High-speed electrical design study for 3D-IC packaging technology

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117223 ◽

2011 ◽

Author(s):

Robert Sung ◽

Kevin Chiang ◽

Daniel Lee ◽

Mike Ma

Keyword(s):

High Speed ◽

Design Study ◽

3D Ic ◽

Packaging Technology ◽

3D Ic Packaging ◽

Ic Packaging

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Reliability challenges in 3D IC packaging technology

Microelectronics Reliability ◽

10.1016/j.microrel.2010.09.031 ◽

2011 ◽

Vol 51 (3) ◽

pp. 517-523 ◽

Cited By ~ 332

Author(s):

K.N. Tu

Keyword(s):

3D Ic ◽

Packaging Technology ◽

3D Ic Packaging ◽

Ic Packaging

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Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products

Science China Technological Sciences ◽

10.1007/s11431-013-5261-y ◽

2013 ◽

Vol 56 (7) ◽

pp. 1740-1748 ◽

Cited By ~ 25

Author(s):

K. N. Tu ◽

Tian Tian

Keyword(s):

3D Ic ◽

Electronic Products ◽

Packaging Technology ◽

Consumer Electronic ◽

3D Ic Packaging ◽

Ic Packaging

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Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology

Materials Science and Engineering R Reports ◽

10.1016/j.mser.2018.09.002 ◽

2019 ◽

Vol 136 ◽

pp. 1-12 ◽

Cited By ~ 35

Author(s):

K.N. Tu ◽

Yingxia Liu

Keyword(s):

Solder Joint ◽

Kinetic Analysis ◽

3D Ic ◽

Packaging Technology ◽

Recent Advances ◽

3D Ic Packaging ◽

Ic Packaging

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TSV Core Technology for 3D IC Packaging

Journal of Welding and Joining ◽

10.5781/kwjs.2009.27.3.004 ◽

2009 ◽

Vol 27 (3) ◽

pp. 4-9

Author(s):

Seung-Min Hyun ◽

Chang-Woo Lee

Keyword(s):

3D Ic ◽

Core Technology ◽

3D Ic Packaging ◽

Ic Packaging

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3D IC Integration and 3D IC Packaging

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_7 ◽

2021 ◽

pp. 343-378

Author(s):

John H. Lau

Keyword(s):

3D Ic ◽

3D Ic Packaging ◽

Ic Packaging

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Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis

Microelectronics Reliability ◽

10.1016/j.microrel.2015.12.041 ◽

2016 ◽

Vol 61 ◽

pp. 64-70 ◽

Cited By ~ 28

Author(s):

Fa Xing Che ◽

Xiaowu Zhang ◽

Jong-Kai Lin

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Reliability Study ◽

Element Analysis ◽

3D Ic ◽

3D Ic Packaging ◽

Ic Packaging

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Fundamentals of Heat Dissipation in 3D IC Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_10 ◽

2017 ◽

pp. 245-260 ◽

Cited By ~ 3

Author(s):

Satish G. Kandlikar ◽

Amlan Ganguly

Keyword(s):

Heat Dissipation ◽

3D Ic ◽

3D Ic Packaging ◽

Ic Packaging

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Mechanical strength of thin Cu-TSV memory dies used in 3D IC packaging

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365247 ◽

2015 ◽

Cited By ~ 4

Author(s):

Y. C. Chao ◽

P. S. Huang ◽

H. T. Keng ◽

M. Y. Tsai ◽

P. C. Lin

Keyword(s):

Mechanical Strength ◽

3D Ic ◽

3D Ic Packaging ◽

Ic Packaging

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A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures

Microelectronic Engineering ◽

10.1016/j.mee.2013.12.005 ◽

2014 ◽

Vol 120 ◽

pp. 85-89 ◽

Cited By ~ 8

Author(s):

M. Lofrano ◽

B. Vandevelde ◽

M. Gonzalez

Keyword(s):

3D Ic ◽

Modeling Approach ◽

Induced Stress ◽

3D Ic Packaging ◽

Ic Packaging

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Low cost, room temperature debondable spin-on temporary bonding solution: A key enabler for 2.5D/3D IC packaging

2013 IEEE 63rd Electronic Components and Technology Conference ◽

10.1109/ectc.2013.6575558 ◽

2013 ◽

Cited By ~ 8

Author(s):

Ranjith Samuel E. John ◽

Herman Meynen ◽

Sheng Wang ◽

Peng-Fei Fu ◽

Craig Yeakle ◽

...

Keyword(s):

Room Temperature ◽

Low Cost ◽

3D Ic ◽

3D Ic Packaging ◽

Ic Packaging ◽

Temporary Bonding

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