MEMS Packaging - WSPC Series in Advanced Integration and Packaging
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By WORLD SCIENTIFIC

9789813229358, 9789813229365

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

MEMS Reliability

MEMS Packaging - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789813229365_0013 ◽

2017 ◽

pp. 279-343 ◽

Cited By ~ 1

Author(s):

Chien-Ming Huang ◽

Arvind Sai Sarathi Vasan ◽

Yunhan Huang ◽

Ravi Doraiswami ◽

Michael Osterman ◽

...

Download Full-text

Wafer-Level Solder Bonding by Using Localized Induction Heating

MEMS Packaging - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789813229365_0010 ◽

2017 ◽

pp. 197-222

Author(s):

Hsueh-An Yang ◽

Chiung-Wen Lin ◽

Weileun Fang

Keyword(s):

Induction Heating ◽

Wafer Level

Download Full-text

Vertical Interconnects for High-End MEMS

MEMS Packaging - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789813229365_0003 ◽

2017 ◽

pp. 45-52

Author(s):

Maaike M. Visser Taklo ◽

Sigurd Moe

Keyword(s):

Vertical Interconnects

Download Full-text

Introduction to MEMS Packaging

MEMS Packaging - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789813229365_0001 ◽

2017 ◽

pp. 1-29 ◽

Cited By ~ 1

Author(s):

Y. C. Lee ◽

Ramesh Ramadoss ◽

Nils Hoivik

Keyword(s):

Mems Packaging

Download Full-text

Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost

MEMS Packaging - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789813229365_0004 ◽

2017 ◽

pp. 53-71

Author(s):

Paul Pickering ◽

Collin Twanow ◽

Dean Spicer

Keyword(s):

Wafer Level ◽

Wafer Level Packaging

Download Full-text

PCB Based MEMS and Microfluidics

MEMS Packaging - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789813229365_0006 ◽

2017 ◽

pp. 85-115

Author(s):

Ramesh Ramadoss ◽

Antonio Luque ◽

Carmen Aracil

Download Full-text

Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market

MEMS Packaging - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789813229365_0005 ◽

2017 ◽

pp. 73-84

Author(s):

Steven Nasiri ◽

Sandra Winkler ◽

Ramesh Ramadoss

Keyword(s):

Low Cost ◽

Fabrication Process ◽

Motion Sensors ◽

Consumer Market

Download Full-text

Silex’s TSV Technology: Overview of Processes and MEMS Applications

MEMS Packaging - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789813229365_0002 ◽

2017 ◽

pp. 31-43

Author(s):

Tomas Bauer ◽

Thorbjörn Ebefors

Download Full-text

Heterogeneous Integration and Wafer-Level Packaging of MEMS

MEMS Packaging - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789813229365_0008 ◽

2017 ◽

pp. 141-169 ◽

Cited By ~ 1

Author(s):

Masayoshi Esashi ◽

Shuji Tanaka

Keyword(s):

Heterogeneous Integration ◽

Wafer Level ◽

Wafer Level Packaging

Download Full-text

Microsprings for High-Density Flip-Chip Packaging

MEMS Packaging - WSPC Series in Advanced Integration and Packaging ◽

10.1142/9789813229365_0012 ◽

2017 ◽

pp. 251-277

Author(s):

Eugene M. Chow ◽

Christopher L. Chua

Keyword(s):

Flip Chip ◽

High Density ◽

Flip Chip Packaging

Download Full-text

MEMS Packaging - WSPC Series in Advanced Integration and PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By WORLD SCIENTIFIC

MEMS Reliability

Wafer-Level Solder Bonding by Using Localized Induction Heating

Vertical Interconnects for High-End MEMS

Introduction to MEMS Packaging

Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost

PCB Based MEMS and Microfluidics

Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market

Silex’s TSV Technology: Overview of Processes and MEMS Applications

Heterogeneous Integration and Wafer-Level Packaging of MEMS

Microsprings for High-Density Flip-Chip Packaging

MEMS Packaging - WSPC Series in Advanced Integration and Packaging
Latest Publications