Reactive Ion Etching of the fluorinated polyimide film

1996 ◽  
Vol 427 ◽  
Author(s):  
Y. K. Lee ◽  
S. P. Murarka
Keyword(s):  
Flow Rate ◽  
Etch Rate ◽  
Gas Flow ◽  
Polyimide Film ◽  
Rf Plasma ◽  
Gas Composition ◽  
Polyimide Films ◽  
Hard Mask ◽  
Fluorinated Polyimide ◽  
Oxygen Gas

AbstractThe etch conditions affecting the etching of the fluorinated polyimide films in RF plasma using oxygen or fluorine-containing oxygen has been investigated. The effect of power, oxygen gas flow rate, and gas composition on the etch rate of fluorinated polyimide have been determined. The etch rate of the fluorinated polyimide increases linearly with the power and oxygen gas flow. The saturation at high oxygen flow rate indicates a saturation or steady state achieved at the polyimide-oxygen reaction interface. However, the etch rate increases when CF4 is added to oxygen, up to about 10% CF4 in O2, and then decreases to a smaller and CF4 concentration independent value. The etch selectivity of hard mask against fluorinated polyimide has been determined. The PECVD silicon nitride and PETEOS are found to be excellent hard mask for pattering these polyimides. The trench profile of the polyimide film also has been examined by patterning and etching the different trench sizes in fluorinated polyimide. It is concluded that this fluorinated polyimide can be etched with oxygen or fluorine containing oxygen plasma.

Enhancement of Adhesion Between Cu Thin Film and Polyimide Modified by Ion Assisted Reaction

1997 ◽  
Vol 504 ◽  
Author(s):  
S. C. Choi ◽  
K. H. Kim ◽  
H-J. Jung ◽  
C. N. Whang ◽  
S. K. Koha
Keyword(s):  
Ion Irradiation ◽  
Polyimide Film ◽  
Wetting Angle ◽  
Free Energies ◽  
Polyimide Films ◽  
Oxygen Environment ◽  
X Ray ◽  
Oxygen Ion ◽  
Oxygen Gas ◽  
Cu Thin Film

ABSTRACTPolyimide films are modified by ion assisted reaction method using various ion beams in various gases environments. Amount of ion and blown gases rate were changed from 5 × 1014 to 1 × 1017 and from 0 to 8 sccm, respectively. Wetting angles between water and polyimide films modified by Ar+ ion without oxygen blowing decrease from 67° to 400° and surface free energies increase from 46 to 64 dyne/cm2. Wetting angle of polyimide films modified by Ar+ ion in an oxygen environment decreases to 12° and surface free energy increases to 72 dyne/cm2. The lowest wetting angle was obtained by oxygen ion irradiation in the oxygen gas environment and its value was 7°. In the case of polyimide film modified by Ar+ ions in an oxygen environment, the wetting angle increases up to 65° when it kept in air and that increases up to 46° when it kept in water after 5 day. In the case of polyimide film modified by O2+ ion in oxygen environment, however, the wetting angle of polyimide film dose not increase. X-ray photoelectron analysis shows that the chemical bonds between polyimide components are severed by ion irradiation and hydrophilic groups such as CO and C=O are formed by the reaction between newly formed radicals and blown oxygen. It was found that adhesion between Cu and polyimide modified by ion assisted reaction was improved. The main reason of the enhanced adhesion is due to the reaction between Cu and C-O or C=O groups formed by ion assisted reaction on the polyimide surface.

Band gap modulation of ZnTe1-xOx alloy film by control of oxygen gas flow rate during reactive magnetron sputtering

2013 ◽  
Vol 103 (26) ◽  
pp. 263901 ◽  
Author(s):  
Dong Uk Lee ◽  
Seon Pil Kim ◽  
Kyoung Su Lee ◽  
Sang Woo Pak ◽  
Eun Kyu Kim
Keyword(s):  
Magnetron Sputtering ◽  
Band Gap ◽  
Flow Rate ◽  
Gas Flow ◽  
Alloy Film ◽  
Reactive Magnetron Sputtering ◽  
Reactive Magnetron ◽  
Gas Flow Rate ◽  
Oxygen Gas ◽  
Band Gap Modulation

Plasma Etching of Copper Films Using IR Light Irradiation

1994 ◽  
Vol 337 ◽  
Author(s):  
N. Hosoi ◽  
Y. Ohshita
Keyword(s):  
Low Temperature ◽  
Flow Rate ◽  
Plasma Etching ◽  
Etch Rate ◽  
Gas Flow ◽  
Light Irradiation ◽  
Copper Films ◽  
Gas Flow Rate ◽  
Line Patterns ◽  
Ir Light

ABSTRACTCopper films are etched at a low temperature of 60 °C using a Cl2 plasma etching method with IR light irradiation. The etch rate is as high as 1 μm/min. The anisotropic Cu line patterns are obtained independent of the Cl2 gas flow rate and the etching pressure conditions. Moreover, there is no corrosion on the etched sample.

Microstructures and Hardness of Silver Alloys after Internal Oxidation Process

2011 ◽  
Vol 194-196 ◽  
pp. 1217-1220
Author(s):  
Kessaraporn Wathanyu ◽  
Siriporn Rojananan
Keyword(s):  
Internal Oxidation ◽  
Flow Rate ◽  
Gas Flow ◽  
Vickers Microhardness ◽  
Oxidation Process ◽  
Dendritic Structure ◽  
Gas Flow Rate ◽  
Silver Alloys ◽  
Oxygen Gas ◽  
Equiaxed Grains

The aim of this paper is to study the microstructures and hardness of silver alloys after internal oxidation process. The Ag-5Sn and Ag-5Cu alloys were prepared by melting and cast into ingots and then they were internal oxidized at the temperature range from 550 to 750°C, for 24 hours under oxidizing atmosphere by feeding oxygen gas with the pressure of 1 kg/cm2, gas flow rate 5 l/min and cooled in the furnace. The microstructures, Vickers microhardness and phase compositions were investigated. The results showed that the microstructures of the based metal revealed dendritic structure and they were transformed to equiaxed grains after internal oxidation. The internally oxidized layer of Ag-5Sn alloy is SnO2 with the hardness about 106-133 HV. The internally oxidized layer of Ag-5Cu alloy is CuO with the hardness about 65-73 HV.

scholarly journals Purification of the gas after pyrolysis in coupled plasma-catalytic system

2017 ◽  
Vol 19 (4) ◽  
pp. 94-98 ◽  
Author(s):  
Michał Młotek ◽  
Bogdan Ulejczyk ◽  
Joanna Woroszył ◽  
Irmina Walerczak ◽  
Krzysztof Krawczyk
Keyword(s):  
Catalytic System ◽  
Flow Rate ◽  
Gas Flow ◽  
Homogeneous System ◽  
Discharge Power ◽  
Gas Composition ◽  
Gas Flow Rate ◽  
Gliding Discharge ◽  
The One ◽  
Pyrolysis Of Biomass

Abstract Gliding discharge and coupled plasma-catalytic system were used for toluene conversion in a gas composition such as the one obtained during pyrolysis of biomass. The chosen catalyst was G-0117, which is an industrial catalyst for methane conversion manufactured by INS Pulawy (Poland). The effects of discharge power, initial concentration of toluene, gas flow rate and the presence of the bed of the G-0117 catalyst on the conversion of C7H8, a model tars compounds were investigated. Conversion of coluene increases with discharge power and the highest one was noted in the coupled plasma-catalytic system. It was higher than that in the homogeneous system of gliding discharge. When applying a reactor with reduced G-0117 and CO (0.15 mol%), CO2 (0.15 mol%), H2 (0.30 mol%), N2 (0.40 mol%), 4000 ppm of toluene and gas flow rate of 1.5 Nm3/h, the conversion of toluene was higher than 99%. In the coupled plasma-catalytic system with G-0117 methanation of carbon oxides was observed.

Sign in / Sign up

Export Citation Format

Share Document