scholarly journals Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding

2005 ◽  
Author(s):  
Weibo Yu
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Silicon On Insulator ◽  
Fabrication And Characterization

Characterization of a Non-Interdigitated Comb Drive

2018 ◽  
Author(s):  
Mary Gopanchuk ◽  
Mohamed Arabi ◽  
N. Nelson-Fitzpatrick ◽  
Majed S. Al-Ghamdi ◽  
Eihab Abdel-Rahman ◽  
...  
Keyword(s):  
Quality Factor ◽  
Fundamental Frequency ◽  
High Quality Factor ◽  
Silicon On Insulator ◽  
Comb Drive ◽  
High Quality ◽  
Sensor Applications ◽  
Fabrication And Characterization

This paper reports on the design, fabrication, and characterization of non-interdigitated comb drive actuators in Silicon-on-Insulator (SOI) wafers, using a single mask surface microma-chining process. The response of the actuator is analyzed numerically and experimentally. The results show at the fundamental frequency; it behaves as a longitudinal comb drive actuator. At a higher frequency, it exhibits a high-quality factor which is appropriate for sensor applications.

scholarly journals Fabrication and Characterization of Light Emitting Diode Based on n-ZnO Nanorods Grown Via a Low-Temperature

2020 ◽  
Vol 1535 ◽  
pp. 012009
Author(s):  
Sabah M. Mohammad ◽  
Nabeel M. Abd-Alghafour ◽  
Z. Hassan ◽  
Naser M. Ahmed ◽  
Amal Mohamed Ahmed Ali ◽  
...  
Keyword(s):  
Low Temperature ◽  
Light Emitting Diode ◽  
Zno Nanorods ◽  
Light Emitting ◽  
Fabrication And Characterization

Fabrication and Characterization of Vertical Travel Linear Microactuator

2004 ◽  
Author(s):  
Risaku Toda ◽  
Eui-Hyeok Yang
Keyword(s):  
Piezoelectric Actuator ◽  
Actuation Voltage ◽  
Silicon On Insulator ◽  
Test Bed ◽  
Device Structure ◽  
Beam Geometry ◽  
Out Of Plane ◽  
Fabrication And Characterization ◽  
Vertical Travel

This paper describes design, fabrication and characterization of a proof-of-concept vertical travel linear microactuator designed to provide out-of-plane actuation for high precision positioning applications in space. The microactuator is designed to achieve vertical actuation travel by incorporating compliant beam structures within a SOI (Silicon on Insulator) wafer. Device structure except for the piezoelectric actuator is fabricated on the SOI wafer using Deep Reactive Ion Etch (DRIE) process. Incremental travel distance of the piezoelectric actuator is adjustable at nanometer level by controlling voltage. Bistable beam geometry is employed to minimize initial gaps between electrodes. The footprint of an actuator is approximately 2 mm × 4 mm. Actuation is characterized with LabVIEW-based test bed. Actuation voltage sequence is generated by the LabVIEW controlled power relays. Vertical actuation in the range of 500 nm over 10-cycle was observed using WYKO RST Plus Optical Profiler.

Sign in / Sign up

Export Citation Format

Share Document