Sensor stack for Tian-Calvet Calorimeter made in LTCC-Technology

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000019-000023
Author(s):  
Franz Schubert ◽  
Jaroslaw Kita ◽  
Michael Gollner ◽  
Florian Linseis ◽  
Ralf Moos
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Production Costs ◽  
Hybrid Structures ◽  
Fem Modelling ◽  
Stage Of Development ◽  
Ceramic Disc ◽  
Made In ◽  
Calvet Calorimeter ◽  
Screen Printed

Abstract The paper presents the construction and first tests of a new sensor stack for a Tian-Calvet Calorimeter made in LTCC Technology. In contrast to typical construction where wired thermocouples are directly connected, the here-presented solution replaces wired thermocouples by screen-printed thick-film thermocouples placed on a structured disc made of Low Temperature Co-fired Ceramics (LTCC). The advantage of screen-printed thermocouples is the ease of integration of them into thick-film hybrid structures, and to simplify the device setup. Moreover, using thermocouples integrated into a ceramic disc can increase the sensitivity of the system and simultaneously reduce the production costs. The paper shows the design and fabrication of the sensor stacks. It consists of several LTCC discs and ceramic spacers. On each LTCC disc, 34 Au/Pt thermocouples were deposited. The design of the disc was supported by FEM-modelling under consideration of device specific requirements. The very initial measurements, which we conducted using two sensor stacks already exhibited a sensitivity of 8 μV/mW, which is more than satisfactory in this stage of development.

scholarly journals Modification of Thick-Film Conductors Used in IP Technology for Reduction of Warpage during Co-Firing of LTCC (Low Temperature Co-Fired Ceramic) Modules

2007 ◽  
Vol 336-338 ◽  
pp. 746-749 ◽  
Author(s):  
Hansu Birol ◽  
Thomas Maeder ◽  
Peter Ryser
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Thick Films ◽  
Shrinkage Rate ◽  
Major Difficulty ◽  
Flat Surfaces ◽  
Temperature Firing ◽  
Differential Shrinkage ◽  
Printed Materials ◽  
Screen Printed

LTCC technology offers low temperature firing (<900 °C) of a materials system, which is based on LTCC sheets/tapes and (ideally) compatible thick-film components. Screen-printed materials on LTCC tapes, such as conductor, resistor, inductor thick-films are co-fired (simultaneously fired), providing a highly-functional package. This comes along with additional benefits such as ease of LTCC tape structuring, fabrication of hermetic and complex 3-D structures, etc. The major difficulty encountered arises from the differential shrinkage rate of LTCC tape and thick-film components, which has to be avoided for fabrication of warpage-free, flat surfaces that is vital for membranes, beams, etc. Therefore the goal of this study is the reduction of deformation, by matching the shrinkage rate of conductor with that of LTCC, which is achieved by mixing the commercially-available paste with selected additives.

ЦИФРОВОЙ ИЗОЛЯТОР В СПЕЦИАЛИЗИРОВАННОМ КОРПУСЕ, ВЫПОЛНЕННОМ ПО ТЕХНОЛОГИИ LTCC

2020 ◽  
Vol 96 (3s) ◽  
pp. 392-395
Author(s):  
В.А. Бутузов ◽  
А.Е. Назаренко ◽  
Н.Ю. Дмитриев ◽  
В.А. Трофимов ◽  
В.А. Косевский ◽  
...  
Keyword(s):  
Low Temperature ◽  
Data Rate ◽  
Test Results ◽  
Made In

Представлены результаты разработки цифрового изолятора на основе интегрального микротрансформатора в специализированном корпусе, выполненном по технологии низкотемпературной совместно обжигаемой керамики (LTCC). Согласно результатам измерений тестовых образцов максимальная скорость передачи данных разработанного цифрового изолятора - не менее 30 Мбит/с. The paper presents the results of the development of a digital insulator based on an integral microtransformer in a specialized package made in technology of low-temperature co-fired ceramics. The isolator is a microassembly consisting of a transceiver chip and an integrated transformer. According to the test results, the maximum data rate speed of the developed digital insulator is not less than 30 Mbit/s.

scholarly journals Bimetallic Ni-Based Catalysts for CO2 Methanation: A Review

Nanomaterials ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 28
Author(s):  
Anastasios I. Tsiotsias ◽  
Nikolaos D. Charisiou ◽  
Ioannis V. Yentekakis ◽  
Maria A. Goula
Keyword(s):  
Low Temperature ◽  
Noble Metals ◽  
Recent Progress ◽  
Low Cost ◽  
Alloy Formation ◽  
Co2 Methanation ◽  
High Performing ◽  
Mobile Sources ◽  
Low Dispersion ◽  
Made In

CO2 methanation has recently emerged as a process that targets the reduction in anthropogenic CO2 emissions, via the conversion of CO2 captured from point and mobile sources, as well as H2 produced from renewables into CH4. Ni, among the early transition metals, as well as Ru and Rh, among the noble metals, have been known to be among the most active methanation catalysts, with Ni being favoured due to its low cost and high natural abundance. However, insufficient low-temperature activity, low dispersion and reducibility, as well as nanoparticle sintering are some of the main drawbacks when using Ni-based catalysts. Such problems can be partly overcome via the introduction of a second transition metal (e.g., Fe, Co) or a noble metal (e.g., Ru, Rh, Pt, Pd and Re) in Ni-based catalysts. Through Ni-M alloy formation, or the intricate synergy between two adjacent metallic phases, new high-performing and low-cost methanation catalysts can be obtained. This review summarizes and critically discusses recent progress made in the field of bimetallic Ni-M (M = Fe, Co, Cu, Ru, Rh, Pt, Pd, Re)-based catalyst development for the CO2 methanation reaction.

scholarly journals Development of technology of preparation of pork semi-products with the application of low-temperature treatment

2019 ◽  
Vol 81 (2) ◽  
pp. 250-256
Author(s):  
M. F. Khairullin ◽  
E. A. Koval ◽  
I. Y. Levitskaya ◽  
M. G. Gadjiev ◽  
B. A. Sultonov
Keyword(s):  
Low Temperature ◽  
Temperature Treatment ◽  
Production Costs ◽  
Meat Industry ◽  
Pork Products ◽  
Low Temperature Treatment ◽  
Organoleptic Characteristics ◽  
Microbiological Characteristics ◽  
Manufactured Products ◽  
Low Temperature Processing

The study was aimed at developing a technology for preparing various semi-finished products from pork meat using low-temperature processing "Su-Vid". The main physicochemical indicators, functional-technological and structural-mechanical characteristics of semi-finished products, the chemical composition of semi-finished products and finished products were identified and determined experimentally, and organoleptic analysis was carried out. The data indicate that the use of low-temperature processing significantly affects the characteristics of manufactured products, which improves its performance. In particular, pork semi-finished products prepared at low temperatures are characterized by the yield: steak – 93.9%, ribs – 92.6%, in comparison with the control regime, 7.5 and 6.2% higher. The complex of data obtained showed that the samples of semi-finished pork, according to the experimental regimes of heat treatment, in terms of safety, fully meet the requirements of TR TS 034/2013. Analysis of semi-finished pork products showed that products prepared using the Su-Vid technology had high organoleptic characteristics, taste and sensory characteristics. During the storage of semi-finished products, minor changes in proteins and fats, as well as organoleptic, sanitary and microbiological characteristics, took place. As a result, a bone steak was developed in the Caucasian marinade and pork ribs in the Monte Ritz marinade made using the Su-Vid technology. The results allow us to judge that this technology is quite promising and has a positive effect on the characteristics of manufactured products. The widespread introduction of this technology in the meat industry will allow the development of semi-finished products and products of high quality, nutritional and biological value compared to products manufactured by traditional methods, as well as reduce production costs.

REVIEW OF THE PRODUCTION OF ELECTRICITY FROM PHOTOVOLTAICS IN THE REPUBLIC OF MACEDONIA

2013 ◽  
Vol 4 (2) ◽  
Author(s):  
Igor Tomovski ◽  
Aleksandra Kanevče ◽  
Ljubčo Kocarev
Keyword(s):  
Direct Conversion ◽  
Production Costs ◽  
Electricity Production ◽  
Renewable Sources ◽  
Global Trends ◽  
Republic Of Macedonia ◽  
The Republic ◽  
Technological Limitations ◽  
Legislative Measures ◽  
Made In

Global trends in the energy sector are focused towards extensive inclusion of renewable sources in the energy production. Solar energy has proven to be a valuable candidate, especially for direct conversion into electricity. Its wider use has, so far, among other, been constrained by the technological limitations, resulting in higher production costs compared to those from conventional non-renewable sources, primarily coal. In that sense, the efforts of the scientific community have for long been directed towards development of both efficient and inexpensive solutions. However, the major boost in the electricity production from photovoltaics (PV) came from the legislative measures, primarily the introduction of feed-in tariffs. Following the global trends, a significant increase in PV inclusion in the electricity production was made in the Republic of Macedonia. In the article we give a brief review of the achieved progress.

Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technology

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000172-000177
Author(s):  
Koji Sasaki ◽  
Noritsuka Mizumura
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Thermal Cycling ◽  
Thick Film ◽  
Thermal Performance ◽  
Low Temperature Sintering ◽  
Thermal Cycling Test ◽  
Nano Silver ◽  
Cycling Test ◽  
Thick Film Technology

Traditional thick film technology is widely used in various electronics products. There are two type of paste based on thick film technology. Typically, over 400°C is required for high temperature sintering type which contains glass for adhesion function. It shows high electrical and thermal performance. On the other hand, 150–300°C range process is used for low temperature process type as silver epoxy. In last decade, nano silver technology shows amazing progress to address low temperature operation by low temperature sintering. This paper will discuss the results on fundamental study of newly developed nano silver pastes with unique approach which uses MO (Metallo-organic) technology and resin reinforcing technology. Nano silver pastes contain several types of dispersant as surface coating to prevent agglomeration of the particles. Various coating technique has been reported to optimize sintering performance and stability. MO technology provides low temperature sintering capability by minimizing the coating material. The nano silver pastes show high electrical and thermal performance. However, degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Degradation of die shear strength was not found by thermal cycling test to 1000 cycles. Nano silver pastes using MO technology and resin reinforcing technology will meet lots of requirement on various thick film applications.

Performance Assessment of a Low Temperature Polymer Conductor for Lead-Free Soldering Processes

2014 ◽  
Vol 2014 (1) ◽  
pp. 000251-000257
Author(s):  
Steven Grabey ◽  
Samson Shahbazi ◽  
Sarah Groman ◽  
Catherine Munoz
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Elevated Temperatures ◽  
Printed Electronics ◽  
High Reliability ◽  
Sem Analysis ◽  
Lead Free ◽  
Sac305 Solder ◽  
Soldering Process ◽  
Lead Free Solders

An increased interest in low temperature polymer thick film products has become apparent due to the rise of the printed electronics market. The specifications for these products are becoming more demanding with expectations that the low temperature products should perform at a level that is typically reserved for their high temperature counterparts; including solderability with lead free solders, high reliability and strong adhesion. Traditionally, it has only been possible to use leaded solders for soldering to polymer based thick film conductors. Over the last 15 years environmental concerns and legislation have pushed the industry towards a lead free approach. The shift to lead free solders, while beneficial, provides new challenges during processing. The high temperatures required for a lead-free soldering process yield a naturally harsher environment for polymer thick film pastes. In the past these conditions have proven too harsh for the pastes to survive. The polymer thick film discussed in this document aims to address some of these concerns for a highly reliable and easy to process polymer thick film paste. Due to the poor leaching characteristics of polymer thick films, at elevated temperatures, the predecessors of this paste typically soldered at low temperatures with leaded solders. The goal of this paper is to present a low temperature paste that is compatible with a variety of substrates and readily accepts lead-free solder. This paper will discuss a newly formulated low temperature curing (150°C – 200°C) RoHS and REACH compliant paste that shows excellent solderability with SAC305 solder. The paste was evaluated using a dip soldering method at 235°C–250°C on a variety of substrates. The data presented includes solder acceptance, adhesion data, thermal analysis and SEM analysis.

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