Integrated Circuit Technology for Next Generation Point-of-Care Spectroscopy Applications

2017 ◽  
Vol 55 (10) ◽  
pp. 143-151 ◽  
Author(s):  
Jonas Handwerker ◽  
Benedikt Schlecker ◽  
Maurits Ortmanns ◽  
Jens Anders
Keyword(s):  
Integrated Circuit ◽  
Point Of Care ◽  
Next Generation ◽  
Circuit Technology

scholarly journals Special Issue on Intelligent Integrated Systems for Robotics

1994 ◽  
Vol 6 (2) ◽  
pp. 119-119
Author(s):  
Michitaka Kameyama ◽  
Keyword(s):  
Real World ◽  
Integrated Circuit ◽  
Integrated Systems ◽  
Next Generation ◽  
Special Issue ◽  
Robot Systems ◽  
Scale Integration ◽  
Near Future ◽  
Circuit Technology

The new area of ""intelligent integrated systems"" has been proposed to develop one of the generic technologies for next-generation electronics and information systems. Although the interpretation may be different for individual persons, I think the area is the integration of the three concepts as shown in Figure. One is the concept of ""system on silicon"" using the integrated circuit technology. Giga-scale integration will be available in near future, so that we have to develop hardware and software architecture related to ultra highly parallel processing. Another is the concept of intelligence including physical model based computations as well as AI technology. The other is the concept of real-world applications just different from computer-world applications. The signal flow is passed through a real world, so that the performance should be evaluated as the response time or delay time. The examples are robotics, car electronics, home electronics, factory automation and so on. This special issue is planned to demonstrate the above important area, especially dedicated for robotics which is a typical example of the intelligent integrated systems. I believe that the contents of this issue give great impact on' the next-generation robot systems, and it will be a memorial publication. Finally, I would like to express my appreciation to the authors for their efforts and contributions to this special issue and also to the members of the Editorial Board for their useful comments.

Si/SiGe and III-V Integrated Circuit Technology for Next Generation High-Speed Systems: Comparisons and Tradeoffs

1998 ◽  
Vol 535 ◽  
Author(s):  
Lawrence E. Larson
Keyword(s):  
Integrated Circuit ◽  
High Speed ◽  
Next Generation ◽  
Circuit Technology

AbstractThis paper will summarize the technology tradeoffs that are involved in the implementation of high-speed integrated circuit technology for communications applications. The advantages of Si/SiGe and III-V technology with respect to CMOS and Si bipolar technologies are discussed.

Preparation of TEM samples by focused ion beams

1995 ◽  
Vol 53 ◽  
pp. 518-519
Author(s):  
John F. Walker ◽  
J C Reiner ◽  
C Solenthaler
Keyword(s):  
Integrated Circuit ◽  
Polycrystalline Silicon ◽  
Field Effect Transistor ◽  
High Spatial Resolution ◽  
Ion Beam ◽  
Ion Beams ◽  
Focused Ion Beams ◽  
Precise Location ◽  
Effect Transistor ◽  
Circuit Technology

The high spatial resolution available from TEM can be used with great advantage in the field of microelectronics to identify problems associated with the continually shrinking geometries of integrated circuit technology. In many cases the location of the problem can be the most problematic element of sample preparation. Focused ion beams (FIB) have previously been used to prepare TEM specimens, but not including using the ion beam imaging capabilities to locate a buried feature of interest. Here we describe how a defect has been located using the ability of a FIB to both mill a section and to search for a defect whose precise location is unknown. The defect is known from electrical leakage measurements to be a break in the gate oxide of a field effect transistor. The gate is a square of polycrystalline silicon, approximately 1μm×1μm, on a silicon dioxide barrier which is about 17nm thick. The break in the oxide can occur anywhere within that square and is expected to be less than 100nm in diameter.

scholarly journals Haemophilus influenzae Meningitis Direct Diagnosis by Metagenomic Next-Generation Sequencing: A Case Report

Pathogens ◽  
2021 ◽  
Vol 10 (4) ◽  
pp. 461
Author(s):  
Madjid Morsli ◽  
Quentin Kerharo ◽  
Jeremy Delerce ◽  
Pierre-Hugues Roche ◽  
Lucas Troude ◽  
...  
Keyword(s):  
Next Generation Sequencing ◽  
Haemophilus Influenzae ◽  
Real Time ◽  
Real Time Pcr ◽  
Point Of Care ◽  
Next Generation ◽  
Oxford Nanopore ◽  
Sequence Encoding ◽  
Oxford Nanopore Technologies ◽  
Generation Sequencing

Current routine real-time PCR methods used for the point-of-care diagnosis of infectious meningitis do not allow for one-shot genotyping of the pathogen, as in the case of deadly Haemophilus influenzae meningitis. Real-time PCR diagnosed H. influenzae meningitis in a 22-year-old male patient, during his hospitalisation following a more than six-metre fall. Using an Oxford Nanopore Technologies real-time sequencing run in parallel to real-time PCR, we detected the H. influenzae genome directly from the cerebrospinal fluid sample in six hours. Furthermore, BLAST analysis of the sequence encoding for a partial DUF417 domain-containing protein diagnosed a non-b serotype, non-typeable H.influenzae belonging to lineage H. influenzae 22.1-21. The Oxford Nanopore metagenomic next-generation sequencing approach could be considered for the point-of-care diagnosis of infectious meningitis, by direct identification of pathogenic genomes and their genotypes/serotypes.

PERFORMANCE AT THE EDGE: GALLIUM ARSENIDE AND SILICON ICs FOR OPTICAL ELECTRONICS

1991 ◽  
Vol 02 (03) ◽  
pp. 147-162 ◽  
Author(s):  
ROBERT G. SWARTZ
Keyword(s):  
Gallium Arsenide ◽  
Optical Communication ◽  
Optical Communications ◽  
Integrated Circuit ◽  
High Performance ◽  
Compound Semiconductor ◽  
Performance Curve ◽  
Semiconductor Technology ◽  
Market Trends ◽  
Circuit Technology

Compound semiconductor technology is rapidly entering the mainstream, and is quickly finding its way into consumer applications where high performance is paramount. But silicon integrated circuit technology is evolving up the performance curve, and CMOS in particular is consuming ever more market share. Nowhere is this contest more clearly evident than in optical communications. Here applications demand performance ranging from a few hundreds of megahertz to multi-gigahertz, from circuits containing anywhere from tens to tens of thousands of devices. This paper reviews the high performance electronics found in optical communication applications from a technology standpoint, illustrating merits and market trends for these competing, yet often complementary IC technologies.

scholarly journals Design and Development of a 3dB Quadrature Patch Hybrid Coupler

2018 ◽  
Vol 7 (2.6) ◽  
pp. 217
Author(s):  
B Sekharbabu ◽  
K Narsimha Reddy ◽  
S Sreenu
Keyword(s):  
Integrated Circuit ◽  
High Frequency ◽  
Return Loss ◽  
Coupling Factor ◽  
Power Combiners ◽  
Measurement Results ◽  
Structure Simulation ◽  
Hybrid Coupler ◽  
Port Device ◽  
Circuit Technology

In this paper a -3 dB, 90-degreephase shift RF quadrature patch hybrid coupler is designed to operate at 2.4GHz. Hybrid coupler is a four-port device, that’s accustomed split a signaling with a resultant 90degrees’ section shift between output signals whereas maintaining high isolation between the output ports. The RF quadrature patch hybrid coupler is used in various radio frequency applications including mixers, power combiners, dividers, modulators and amplifiers. The desired hybrid coupler is designed using FR-4 substrate with 1.6mm height in High Frequency Structure Simulation (HFSS) and the same is fabricated and tested. The designed Hybrid coupler is examined in terms of parameters like insertion Loss, coupling factor and return Loss. The simulation and measurement results are compared. Major advantages of the RF quadrature patch hybrid couplers are that they are compatible with integrated circuit technology.

scholarly journals PCORI COVID-19 Scan: Next-Generation Sequencing Assays, Point-of-Care Breath Test (August 6-August 19, 2020)

2020 ◽  
Author(s):  
Damian Carlson ◽  
Christian Cuevas ◽  
Jennifer De Lurio ◽  
Andrew Furman ◽  
Randy Hulshizer ◽  
...  
Keyword(s):  
Next Generation Sequencing ◽  
Breath Test ◽  
Point Of Care ◽  
Next Generation ◽  
Generation Sequencing
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