Selective induction heating of metallic microstructures for wafer-level MEMS packaging

2020 ◽  
Vol 63 ◽  
pp. S13-S20
Author(s):  
Alexander Fröhlich ◽  
Christian Hofmann ◽  
Patrick Rochala ◽  
Jonas Kimme ◽  
Martin Kroll ◽  
...  
Keyword(s):  
Induction Heating ◽  
Wafer Level ◽  
Mems Packaging ◽  
Metallic Microstructures

Localized induction heating solder bonding for wafer level MEMS packaging

2004 ◽  
Vol 15 (2) ◽  
pp. 394-399 ◽  
Author(s):  
Hsueh-An Yang ◽  
Mingching Wu ◽  
Weileun Fang
Keyword(s):  
Induction Heating ◽  
Wafer Level ◽  
Mems Packaging

Effects of Packaging Induced Stress on MEMS Devices and Its Improvements

2006 ◽  
Vol 326-328 ◽  
pp. 529-532
Author(s):  
Sung Hoon Choa ◽  
Moon Chul Lee ◽  
Yong Chul Cho
Keyword(s):  
Silicon On Insulator ◽  
Anodic Bonding ◽  
Mems Devices ◽  
Wafer Level ◽  
Process Technology ◽  
Molding Compound ◽  
Mems Packaging ◽  
Induced Stress ◽  
Induced Structure ◽  
Glass Process

In MEMS, packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. The conventional MEMS SOI (silicon-on-insulator) gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. Therefore we propose a packaged SiOG (Silicon On Glass) process technology and more robust spring design.

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