Si/SiGe and III-V Integrated Circuit Technology for Next Generation High-Speed Systems: Comparisons and Tradeoffs

1998 ◽  
Vol 535 ◽  
Author(s):  
Lawrence E. Larson
Keyword(s):  
Integrated Circuit ◽  
High Speed ◽  
Next Generation ◽  
Circuit Technology

AbstractThis paper will summarize the technology tradeoffs that are involved in the implementation of high-speed integrated circuit technology for communications applications. The advantages of Si/SiGe and III-V technology with respect to CMOS and Si bipolar technologies are discussed.

scholarly journals Wire Laying Methods as an Alternative to Multilayer PCB's

1984 ◽  
Vol 11 (2) ◽  
pp. 117-122
Author(s):  
G. Messner ◽  
P. Plonski ◽  
A. Martens
Keyword(s):  
Integrated Circuit ◽  
High Speed ◽  
Impedance Control ◽  
Vlsi Circuits ◽  
High Density ◽  
Large Numbers ◽  
Design And Manufacturing ◽  
Computer Based ◽  
Board Performance ◽  
Circuit Technology

The rapid growth of integrated circuit technology, culminating in VLSI circuits, is responsible for the proliferation of new, surface mountable device packages with large numbers of input-output terminals. Conventional printed circuit or multilayer techniques have been driven to the technological edge in the effort to interconnect these new types of packages. Because the etched conductors can be replaced with fine, insulated wires, automated high density discrete wiring techniques can provide easier high density interconnections and with shorter turn-around times. Among the dozen or so presently available discrete wiring techniques, the fastest growing is Multiwire®. Multiwire is a computer based design and manufacturing system, where special machines are precisely laying down polyimide insulated wires over adhesive coated substrates having etched power and ground planes. The finished boards exhibit microstrip characteristics, providing impedance control for high speed applications. The manufacturing process and Multiwire board performance capabilities are described in this paper.

scholarly journals Special Issue on Intelligent Integrated Systems for Robotics

1994 ◽  
Vol 6 (2) ◽  
pp. 119-119
Author(s):  
Michitaka Kameyama ◽  
Keyword(s):  
Real World ◽  
Integrated Circuit ◽  
Integrated Systems ◽  
Next Generation ◽  
Special Issue ◽  
Robot Systems ◽  
Scale Integration ◽  
Near Future ◽  
Circuit Technology

The new area of ""intelligent integrated systems"" has been proposed to develop one of the generic technologies for next-generation electronics and information systems. Although the interpretation may be different for individual persons, I think the area is the integration of the three concepts as shown in Figure. One is the concept of ""system on silicon"" using the integrated circuit technology. Giga-scale integration will be available in near future, so that we have to develop hardware and software architecture related to ultra highly parallel processing. Another is the concept of intelligence including physical model based computations as well as AI technology. The other is the concept of real-world applications just different from computer-world applications. The signal flow is passed through a real world, so that the performance should be evaluated as the response time or delay time. The examples are robotics, car electronics, home electronics, factory automation and so on. This special issue is planned to demonstrate the above important area, especially dedicated for robotics which is a typical example of the intelligent integrated systems. I believe that the contents of this issue give great impact on' the next-generation robot systems, and it will be a memorial publication. Finally, I would like to express my appreciation to the authors for their efforts and contributions to this special issue and also to the members of the Editorial Board for their useful comments.

Integrated Circuit Technology for Next Generation Point-of-Care Spectroscopy Applications

2017 ◽  
Vol 55 (10) ◽  
pp. 143-151 ◽  
Author(s):  
Jonas Handwerker ◽  
Benedikt Schlecker ◽  
Maurits Ortmanns ◽  
Jens Anders
Keyword(s):  
Integrated Circuit ◽  
Point Of Care ◽  
Next Generation ◽  
Circuit Technology
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