Nitrogen Profile Engineering for Tunnel Oxynitrides

1999 ◽  
Vol 567 ◽  
Author(s):  
Taro Sugizaki ◽  
Yoko Tada ◽  
Ken-Ichi Hikazutani ◽  
Toshiro Nakanishi ◽  
Kanetake Takasaki

ABSTRACTWe consider nitrogen profiling in oxynitrides to be the key technology for next generation Flash Memories, because of its ability to suppress the generation of traps in tunnel oxides. We are trying to develop an oxynitriding technique for tunnel oxides that uses nitric monooxide. This time, we tried to control nitrogen profile in oxynitrides by using reoxidized oxynitride process. By using a three- step oxidationoxynitridation-reoxidation process, we attempted to systematically tune oxidation conditions, to obtain a satisfactory tunnel oxide/Si interface and SILC characteristics. Highly reliable tunnel oxide for flash memory has been achieved using recently developed reoxidized oxynitrides processing, which is characterized by wet oxidationoxynitridation-dry oxidation. This process yields excellent characteristics, such as low oxide trap formation, low leakage current, and high charge to breakdown (Qbd). This three-step oxynitride process is best suited for flash memories having superior Program/Erase (P/E) cycling endurance and data retention characteristics. In addition, I will propose the optimum conditions for the reoxidation process.

2007 ◽  
Vol 28 (8) ◽  
pp. 750-752 ◽  
Author(s):  
M. Park ◽  
Kangdeog Suh ◽  
Keonsoo Kim ◽  
S. Hur ◽  
K. Kim ◽  
...  

2005 ◽  
Vol 45 (9-11) ◽  
pp. 1331-1336 ◽  
Author(s):  
Ling-Chang Hu ◽  
An-Chi Kang ◽  
Eric Chen ◽  
J.R. Shih ◽  
Yao-Feng Lin ◽  
...  

2008 ◽  
Vol 1108 ◽  
Author(s):  
Jung-hwan Kim ◽  
Yong-Seok Kim ◽  
Byong-Hyun Jang ◽  
Hyun Namkoong ◽  
Woo-Sung Lee ◽  
...  

AbstractTo improve the IPD reliability of NAND flash memory, plasma oxidation was introduced as the post-treatment process of ONO (Oxide/Nitride/Oxide) IPD. The LP-CVD SiO2 modified by plasma oxidation showed the excellent electrical properties. e.g., low leakage current, high breakdown voltage etc. By the analysis of Tof-SIMS and XRR, we could observe the several changes of physical characteristics such as the reduction of impurities (H, N etc.), the increase of oxide density, and the improvement of oxide surface roughness. We found out the appropriate treatment condition to be able to densify oxide layer without the addition of ONO Equivalent Oxide Thickness (EOT). The LP-CVD SiO2 prepared by plasma oxidation was used for the ONO IPD of 50nm NAND flash device and also compared with the conventional LP-CVD SiO2 in the aspect of the IPD reliability.


2003 ◽  
Vol 24 (12) ◽  
pp. 748-750 ◽  
Author(s):  
Jae-Duk Lee ◽  
Jeong-Hyuk Choi ◽  
Donggun Park ◽  
Kinam Kim

2011 ◽  
Vol 26 (10) ◽  
pp. 105015 ◽  
Author(s):  
Zhiwei Zheng ◽  
Zongliang Huo ◽  
Manhong Zhang ◽  
Chenxin Zhu ◽  
Jing Liu ◽  
...  

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