Gettering of Impurities in Silicon

1985 ◽  
Vol 59 ◽  
Author(s):  
A. Ourmazd

ABSTRACTDespite the apparent dissimilarities between different gettering methods, we show that many can be understood in terms of two basic mechanisms. The first involves the interaction of selfinterstitials (emitted, for example, by P in-diffusion and precipitation, 0 precipitation, or Ar implantation) with the impurities to be gettered. The second relies on a strain-field/point defect interaction (for example around a dislocation), which appears capable of enhancing the diffusivity of the impurities. In either case, gettering can be viewed as a particular and particularly useful instance of the wider class of defect/defect interactions.

Tungsten ◽  
2021 ◽  
Vol 3 (1) ◽  
pp. 38-57
Author(s):  
Peng-Bo Zhang ◽  
Ji-Jun Zhao ◽  
Ting-Ting Zou ◽  
Rui-Huan Li ◽  
Peng-Fei Zheng ◽  
...  

1984 ◽  
Vol 144 (1) ◽  
pp. 96-109 ◽  
Author(s):  
A.G. Crocker ◽  
J.I. Akhter ◽  
H.L. Tatham

1992 ◽  
Vol 134 (2) ◽  
pp. 351-358 ◽  
Author(s):  
A. V. Gektin ◽  
V. Ya. Serebryanny ◽  
N. V. Shiran

1993 ◽  
Vol 300 ◽  
Author(s):  
T. E. Haynes ◽  
R. Morton ◽  
S. S. Lau

ABSTRACTIn recent years, a number of experimental observations have indicated that interactions between mobile point defects generated during ion implantation play an important role in the damage production in Ill-V compound semiconductors, and particularly GaAs. This paper reviews a set of such observations based on ion channeling measurements of the lattice damage in GaAs implanted with Si ions. Selected independent observations are also surveyed to illustrate the importance of point-defect interactions. Taken together, these show that at least two contributions to the lattice damage must often be considered: a “prompt” contribution attributed to direct-impact amorphization, and a “delayed” contribution attributed to point-defect clustering. New measurements are then described which show the different effects that these two damage components have on the electrical activation in annealed, Siimplanted GaAs. The aim is to indicate the potential to exploit the balance between these two damage contributions in order to improve the electrical performance and reproducibility of ion-implanted and annealed layers. Finally, the applicability of these concepts to other ion species and other compound semiconductors (GaP and InP) is briefly discussed.


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