High Speed Circuits and Packaging Technology for Advanced Laser Altimeter Systems.

Mapping Intimacies ◽

10.21236/ada324731 ◽

1996 ◽

Author(s):

Charles Chang ◽

Dharmesh Jani ◽

K. C. Wang ◽

Gerry Sullivan ◽

Edward Gertner

Keyword(s):

High Speed ◽

Laser Altimeter ◽

Packaging Technology

Download Full-text

High Speed Circuits and Packaging Technology for Advanced Laser Altimeter Systems.

10.21236/ada323087 ◽

1996 ◽

Author(s):

Charles Chang ◽

Dharmesh Jani ◽

Alfred Yen ◽

K. C. Yang

Keyword(s):

High Speed ◽

Laser Altimeter ◽

Packaging Technology

Download Full-text

A new packaging technology using micro-solder bumps for high-speed photoreceivers

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.159888 ◽

1992 ◽

Vol 15 (4) ◽

pp. 578-582 ◽

Cited By ~ 17

Author(s):

H. Tsunetsugu ◽

K. Katsura ◽

T. Hayashi ◽

F. Ishitsuka ◽

S. Hata

Keyword(s):

High Speed ◽

Packaging Technology ◽

Solder Bumps

Download Full-text

High-speed electrical design study for 3D-IC packaging technology

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117223 ◽

2011 ◽

Author(s):

Robert Sung ◽

Kevin Chiang ◽

Daniel Lee ◽

Mike Ma

Keyword(s):

High Speed ◽

Design Study ◽

3D Ic ◽

Packaging Technology ◽

3D Ic Packaging ◽

Ic Packaging

Download Full-text

Investigation of packaging technology for high-speed photodetector modules

Fourth Seminar on Novel Optoelectronic Detection Technology and Application ◽

10.1117/12.2306242 ◽

2018 ◽

Author(s):

Yu Liu ◽

Zeping Zhao ◽

Mingchao Chang ◽

Jianguo Liu

Keyword(s):

High Speed ◽

Packaging Technology

Download Full-text

Packaging technology for high-speed optoelectronics

Conference on Optical Fiber Communication ◽

10.1364/ofc.1994.thl1 ◽

1994 ◽

Author(s):

Kohsuke Katsura

Keyword(s):

High Speed ◽

Packaging Technology

Download Full-text

Organic Chip Packaging Technology For High Speed Processor Applications

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2002.258316 ◽

2002 ◽

Cited By ~ 4

Author(s):

Bernd Garben ◽

Andreas Huber ◽

Dierk Kaller ◽

Erich Klink

Keyword(s):

High Speed ◽

Packaging Technology

Download Full-text

Bond wireless multichip packaging technology for high-speed circuits

Microelectronics Reliability ◽

10.1016/0026-2714(93)90431-w ◽

1993 ◽

Vol 33 (13) ◽

pp. 2067

Keyword(s):

High Speed ◽

Packaging Technology

Download Full-text

High-density memory packaging technology high-speed imaging applications

10.1117/12.23349 ◽

1991 ◽

Cited By ~ 2

Author(s):

Dean L. Frew

Keyword(s):

High Speed ◽

High Density ◽

High Speed Imaging ◽

Packaging Technology

Download Full-text

Bond wireless multichip packaging technology for high-speed circuits

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.159873 ◽

1992 ◽

Vol 15 (4) ◽

pp. 451-456 ◽

Cited By ~ 2

Author(s):

C.-L. Chen ◽

L.J. Mahoney ◽

D.Z. Tsang ◽

K.M. Molvar

Keyword(s):

High Speed ◽

Packaging Technology

Download Full-text

Packaging technology of 32-ch high-speed optical wavelength selector using PLC platform

1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting. IEEE Lasers and Electro-Optics Society 1999 Annual Meeting (Cat. No.99CH37009) ◽

10.1109/leos.1999.813460 ◽

2003 ◽

Author(s):

I. Ogawa ◽

Y. Suzaki

Keyword(s):

High Speed ◽

Packaging Technology ◽

Optical Wavelength

Download Full-text