High Resolution, High Fill Factor A-SI:H Sensor Arrays for Optical Imaging

1999 ◽  
Vol 557 ◽  
Author(s):  
J.T. Rahn ◽  
F. Lemmi ◽  
P. Mei ◽  
J.P. Lu ◽  
J.B. Boyce ◽  
...  
Keyword(s):  
Fill Factor ◽  
Sensor Arrays ◽  
Dimensional Structure ◽  
Pixel Size ◽  
Large Area ◽  
Leakage Currents ◽  
Active Matrix ◽  
3 Dimensional ◽  
Layer Contact ◽  
High Fill Factor

AbstractAmorphous silicon large area sensor arrays are in production for x-ray medical imaging. The most common pixel design works very well for many applications but is limited in spatial resolution because the available sensor area (the fill factor) vanishes in small pixels. One solution is a 3-dimensional structure in which the sensor is placed above the active matrix addressing. However, such high fill factor designs have previously introduce cross talk between pixels.We present data for a design in which the a-Si:H p-i-n photodiode sensor layer has a continuous i-layer and top p+-layer, and a patterned n+-layer contact to the pixel. Arrays of 64 μm and 75μm pitch have been fabricated and are the highest resolution a-Si:H arrays reported to date. The resolution matches the pixel size, and sensitivity has been improved by the high fill factor. Comparison is made between arrays with standard TFTs and TFTs with self-aligned source and drain contacts. Data line capacitance is improved by use of the self-aligned contacts.Measurements are included on the contact to bias capacitance. The high fill factor design greatly suppresses lateral leakage currents, while retaining ease of processing. Provided illumination levels remain below saturation, the resolution matches expectation for the pixel size.

High Fill Factor a-Si:H Sensor Arrays with Reduced Pixel Crosstalk

2008 ◽  
Vol 1066 ◽  
Author(s):  
Yuriy Vygranenko ◽  
A. Sazonov ◽  
D. Striakhilev ◽  
J. H. Chang ◽  
G. Heiler ◽  
...  
Keyword(s):  
Fill Factor ◽  
Sensor Arrays ◽  
Image Sensor ◽  
Low Noise ◽  
Active Matrix ◽  
Interlayer Dielectric ◽  
Sensor Performance ◽  
Data Line ◽  
High Fill Factor ◽  
Low K

ABSTRACTIn this paper, we report on low noise, high fill factor amorphous silicon (a-Si:H) image sensor structures for indirect radiography. Two types of the sensor arrays comprising n-i-p photodiodes and m-i-s photosensors have been fabricated. The device prototypes contain 100 × 100 pixels, with a pixel pitch of 139 μm. The active-matrix addressing is provided by low off-current TFTs. The sensors are vertically integrated onto the TFT-backplane, by implementing a 3-μm-thick low-k interlayer dielectric. This dielectric layer serves to reduce the data line capacitance and to planarize underlying topography. The detector was designed for reduced data-line resistance and parasitic coupling. Details of the device design and fabrication, along with sensor performance characteristics, are presented and discussed.

2D Image Sensing Arrays with NIP Diodes

1993 ◽  
Vol 297 ◽  
Author(s):  
C Van Berkel ◽  
N C Bird ◽  
C J Curling ◽  
I D French
Keyword(s):  
Sensor Arrays ◽  
Image Sensor ◽  
Transient Current ◽  
Medical Applications ◽  
Device Performance ◽  
Large Area ◽  
Active Matrix ◽  
Test Array ◽  
Image Sensing ◽  
Trap Filling

2D image sensor arrays made with a-Si devices on glass over large area are of considerable interest as document scanners and in medical applications. We have made a test array containing a-Si NIP diodes for both the sensors and the active matrix switching devices. The issues of vertical crosstalk and image lag are discussed in relation to the device performance of the switching diode. The vertical crosstalk is controlled by the diode capacitance and the image lag by the high transient current in the device. We speculate that the transient current is a trap filling current in the deep states of the switching diode.

High-resolution high fill factor a-Si:H sensor arrays for medical imaging

1999 ◽  
Author(s):  
Jeffrey T. Rahn ◽  
Francesco Lemmi ◽  
Richard L. Weisfield ◽  
Rene Lujan ◽  
Ping Mei ◽  
...  
Keyword(s):  
High Resolution ◽  
Medical Imaging ◽  
Fill Factor ◽  
Sensor Arrays ◽  
High Fill Factor

Approaching the fill factor Shockley–Queisser limit in stable, dopant-free triple cation perovskite solar cells

2017 ◽  
Vol 10 (6) ◽  
pp. 1530-1539 ◽  
Author(s):  
Martin Stolterfoht ◽  
Christian M. Wolff ◽  
Yohai Amir ◽  
Andreas Paulke ◽  
Lorena Perdigón-Toro ◽  
...  
Keyword(s):  
Solar Cells ◽  
Charge Carrier ◽  
Fill Factor ◽  
Perovskite Solar Cells ◽  
Large Area ◽  
High Fill Factor

High fill factor, large area perovskite solar cells are realized with undoped organic transport layers by optimizing the charge carrier transit through PTAA.

Effects of buried insulator-sensor interface on the lateral conduction of high fill factor aSi:H imagers

2000 ◽  
Vol 609 ◽  
Author(s):  
M. Mulato ◽  
F. Lemmi ◽  
S. E. Ready ◽  
J. P. Lu ◽  
K. Van Schuylenbergh ◽  
...  
Keyword(s):  
Cross Talk ◽  
Fill Factor ◽  
Silicon Oxynitride ◽  
Readout Circuit ◽  
Sensor Interface ◽  
Active Matrix ◽  
Low Dielectric ◽  
Factor Design ◽  
High Fill Factor

ABSTRACTThe pixel cross-talk is investigated in two-dimensional amorphous silicon (a-Si:H) imager arrays based on the new high fill factor design. In this configuration a continuous a-Si:H sensor extends over the whole surface of the imager, and a buried insulator material with low dielectric constant is used to separate the sensor from the underlying active matrix readout circuit. We find that the lateral conduction between neighboring pixels is mainly determined by the quality of the buried insulator-sensor interface, rather than the specific buried material itself. Minimum cross-talk values below 1% are obtained for different insulator materials including silicon oxynitride and thicker polymer based resins. The quality of this interface also affects trapping and recombination of the photogenerated carriers, influencing important imager properties such as sensitivity and image lag.

Three-Dimensional Reconstruction Using Stereo Pairs from Serial Thick Sections

1977 ◽  
Vol 35 ◽  
pp. 562-563
Author(s):  
Robert Glaeser ◽  
Thomas Bauer ◽  
David Grano
Keyword(s):  
Three Dimensional ◽  
Dimensional Structure ◽  
Serial Sections ◽  
Thin Sections ◽  
3 Dimensional ◽  
Transmission Electron ◽  
Freeze Dried ◽  
Dimensional Reconstruction ◽  
Stereo Imagery ◽  
Whole Mounts

In transmission electron microscopy, the 3-dimensional structure of an object is usually obtained in one of two ways. For objects which can be included in one specimen, as for example with elements included in freeze- dried whole mounts and examined with a high voltage microscope, stereo pairs can be obtained which exhibit the 3-D structure of the element. For objects which can not be included in one specimen, the 3-D shape is obtained by reconstruction from serial sections. However, without stereo imagery, only detail which remains constant within the thickness of the section can be used in the reconstruction; consequently, the choice is between a low resolution reconstruction using a few thick sections and a better resolution reconstruction using many thin sections, generally a tedious chore. This paper describes an approach to 3-D reconstruction which uses stereo images of serial thick sections to reconstruct an object including detail which changes within the depth of an individual thick section.

A Novel Reconstitution Method for Inducing the Formation of Regular 2-Dimensional Arrays of Membrane Proteins and Lipids

1988 ◽  
Vol 46 ◽  
pp. 152-153 ◽  
Author(s):  
A. Engel ◽  
A. Holzenburg ◽  
K. Stauffer ◽  
J. Rosenbusch ◽  
U. Aebi
Keyword(s):  
Membrane Proteins ◽  
Flow Rate ◽  
Lipid Membranes ◽  
Functional Characterization ◽  
Dimensional Structure ◽  
Electron Crystallography ◽  
Peltier Element ◽  
Protein Ratio ◽  
Precise Control ◽  
3 Dimensional

Reconstitution of solubilized and purified membrane proteins in the presence of phospholipids into vesicles allows their functions to be studied by simple bulk measurements (e.g. diffusion of differently sized solutes) or by conductance measurements after transformation into planar membranes. On the other hand, reconstitution into regular protein-lipid arrays, usually forming at a specific lipid-to-protein ratio, provides the basis for determining the 3-dimensional structure of membrane proteins employing the tools of electron crystallography.To refine reconstitution conditions for reproducibly inducing formation of large and highly ordered protein-lipid membranes that are suitable for both electron crystallography and patch clamping experiments aimed at their functional characterization, we built a flow-dialysis device that allows precise control of temperature and flow-rate (Fig. 1). The flow rate is generated by a peristaltic pump and can be adjusted from 1 to 500 ml/h. The dialysis buffer is brought to a preselected temperature during its travel through a meandering path before it enters the dialysis reservoir. A Z-80 based computer controls a Peltier element allowing the temperature profile to be programmed as function of time.

Structure and Interaction of Protamine by Dark Field Electron Microscopy

1976 ◽  
Vol 34 ◽  
pp. 160-161
Author(s):  
D.P. Bazett-Jones ◽  
F.P. Ottensmeyer
Keyword(s):  
Electron Microscopy ◽  
Dark Field ◽  
Amino Acid Sequences ◽  
Dimensional Structure ◽  
3 Dimensional ◽  
Field Electron ◽  
Proposed Model ◽  
Field Electron Microscopy ◽  
Dark Field Electron ◽  
Positively Charged

It has been shown for some time that it is possible to obtain images of small unstained proteins, with a resolution of approximately 5Å using dark field electron microscopy (1,2). Applying this technique, we have observed a uniformity in size and shape of the 2-dimensional images of pure specimens of fish protamines (salmon, herring (clupeine, Y-l) and rainbow trout (Salmo irideus)). On the basis of these images, a model for the 3-dimensional structure of the fish protamines has been proposed (2).The known amino acid sequences of fish protamines show stretches of positively charged arginines, separated by regions of neutral amino acids (3). The proposed model for protamine structure (2) consists of an irregular, right-handed helix with the segments of adjacent arginines forming the loops of the coil.

High resolution spot scan imaging of frozen, hydrated actin bundles with 400kV electrons

1992 ◽  
Vol 50 (1) ◽  
pp. 512-513
Author(s):  
J. Jakana ◽  
M.F. Schmid ◽  
P. Matsudaira ◽  
W. Chiu
Keyword(s):  
High Resolution ◽  
Binding Proteins ◽  
Actin Binding ◽  
Eukaryotic Cells ◽  
Dimensional Structure ◽  
Structural Basis ◽  
Actin Bundle ◽  
Actin Bundles ◽  
3 Dimensional ◽  
Macromolecular Assembly

Actin is a protein found in all eukaryotic cells. In its polymerized form, the cells use it for motility, cytokinesis and for cytoskeletal support. An example of this latter class is the actin bundle in the acrosomal process from the Limulus sperm. The different functions actin performs seem to arise from its interaction with the actin binding proteins. A 3-dimensional structure of this macromolecular assembly is essential to provide a structural basis for understanding this interaction in relationship to its development and functions.

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