Mo/Cr Metallization for Silicon Device Interconnection

1986 ◽  
Vol 71 ◽  
Author(s):  
M. J. Kim ◽  
R. A. Saia
Keyword(s):  
Annealing Temperature ◽  
Vlsi Circuits ◽  
Electrical Characteristics ◽  
X Ray Diffraction ◽  
Electrical Measurements ◽  
Thermal Reliability ◽  
X Ray ◽  
Layer Contact ◽  
Silicon Device ◽  
Dry Etch

AbstractA molybdenum and chromium double layer contact has been developed for the first level metallization of VLSI circuits. An 800Å layer of chromium deposited under a thick molybdenum conductor provides good ohmic contact to p+ and n+ silicon and also promotes metal adhesion to the substrate. The molybdenum has good step coverage and acceptable current carrying capacity when its thickness exceeds 5000Å. Both metals are sequentially sputtered in one pumpdown and patterned with a single RIE step using CCI4 + O2. One pm diameter contacts and 1.5µm wide lines are formed in VLSI geometries using all dry etch processes. Electrical characteristics and thermal reliability were evaluated as a function of annealing temperature. Contact resistance and shallow device junctions are stable up to 500°C for p+/n diodes and up to 450°C for n+/p diodes. The sheet resistance of the film in contact with silicon rapidly increases at 525°C as silicon outdiffuses to form (Mox Crr−x)Si2 The mechanism and cause of the high temperature degradation was studied by mean of SIMS, x-ray diffraction analysis, SEM and electrical measurements.

Electrical Characteristics of ZnTe Thermoelectric Thin Films

2014 ◽  
Vol 535 ◽  
pp. 688-691 ◽  
Author(s):  
Wen Shiush Chen ◽  
Cheng Hsing Hsu ◽  
Wen Hua Kao ◽  
Yi Ting Yu ◽  
Pai Chuan Yang ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Annealing Temperature ◽  
Thermoelectric Device ◽  
Electrical Characteristics ◽  
X Ray Diffraction ◽  
Si Substrate ◽  
X Ray ◽  
Device Applications ◽  
Thermoelectric Thin Films ◽  
Thermal Coating

Thermal coating growth of ZnTe thermoelectric films were deposited on n-type Si substrate is studied. Structural analysis through x-ray diffraction (XRD) and scanning electron microscopy (SEM) were sensitive to the RTA treatment. The electrical properties and microstructure of these films were investigated with special emphasis on the effects of various annealing temperatures from 600°C to 800°C by RTA technique. The highest carrier concentration, lowest resistivity and mobility at an annealing temperature of 700°C are 3.5×1015cm-3, 0.25 Ω-cm, and 49 cm2V-1S-1. The resultant electrical properties have made ZnTe films as very interesting materials for thermoelectric device applications.

Metallurgical and Electrical Characteristics of MoAlx Schottky Contacts to n-GaAs

1992 ◽  
Vol 260 ◽  
Author(s):  
T. S. Huang ◽  
J. G. Peng ◽  
C. C. Lin
Keyword(s):  
Thermal Processing ◽  
Annealing Temperature ◽  
Schottky Diodes ◽  
Schottky Contacts ◽  
Electrical Characteristics ◽  
Interfacial Stability ◽  
X Ray Diffraction ◽  
X Ray ◽  
Barrier Heights ◽  
Current Voltage

ABSTRACTThe interfacial stability, surface morphology and electrical characteristics of MoAlx contacts to n-GaAs have been investigated by using x-ray diffraction, scanning electron microscopy, sheet resistance and current-voltage measurements. The compositions of rf-cosputtered MoAlx films were x = 0.35, 2.7, and 7.0, respectively. The contacts were annealed by rapid thermal processing in the temperature range 500–1000 °C for 20 s. The interfaces of MoAl0.35/GaAs and MoAl2,7/GaAs were stable up to 900 °C, while the interfaces of MoAl7.0/GaAs were less stable and reactions occurred above 800 °C. The variations of sheet resistances and the barrier heights of the Schottky diodes as a function of annealing temperatures can be well correlated to the interfacial stability. The MoAl2.7/n-GaAs diodes exhibited the best stability and were characterized by the highest barrier height (0.98 V) and nearly unit ideality factor (1.11) after annealing at 900 °C. For all thermally stable MoAlx/n-GaAs Schottky diodes, the barrier heights increased with annealing temperature.

Electrical Characteristics of BaxSr1-xTiO3(BST) Capacitors Implemented with Ti-Al Electrodes

2006 ◽  
Vol 928 ◽  
Author(s):  
Thottam S Kalkur ◽  
Jeff Whitescarver ◽  
Nick Cramer
Keyword(s):  
Dielectric Constant ◽  
Substrate Temperature ◽  
Diffraction Analysis ◽  
Annealing Temperature ◽  
Electrical Characteristics ◽  
X Ray Diffraction ◽  
X Ray ◽  
Decoupling Capacitor ◽  
Electrical Characterizations ◽  
Deposited Film

AbstractTi-Al was used as the electrode for RF magnetron sputtered BST film at a substrate temperature of 450°C for decoupling capacitor applications. X-ray diffraction analysis shows that the deposited film BST film is amorphous. Electrical characterizations of the devices performed by capacitance versus voltage measurements show a dielectric constant of about 55. With increase in annealing temperature above 450°C, the capacitance was found to decrease significantly.

Electrical Characteristics of Ti/4H-SiC Slicidation Schottky Barrier Diode

2008 ◽  
Vol 600-603 ◽  
pp. 643-646 ◽  
Author(s):  
Akimasa Kinoshita ◽  
Takashi Nishi ◽  
Takasumi Ohyanagi ◽  
Tsutomu Yatsuo ◽  
Kenji Fukuda ◽  
...  
Keyword(s):  
Schottky Barrier ◽  
Schottky Barrier Height ◽  
Annealing Temperature ◽  
Voltage Drop ◽  
Schottky Contact ◽  
Electrical Characteristics ◽  
X Ray Diffraction ◽  
X Ray ◽  
Current Voltage ◽  
Forward Voltage Drop

The reaction and phase formation of the Ti/SiC Schottky contact as a function of the annealing temperature (400~700oC) were investigated. The Schottky barrier height (fb) and the crystal structure of the samples annealed at the different temperature were measured by the forward current-voltage (IV) characteristics and the x-ray diffraction (XRD), respectively. XRD measurements were performed in the w-2q scan and the pole figure measurement for Ti (101) diffraction peak. The fb was changed as a function of temperature. It was concluded that the fb variation and non-uniformity of the samples annealed at 400oC, 500oC, 600 oC and 700oC was caused by changing the condition at the interface between SiC substrate and Ti. We fabricated the 600V Ti/SiC silicidation SBD annealed at 500oC for 5min. As a result, a low forward voltage drop, low reverse leakage current and stability at high temperature (200 oC) for the Ti/SiC silicidation SBD were shown.

Rapid Isothermal Processing of Strained GeSi Layers

1991 ◽  
Vol 224 ◽  
Author(s):  
D. K. Nayak ◽  
K. Kamjoo ◽  
J. S. Park ◽  
J. C. S. Woo ◽  
K. L. Wang
Keyword(s):  
High Temperature ◽  
Structural Stability ◽  
Annealing Temperature ◽  
Electrical Characteristics ◽  
X Ray Diffraction ◽  
Thermal Cycles ◽  
Double Crystal ◽  
X Ray ◽  
Rapid Isothermal Processing ◽  
Temperature Time

AbstractThe effects of high temperature-time thermal cycles on the structural stability of GexSi1−x/Si and Si/GexSi1−x/Si layers are studied, using double-crystal x-ray diffraction. The temperature-time cycles chosen in this study are useful for the fabrication of submicron Si MOSFETs. The electrical characteristics of GeSi/Si p-n heterojunctions as a function of annealing temperature and time are also presented.

Effect of F-doping on temperature dependence of resistivity of vanadium pentoxide thin films prepared by spray pyrolysis

2018 ◽  
Vol 32 (20) ◽  
pp. 1850229
Author(s):  
M. Mousavi ◽  
Gh. Khorami ◽  
A. Kompany ◽  
N. Shahtahmasebi
Keyword(s):  
Thin Films ◽  
Phase Transition ◽  
Vanadium Pentoxide ◽  
Metallic Phase ◽  
Electrical Characteristics ◽  
X Ray Diffraction ◽  
Electrical Measurements ◽  
Sem Images ◽  
X Ray ◽  
Transition Change

This paper reports structural and electrical characteristics of F-doped [Formula: see text]V2O5 thin films of different F concentrations. The films were analyzed by X-ray diffraction. It was found that F-doping in vanadium pentoxide affects the crystallinity of the samples. The SEM images have shown that by increasing the F-doping level, the size of the nanobelt increases. Electrical measurements indicated that the F-doping in [Formula: see text]V2O5 makes the temperature of phase transition change from semiconductor to metallic phase.

SI Contacts Formed from Spun-on Metallo-Organic Solutions

1983 ◽  
Vol 25 ◽  
Author(s):  
C. S. Pai ◽  
B. Zhang ◽  
D. M. Scott ◽  
S. S. Lau ◽  
M. Bartur ◽  
...  
Keyword(s):  
Schottky Barrier ◽  
Annealing Temperature ◽  
Electrical Characteristics ◽  
X Ray Diffraction ◽  
Si Substrate ◽  
Linear Region ◽  
X Ray ◽  
Si Substrates ◽  
Organic Solutions ◽  
Pt Films

ABSTRACTThe use of spun-on liquids to form ohmic and Schottky barrier contacts on Si has been investigated. Two commercially available metallo-organic solutions containing Au or Pt were applied to Si substrates by spinning techniques. The Au or Pt contacts were then formed by annealing at 250°C or 450°C respectively. The metallurgical interactions between the spun-on Au or Pt layers and the Si substrate were investigated by MeV backscattering spectrometry and X-ray diffraction as a function of the annealing temperature. The resulting electrical characteristics were investigated with four point probe, I-V and C-V techniques. It was found that the spun-on Au or Pt films react with Si substrates at much higher temperatures than those deposited by vacuum evaporation. The diode characteristics of the spun-on Au films are comparable to those of evaporated Au films ( φB ∼0.85V, n ∼1.08), whereas diode characteristics of spunon Pt films show no linear region on the ln I-V curve. The application of spun-on Au also improves the bondability of Si chips on Mo headers.

scholarly journals A Study of Thin Film Resistors Prepared Using Ni-Cr-Si-Al-Ta High Entropy Alloy

2015 ◽  
Vol 2015 ◽  
pp. 1-7 ◽  
Author(s):  
Ruei-Cheng Lin ◽  
Tai-Kuang Lee ◽  
Der-Ho Wu ◽  
Ying-Chieh Lee
Keyword(s):  
Annealing Temperature ◽  
Phase Evolution ◽  
Amorphous Structure ◽  
High Entropy Alloy ◽  
X Ray Diffraction ◽  
Temperature Coefficient Of Resistance ◽  
X Ray ◽  
High Entropy ◽  
Transmission Electron ◽  
Thin Film Resistors

Ni-Cr-Si-Al-Ta resistive thin films were prepared on glass and Al2O3substrates by DC magnetron cosputtering from targets of Ni0.35-Cr0.25-Si0.2-Al0.2casting alloy and Ta metal. Electrical properties and microstructures of Ni-Cr-Si-Al-Ta films under different sputtering powers and annealing temperatures were investigated. The phase evolution, microstructure, and composition of Ni-Cr-Si-Al-Ta films were characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), and Auger electron spectroscopy (AES). When the annealing temperature was set to 300°C, the Ni-Cr-Si-Al-Ta films with an amorphous structure were observed. When the annealing temperature was at 500°C, the Ni-Cr-Si-Al-Ta films crystallized into Al0.9Ni4.22, Cr2Ta, and Ta5Si3phases. The Ni-Cr-Si-Al-Ta films deposited at 100 W and annealed at 300°C which exhibited the higher resistivity 2215 μΩ-cm with −10 ppm/°C of temperature coefficient of resistance (TCR).

scholarly journals Effects of Thermal Annealing on the Properties of Zirconium-Doped MgxZn1−XO Films Obtained through Radio-Frequency Magnetron Sputtering

Membranes ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 373
Author(s):  
Wen-Yen Lin ◽  
Feng-Tsun Chien ◽  
Hsien-Chin Chiu ◽  
Jinn-Kong Sheu ◽  
Kuang-Po Hsueh
Keyword(s):  
Magnetron Sputtering ◽  
Radio Frequency ◽  
Photoelectron Spectroscopy ◽  
Annealing Temperature ◽  
Radio Frequency Magnetron ◽  
Radio Frequency Magnetron Sputtering ◽  
X Ray Diffraction ◽  
Free Electrons ◽  
X Ray ◽  
Mg Content

Zirconium-doped MgxZn1−xO (Zr-doped MZO) mixed-oxide films were investigated, and the temperature sensitivity of their electric and optical properties was characterized. Zr-doped MZO films were deposited through radio-frequency magnetron sputtering using a 4-inch ZnO/MgO/ZrO2 (75/20/5 wt%) target. Hall measurement, X-ray diffraction (XRD), transmittance, and X-ray photoelectron spectroscopy (XPS) data were obtained. The lowest sheet resistance, highest mobility, and highest concentration were 1.30 × 103 Ω/sq, 4.46 cm2/Vs, and 7.28 × 1019 cm−3, respectively. The XRD spectra of the as-grown and annealed Zr-doped MZO films contained MgxZn1−xO(002) and ZrO2(200) coupled with Mg(OH)2(101) at 34.49°, 34.88°, and 38.017°, respectively. The intensity of the XRD peak near 34.88° decreased with temperature because the films that segregated Zr4+ from ZrO2(200) increased. The absorption edges of the films were at approximately 348 nm under 80% transmittance because of the Mg content. XPS revealed that the amount of Zr4+ increased with the annealing temperature. Zr is a potentially promising double donor, providing up to two extra free electrons per ion when used in place of Zn2+.

AIN/GaN and AIGaN/GaN Heterostructures Grown by HVPE on SiC Substrates

1997 ◽  
Vol 482 ◽  
Author(s):  
Yu. V. Melnik ◽  
A. E. Nikolaev ◽  
S. I. Stepanov ◽  
A. S. Zubrilov ◽  
I. P. Nikitina ◽  
...  
Keyword(s):  
Growth Rate ◽  
Electron Beam ◽  
Vapor Phase ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Hydride Vapor Phase Epitaxy ◽  
X Ray Diffraction ◽  
Electrical Measurements ◽  
X Ray ◽  
Micro Analysis

AbstractGaN, AIN and AIGaN layers were grown by hydride vapor phase epitaxy. 6H-SiC wafers were used as substrates. Properties of AIN/GaN and AIGaN/GaN structures were investigated. AIGaN growth rate was about 1 μm/min. The thickness of the AIGaN layers ranged from 0.5 to 5 μm. The AIN concentration in AIGaN layers was varied from 9 to 67 mol. %. Samples were characterised by electron beam micro analysis, Auger electron spectroscopy, X-ray diffraction and cathodoluminescence.Electrical measurements performed on AIGaN/GaN/SiC samples indicated that undoped AIGaN layers are conducting at least up to 50 mol. % of AIN.

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