Application of the Non-Enzymatic Glucose Sensor Combined with Microfluidic System and Calibration Readout Circuit

In this research, we proposed a potentiometric sensor based on copper doped zinc oxide (CZO) films to detect glucose. Silver nanowires were used to improve the sensor’s average sensitivity, and we used the low power consumption instrumentation amplifier (UGFPCIA) designed by our research group to measure the sensing characteristics of the sensor. It was proved that the sensor performs better when using this system. In order to observe the stability of the sensor, we also studied the influence of two kinds of non-ideal effects on the sensor, such as the drift effect and the hysteresis effect. For this reason, we chose to combine the calibration readout circuit with the voltage-time (V-T) measurement system to optimize the measurement environment and successfully reduced the instability of the sensor. The drift rate was reduced by about 51.1%, and the hysteresis rate was reduced by 13% and 28% at different measurement cycles. In addition, the characteristics of the sensor under dynamic conditions were also investigated, and it was found that the sensor has an average sensitivity of 13.71 mV/mM and the linearity of 0.998 at a flow rate of 5.6 μL/min.

Thermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation

In this work, we analysed the difference between the measurement and simulation results of thermal drift of a custom designed capacitive MEMS accelerometer. It was manufactured in X-FAB XMB10 technology together with a dedicated readout circuit in X-FAB XP018 technology. It turned out that the temperature sensitivity of the sensor’s output is nonlinear and particularly strong in the negative Celsius temperature range. It was found that the temperature drift is mainly caused by the MEMS sensor and the influence of the readout circuit is minimal. Moreover, the measurements showed that this temperature dependence is the same regardless of applied acceleration. Simulation of the accelerometer’s model allowed us to estimate the contribution of post-manufacturing mismatch on the thermal drift; for our sensor, the mismatch-induced drift accounted for about 6% of total thermal drift. It is argued that the remaining 94% of the drift could be a result of the presence of residual stress in the structure after fabrication.