of as-prepared PMSQ microspheres were measured to be about 3.7, which turned out a lower dielectric constant compared to SiO2 powder (≈4.0). This study paves the way to further improve the performance of the electronic circuit board substrates for the application of high-frequency electronic packaging.


1992 ◽  
Vol 4 (2) ◽  
pp. 73-80 ◽  
Author(s):  
F. W. Mercer

Two oxadiazole containing aromatic diamines were synthesized. The diamines were prepared by reaction of aminophenols with 2,5-bis(4-fluorophenyl)-4l3,4-oxadiazole in a polar aprotic solvent in the presence of potassium carbonate. Reaction of the resulting 2,5-bis(4-(aminophenoxy)phenyl)-1,3,4-oxadiazoles with dianhydrides gave a series of polymeric amic acids. Thermal treatment yielded poly(imide ether oxadazole) films which displayed good thermal stability, flexibility, and glass transition temperatures ranging from 241 to 344C. The dielectric constants of the films were characterized as a function of relative humidity.


RSC Advances ◽  
2017 ◽  
Vol 7 (65) ◽  
pp. 40996-41003 ◽  
Author(s):  
Tianyun Li ◽  
Huahua Huang ◽  
Lei Wang ◽  
Yongming Chen

Highly soluble and optically transparent polyimides with excellent thermal stability were prepared by the introduction of alkyl and naphthalene groups into a single diamine monomer under microwave-assisted polymerization.


2019 ◽  
Vol 48 (47) ◽  
pp. 17488-17498 ◽  
Author(s):  
Randi Zhang ◽  
Mingyang Han ◽  
Yanping Ma ◽  
Gregory A. Solan ◽  
Tongling Liang ◽  
...  

The depicted N,N,N-iron(ii) chloride precatalysts, upon activation with either MAO or MMAO, not only display excellent thermal stability but are also capable of generating exceptionally high molecular weight linear polyethylenes.


Author(s):  
Narihito Nakagawa ◽  
Hideki Ohtsubo ◽  
Kohji Shibata ◽  
Atsuyuki Mitani ◽  
Kazutoshi Shimizu ◽  
...  

Melt growth composites (MGCs) have a unique microstructure, in which continuous networks of single-crystal phases interpenetrate without grain boundaries. Therefore, the MGCs have excellent high-temperature strength characteristics, creep resistance, oxidation resistance and thermal stability in an air atmosphere at very high temperature. In order to investigate the recession behavior of MGCs in combustion gas flow environment, we have just started the exposure tests to evaluate the influence of combustion gas flow environment on MGCs. The MGCs have about 95% of the initial flexural strengths after the exposure test for 10 hours at T = 1500 °C, P = 0.1–0.3 MPa, V = 150–250 m/s, PH2O = 15–45 kPa in the combustion gas flow environment. MGCs have excellent thermal stability and water vapor resistance in comparison with conventional ceramic materials such as Si3N4 and Al2O3 under the high temperature combustion gas flow environment.


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