Epoxy/benzoxazinyl POSS nanocomposite resin with low dielectric constant and excellent thermal stability

2020 ◽  
Vol 138 (8) ◽  
pp. 49887
Author(s):  
Xiaodan Li ◽  
Jiacheng Feng ◽  
Shuai Zhang ◽  
Ying Tang ◽  
Xinyu Hu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Excellent Thermal Stability ◽  
Low Dielectric

Facile method for fabricating low dielectric constant polyimide fibers with hyperbranched polysiloxane

2017 ◽  
Vol 5 (11) ◽  
pp. 2818-2825 ◽  
Author(s):  
Jie Dong ◽  
Cairan Yang ◽  
Yang Cheng ◽  
Tingting Wu ◽  
Xin Zhao ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Dielectric Constant ◽  
High Performance ◽  
Low Dielectric Constant ◽  
Excellent Thermal Stability ◽  
Low Dielectric ◽  
Polyimide Fibers ◽  
Hyperbranched Polysiloxane ◽  
Radar Wave

High-performance fibers with a low dielectric constant and good mechanical properties as well as excellent thermal stability are in demand for the next generation of advanced radar-wave-transparent composites.

Curing Process Window and Thermal Stability of Porous MSQ-Based Low-Dielectric-Constant Materials

2004 ◽  
Vol 151 (6) ◽  
pp. F146 ◽  
Author(s):  
Shou-Yi Chang ◽  
Tzu-Jen Chou ◽  
Yung-Cheng Lu ◽  
Syun-Ming Jang ◽  
Su-Jien Lin ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Process Window ◽  
Curing Process ◽  
Low Dielectric ◽  
Low Dielectric Constant Materials ◽  
Thermal Stability Of

Deposition of Fluorinated Amorphous Carbon Thin Films with Low Dielectric Constant and Thermal Stability

2000 ◽  
Vol 612 ◽  
Author(s):  
Sang-Soo Han ◽  
Byeong-Soo Bae
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Dielectric Constant ◽  
Amorphous Carbon ◽  
Inductively Coupled Plasma ◽  
Gas Flow ◽  
Stable Condition ◽  
Flow Rate Ratio ◽  
Low Dielectric Constant ◽  
Low Dielectric

AbstractFluorinated amorphous carbon (a-C:F) thin films were deposited by inductively coupled plasma enhanced chemical vapor deposition (ICP-CVD) with increasing CF4:CH4 gas flow rate ratio, and then annealed with increasing annealing temperature (100, 200, 300, and 400.). We have found the reduction mechanism of the dielectric constant and the thermally stable condition for the a-C:F films. On the basis of the results, the optimal condition to satisfy both the low dielectric constant and the thermal stability is followed as; the a-C:F films have to have the compatible F content to make a compromise between the two properties; the C-Fx bonding configuration has to exist as a form of C-F2 & C-F3 instead of C-F; The films should be somewhat cross-linked structure.

Design of low dielectric constant polybenzoxazine nanocomposite using mesoporous mullite

2016 ◽  
Vol 29 (2) ◽  
pp. 141-150 ◽  
Author(s):  
K Ilango ◽  
P Prabunathan ◽  
E Satheeshkumar ◽  
P Manohar
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Thermal Studies ◽  
Microscopic Analysis ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Porous Morphology

In this present work, porous mullites (PM0–5) were synthesized through a template-assisted method using various weight percentages of pluronic (P-123). PM5 obtained using 10 wt% of P-123 was found to show maximum porosity (3.8 Å) and low dielectric constant value (2.4). PM5 was functionalized using glycidyl-terminated silane and denoted as FPM and various weight percentages of FPM were reinforced with polybenzoxazine (PBZ) matrix in order to develop FPM/PBZ nanocomposites. The thermal studies indicate that 1.5 wt% of FPM/PBZ nanocomposite showed improved thermal stability with 34% char yield at 800°C and 162°C as glass transition temperature. It also exhibits low dielectric constant (2.6) than that of the neat PBZ matrix and other FPM/PBZ nanocomposites. The microscopic analysis confirms the homogenous dispersion of FPM into the PBZ polymer that has a porous morphology. The results suggest that the as-synthesized mesoporous mullite with low dielectric constant ( k), synthesized via template-assisted method can be used as a reinforcement to decrease the dielectric constant of polymeric material, which is of industrial significance.

New fluorinated poly(ether sulfone imide)s with high thermal stability and low dielectric constant

2014 ◽  
Vol 143 (2) ◽  
pp. 773-778 ◽  
Author(s):  
Chenyi Wang ◽  
Wentao Chen ◽  
Yunyun Chen ◽  
Xiaoyan Zhao ◽  
Jian Li ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
High Thermal Stability ◽  
Low Dielectric Constant ◽  
Low Dielectric
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