Enhancement of Adhesion Between Cu Thin Film and Polyimide Modified by Ion Assisted Reaction

1997 ◽  
Vol 504 ◽  
Author(s):  
S. C. Choi ◽  
K. H. Kim ◽  
H-J. Jung ◽  
C. N. Whang ◽  
S. K. Koha
Keyword(s):  
Ion Irradiation ◽  
Polyimide Film ◽  
Wetting Angle ◽  
Free Energies ◽  
Polyimide Films ◽  
Oxygen Environment ◽  
X Ray ◽  
Oxygen Ion ◽  
Oxygen Gas ◽  
Cu Thin Film

ABSTRACTPolyimide films are modified by ion assisted reaction method using various ion beams in various gases environments. Amount of ion and blown gases rate were changed from 5 × 1014 to 1 × 1017 and from 0 to 8 sccm, respectively. Wetting angles between water and polyimide films modified by Ar+ ion without oxygen blowing decrease from 67° to 400° and surface free energies increase from 46 to 64 dyne/cm2. Wetting angle of polyimide films modified by Ar+ ion in an oxygen environment decreases to 12° and surface free energy increases to 72 dyne/cm2. The lowest wetting angle was obtained by oxygen ion irradiation in the oxygen gas environment and its value was 7°. In the case of polyimide film modified by Ar+ ions in an oxygen environment, the wetting angle increases up to 65° when it kept in air and that increases up to 46° when it kept in water after 5 day. In the case of polyimide film modified by O2+ ion in oxygen environment, however, the wetting angle of polyimide film dose not increase. X-ray photoelectron analysis shows that the chemical bonds between polyimide components are severed by ion irradiation and hydrophilic groups such as CO and C=O are formed by the reaction between newly formed radicals and blown oxygen. It was found that adhesion between Cu and polyimide modified by ion assisted reaction was improved. The main reason of the enhanced adhesion is due to the reaction between Cu and C-O or C=O groups formed by ion assisted reaction on the polyimide surface.

Ar+ ion irradiation in oxygen environment for improving wettability of polymethylmethacrylate

1996 ◽  
Vol 11 (11) ◽  
pp. 2933-2939 ◽  
Author(s):  
Seok-Keun Koh ◽  
Won-Kook Choi ◽  
Jun-Sik Cho ◽  
Seok-Kyun Song ◽  
Young-Man Kim ◽  
...  
Keyword(s):  
Chemical Reaction ◽  
Ion Irradiation ◽  
Ion Beam ◽  
Polymer Surface ◽  
Wetting Angle ◽  
Energetic Ions ◽  
Oxygen Ion ◽  
Deposited Metal ◽  
Oxygen Gas ◽  
Surface Changes

Ion irradiation with various oxygen flow rates has been carried out to improve the wettability of polymethylmethacrylate (PMMA) to water and to enhance the adhesion between Al and the polymer. Ar+ ion and oxygen ion were irradiated on the polymer, and amounts of ions were changed from 5 × 1014 Ar+/cm2 to 5 × 1016 Ar+/cm2 by a broad ion beam source. Oxygen gas from 0 ml/min to 7 ml/min was flowed near the polymer surface during the ion irradiation, and the energy of ions was changed from 500 eV to 1500 eV. The wetting angle was reduced from 68° to 49° with the Ar+ ion irradiation only at 1 keV energy, to 43° with the oxygen ion irradiation, and dropped to 8° with Ar+ ion irradiation with flowing 4 ml/min oxygen gas near the polymer surface. Changes of wetting angle with oxygen gas and Ar+ ion irradiation were explained by a two-step chemical reaction among polymer matrix, energetic ions, and oxygen gas. The effects of Ar+ ion and oxygen ion irradiation were explained by considering formation of hydrophilic groups due to a reaction between irradiated polymer chain by energetic ion irradiation and blown oxygen gas, and enhanced adhesion between Al and PMMA was explained by the formation of electron acceptor groups in polymer and electron donors in metal, and by the chemical reaction in the interface between irradiated polymer surface and deposited metal.

Preparation and Characterization Silver and Copper Layers on Polyimide Prepared by Electroless Copper Plating

2006 ◽  
Vol 947 ◽  
Author(s):  
Eun Sun Ji ◽  
Young Hwan Kim ◽  
Young Soo Kang
Keyword(s):  
Polyimide Film ◽  
Metallic Silver ◽  
Polyimide Films ◽  
Electroless Copper Plating ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force ◽  
Ag Particles ◽  
Plating Method ◽  
Surface Image

ABSTRACTAg particles were generated on Ag+-doped polyimide film by ion exchanging, followed by copper deposition using metallic silver particles as seeds. The Cu layers were coated on the surface of polyimide films by electroless plating method. The surface image and morphology of Cu layers on the polyimide films were characterized with scanning electron microscopy (SEM), and atomic force microscopy (AFM). The chemical composition on the PI film was investigated energy dispersive X-ray (EDX) spectrometer.

Reactive Ion Etching of the fluorinated polyimide film

1996 ◽  
Vol 427 ◽  
Author(s):  
Y. K. Lee ◽  
S. P. Murarka
Keyword(s):  
Flow Rate ◽  
Etch Rate ◽  
Gas Flow ◽  
Polyimide Film ◽  
Rf Plasma ◽  
Gas Composition ◽  
Polyimide Films ◽  
Hard Mask ◽  
Fluorinated Polyimide ◽  
Oxygen Gas

AbstractThe etch conditions affecting the etching of the fluorinated polyimide films in RF plasma using oxygen or fluorine-containing oxygen has been investigated. The effect of power, oxygen gas flow rate, and gas composition on the etch rate of fluorinated polyimide have been determined. The etch rate of the fluorinated polyimide increases linearly with the power and oxygen gas flow. The saturation at high oxygen flow rate indicates a saturation or steady state achieved at the polyimide-oxygen reaction interface. However, the etch rate increases when CF4 is added to oxygen, up to about 10% CF4 in O2, and then decreases to a smaller and CF4 concentration independent value. The etch selectivity of hard mask against fluorinated polyimide has been determined. The PECVD silicon nitride and PETEOS are found to be excellent hard mask for pattering these polyimides. The trench profile of the polyimide film also has been examined by patterning and etching the different trench sizes in fluorinated polyimide. It is concluded that this fluorinated polyimide can be etched with oxygen or fluorine containing oxygen plasma.

Surface Modification of Polytetrafluoroethylene by Ar+ Irradiation for Improving Adhesion to other Materials

1996 ◽  
Vol 438 ◽  
Author(s):  
S. K. Koh ◽  
S. C. Park ◽  
J. W. Seok ◽  
S. C. Choi ◽  
W. K. Choi ◽  
...  
Keyword(s):  
Ion Irradiation ◽  
Ion Beam ◽  
Polymer Surface ◽  
Wetting Angle ◽  
Ion Beam Irradiation ◽  
Hydrophilic Group ◽  
Interfacial Chemical Reaction ◽  
Oxygen Gas ◽  
Argon Ion ◽  
Adhesive Cement

AbstractIon Irradiation on polytetrafluoroethylene(PTFE) has been carried out to improve adhesion to metal and to adhesive cement. Argon ion was irradiated on the polymer, and amount of Ar+ was changed from 1014 ions/cm2 to l×1017 ions/cm2 at 1 keV, and 4 ml/min of oxygen gas was flowed near the polymer surface during the ion irradiation. Wetting angle was changed from 100 degree to 70 – 150 degree depending on the ion beam condition. The changes of wetting angle and effects of Ar+ irradiation in oxygen environment were explained in a view of surface morphology due to the ion beam irradiation onto PTFE and formation of hydrophilic group due to a reaction between irradiated polymer chain and the blown oxygen. Strongly enhanced adhesions were explained by interlock mechanism, formation of electron acceptor groups on the modified PTFE, and interfacial chemical reaction between the irradiated surface and the deposited materials.

Enhancing adhesion between metals or epoxy and polytetrafluoroethylene by ion assisted reaction

1998 ◽  
Vol 13 (5) ◽  
pp. 1363-1367 ◽  
Author(s):  
S. K. Koh ◽  
J. W. Seok ◽  
S. C. Choi ◽  
W. K. Choi ◽  
H. J. Jung
Keyword(s):  
Ion Irradiation ◽  
Ion Beam ◽  
Polymer Surface ◽  
Wetting Angle ◽  
Beam Irradiation ◽  
Ion Beam Irradiation ◽  
Ptfe Surface ◽  
Hydrophilic Group ◽  
Oxygen Gas ◽  
Argon Ions

Ion irradiation on polytetrafluoroethylene (PTFE) has been carried out to improve adhesions to metals and to adhesive cements. Argon ions were irradiated on the polymer, by varying the amount of Ar+ from 1 × 1014 ions/cm2 to 1 × 1017 ions/cm2 at 1 keV, and 4 ml/min of oxygen gas flowed near the polymer surface during the ion irradiation. The wetting angle of water on the PTFE surface was changed from 100° to 70–150°, depending on the ion beam condition. The changes of the wetting angle and effects of Ar+ irradiation in oxygen environment were explained by the changes in surface morphology due to the ion beam irradiation onto PTFE, and formation of a hydrophilic group due to a reaction between the irradiated polymer chain and the blown oxygen. Strongly enhanced adhesion is explained by interlock mechanism, formation of electron acceptor groups on the modified PTFE, and interfacial chemical reactions between the irradiated surface and the deposited materials.

Characterization of Fluorinated Polyimide Films

1992 ◽  
Vol 264 ◽  
Author(s):  
Pradnya V. Nagarkar ◽  
Jiong Ping Lu ◽  
David Volfson ◽  
Klavs F. Jensen ◽  
Stephen D. Senturia
Keyword(s):  
Photoelectron Spectroscopy ◽  
Polyimide Film ◽  
Binding Energies ◽  
Polyimide Films ◽  
Chemical Modifications ◽  
X Ray ◽  
Fluorinated Polyimide ◽  
Peak Assignment ◽  
Good Agreement

Abstract:X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy (FTIR) have been used to characterize the polyimide film based on 4,4′ hexafluoro-isopropylidene -bis pthalic anhydride (HFDA) and 4,4′ -bis (4-aminophenoxy) biphenyl (APBP). Films of varying thicknesses made from diluted precursors were studied by IR and XPS. An elemental analysis and a tentative peak assignment for C 1s in XPS is presented. The HFDA-APBP thick films are stoichiometric in composition and binding energies are in good agreement with data on hexafluorodianhydride-oxydianiline (HFDA-ODA). For thinner films, certain chemical modifications were observed at high cure temperatures.

Chemical Reaction Between Polymers (Pc, Pmma, and Pet) and Oxygen Gas During Ar+ Irradiation

1995 ◽  
Vol 396 ◽  
Author(s):  
Sung-Chul Park ◽  
Hyung-Jin Jung ◽  
Seok-Keun Koh
Keyword(s):  
Contact Angle ◽  
Chemical Reaction ◽  
Photoelectron Spectroscopy ◽  
Contact Angle Measurement ◽  
Angle Measurement ◽  
Peak Ratio ◽  
Xps Spectra ◽  
Oxygen Environment ◽  
X Ray ◽  
Oxygen Gas

AbstractA surface of PC, PMMA, and PET samples irradiated with Ar+ ion of 1 keV energy with and without oxygen environment was investigated by contact angle measurement and x-ray photoelectron spectroscopy (XPS) spectra. Contact angle of water droplets on the irradiated surface of the polymers decreased and remained almost constant with increasing Ar+ irradiation without oxygen. However, when the polymers were irradiated under oxygen environment, the contact angle markedly decreased with increasing ion dose upto 1016 ions/cm2. XPS results show that, after Ar+ irradiation under oxygen, hydrophilic groups were developed on PC, PMMA, and PET. The peak ratio (O/C) of PET irradiated without oxygen decreased with increasing ion dose, whereas that of PET irradiated under oxygen increased with ion dose upto 1016 ions/cm2

Changes of Wettability and Surface Energy of Polymer by keV Ar+ Ion Irradiation

1995 ◽  
Vol 396 ◽  
Author(s):  
Jun-Sik Cho ◽  
Won-Kook Choi ◽  
Ki Hyun Yoon ◽  
Hyung-Jin Jung ◽  
Seok-Keun Koh
Keyword(s):  
Surface Roughness ◽  
Surface Energy ◽  
Photoelectron Spectroscopy ◽  
Ion Irradiation ◽  
Oxygen Flow Rate ◽  
Mean Square ◽  
X Ray ◽  
Atomic Force ◽  
Hydrophilic Group ◽  
Oxygen Gas

AbstractSurface modification of polycarbonate(PC) was performed to improve the wettability by Ar+ ion irradiation with 1 keV energy in oxygen environment. The ion dose ranged from 5 x 1014 to 5 x 1016 ions/cm2 and oxygen flow rate was also varied from 0 to 6 sccm(ml/min.). Contact angle was not much decreased from 78° to 48° for water and from 63° to 32° for formamide by Ar+ ion irradiation without oxygen gas, but largely reduced to 12° for water and to 8° for formamide as Ar+ ion irradiation with 4 seem oxygen gas. Surface energy of modified PC surface which was irradiated with oxygen gas was more increased than that of PC surface irradiated without oxygen gas. It is evident that the increase of surface energy for PC modified with oxygen gas is due to hydrophilic group which result from the chemical reaction between PC surface and oxygen gas. From X-ray photoelectron spectroscopy(XPS) analysis, the newly formed hydrophilic group is identified as hydrophilic C=0 bond, and atomic force microscope(AFM), it is found that the root mean square of surface roughness is changed from 14 Å to 22 ∼ 26 Å for Ar+ ion irradiation only and 26 ∼ 30 Å for Ar+ ion irradiation with 4 seem oxygen gas. Therefore wettability of PC surface is much more affected by newly formed hydrophilic group than surface roughness in keV energy Ar+ ion irradiation.

scholarly journals Structural and Enhanced Optical Properties of Stabilized γ‒Bi2O3 Nanoparticles: Effect of Oxygen Ion Vacancies

Nanomaterials ◽  
2020 ◽  
Vol 10 (6) ◽  
pp. 1023 ◽  
Author(s):  
Ashish Chhaganlal Gandhi ◽  
Chia-Liang Cheng ◽  
Sheng Yun Wu
Keyword(s):  
Room Temperature ◽  
Excess Oxygen ◽  
Ambient Atmosphere ◽  
Photoluminescence Spectra ◽  
X Ray Diffraction ◽  
X Ray ◽  
Band Emission ◽  
Oxygen Ion ◽  
Integrated Intensity ◽  
Effect Of Oxygen

We report the synthesis of room temperature (RT) stabilized γ–Bi2O3 nanoparticles (NPs) at the expense of metallic Bi NPs through annealing in an ambient atmosphere. RT stability of the metastable γ–Bi2O3 NPs is confirmed using synchrotron radiation powder X-ray diffraction and Raman spectroscopy. γ–Bi2O3 NPs exhibited a strong red-band emission peaking at ~701 nm, covering 81% integrated intensity of photoluminescence spectra. Our findings suggest that the RT stabilization and enhanced red-band emission of γ‒Bi2O3 is mediated by excess oxygen ion vacancies generated at the octahedral O(2) sites during the annealing process.

Uranium–molybdenum nuclear fuel plates behaviour under heavy ion irradiation: An X-ray diffraction analysis

2009 ◽  
Vol 385 (2) ◽  
pp. 449-455 ◽  
Author(s):  
H. Palancher ◽  
N. Wieschalla ◽  
P. Martin ◽  
R. Tucoulou ◽  
C. Sabathier ◽  
...  
Keyword(s):  
Diffraction Analysis ◽  
Nuclear Fuel ◽  
Ion Irradiation ◽  
Heavy Ion ◽  
X Ray Diffraction ◽  
X Ray ◽  
Heavy Ion Irradiation
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