scholarly journals Pull strength evaluation of Sn-Pb solder joints made to Au-Pt-Pd and Au thick film structures on low-temperature co-fired ceramic -final report for the MC4652 crypto-coded switch (W80).

2006 ◽  
Author(s):  
Fernando Uribe ◽  
Paul Thomas Vianco ◽  
Gary L Zender
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Solder Joints ◽  
Final Report ◽  
Strength Evaluation ◽  
Pull Strength

scholarly journals Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 335
Author(s):  
Gyuwon Jeong ◽  
Dong-Yurl Yu ◽  
Seongju Baek ◽  
Junghwan Bang ◽  
Tae-Ik Lee ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Interfacial Reactions ◽  
Circuit Boards ◽  
Ag Nps ◽  
Laser Bonding ◽  
Laser Soldering ◽  
Low Temperature Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.

Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder

2008 ◽  
Vol 580-582 ◽  
pp. 243-246 ◽  
Author(s):  
Hiroshi Nishikawa ◽  
Akira Komatsu ◽  
Tadashi Takemoto
Keyword(s):  
Intermetallic Compound ◽  
Interfacial Reaction ◽  
Fracture Mode ◽  
Joint Strength ◽  
Solder Bump ◽  
Solder Joints ◽  
Pull Strength ◽  
Electroless Ni

The reaction between Sn-Ag (-Co) solder and electroless Ni-P plating was investigated in order to clarify the effect of the addition of Co to Sn-Ag solder on the formation of intermetallic compound (IMC) at the interface and the joint strength at the interface. Sn-Ag-Co solder was specially prepared. The results show that there is little effect of the addition of Co to the Sn-Ag solder on the IMC formation and the thickness of the IMC at the interface. For the pull strength of the solder bump joint, the addition of Co to the solder didn’t strongly affect the pull strength of the solder joints, but it affected the fracture mode of the solder joints.

Sensor stack for Tian-Calvet Calorimeter made in LTCC-Technology

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000019-000023
Author(s):  
Franz Schubert ◽  
Jaroslaw Kita ◽  
Michael Gollner ◽  
Florian Linseis ◽  
Ralf Moos
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Production Costs ◽  
Hybrid Structures ◽  
Fem Modelling ◽  
Stage Of Development ◽  
Ceramic Disc ◽  
Made In ◽  
Calvet Calorimeter ◽  
Screen Printed

Abstract The paper presents the construction and first tests of a new sensor stack for a Tian-Calvet Calorimeter made in LTCC Technology. In contrast to typical construction where wired thermocouples are directly connected, the here-presented solution replaces wired thermocouples by screen-printed thick-film thermocouples placed on a structured disc made of Low Temperature Co-fired Ceramics (LTCC). The advantage of screen-printed thermocouples is the ease of integration of them into thick-film hybrid structures, and to simplify the device setup. Moreover, using thermocouples integrated into a ceramic disc can increase the sensitivity of the system and simultaneously reduce the production costs. The paper shows the design and fabrication of the sensor stacks. It consists of several LTCC discs and ceramic spacers. On each LTCC disc, 34 Au/Pt thermocouples were deposited. The design of the disc was supported by FEM-modelling under consideration of device specific requirements. The very initial measurements, which we conducted using two sensor stacks already exhibited a sensitivity of 8 μV/mW, which is more than satisfactory in this stage of development.

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