Bond wireless multichip packaging technology for high-speed circuits

1992 ◽  
Vol 15 (4) ◽  
pp. 451-456 ◽  
Author(s):  
C.-L. Chen ◽  
L.J. Mahoney ◽  
D.Z. Tsang ◽  
K.M. Molvar
Keyword(s):  
High Speed ◽  
Packaging Technology

A new packaging technology using micro-solder bumps for high-speed photoreceivers

1992 ◽  
Vol 15 (4) ◽  
pp. 578-582 ◽  
Author(s):  
H. Tsunetsugu ◽  
K. Katsura ◽  
T. Hayashi ◽  
F. Ishitsuka ◽  
S. Hata
Keyword(s):  
High Speed ◽  
Packaging Technology ◽  
Solder Bumps

High Speed Circuits and Packaging Technology for Advanced Laser Altimeter Systems.

1996 ◽  
Author(s):  
Charles Chang ◽  
Dharmesh Jani ◽  
K. C. Wang ◽  
Gerry Sullivan ◽  
Edward Gertner
Keyword(s):  
High Speed ◽  
Laser Altimeter ◽  
Packaging Technology

Polyamide 4T: A New Lead-Free Solderable Polymer Enabling Packaging Technology Through Micro Molding and LDS

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 001563-001584
Author(s):  
Tamim Sidiki
Keyword(s):  
Value Chain ◽  
High Speed ◽  
High Performance ◽  
New Technologies ◽  
New Technology ◽  
Three Dimensional ◽  
Common Mode ◽  
Packaging Technology ◽  
Semiconductor Chip ◽  
High Flexibility

The continuous trend towards convergence and miniaturization is recently generating significant interest in new technologies for Electronics. This requires the integration of Semiconductors and Magnetics, two entirely different industries with different players in the value chain. In this paper, we demonstrate, a packaging technology which allows three dimensional stacking of Magnets and Semiconductors. We realized the integration of a Semiconductor chip - which provides protection against electro static discharge (ESD) – and a common mode filter (CMF) into one thermoplastic package. For the first time ever, this filter is integrated directly into the thermoplastic part which is used as the substrate, filter and housing at the same time. Laser direct structuring in combination with Stanyl® ForTiiTM as an ultra high performance, entirely halogen-free high temperature thermoplastic omits any wires for the realized coil, and also facilitates high flexibility in design and manufacturing, allowing ultra small footprints and the realization of components suitable for surface mount technology. As an example of this new technology, we demonstrate a component which can provide full ESD protection and common mode filtering for a high speed USB2.0 interface.

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