Thermal And Mechanical Properties Of Polyimide Films

1995 ◽  
Vol 381 ◽  
Author(s):  
S. T. Chen
Keyword(s):  
Mechanical Properties ◽  
Structural Integrity ◽  
Polyimide Film ◽  
Thermal And Mechanical Properties ◽  
Polyimide Films ◽  
Low Dielectric ◽  
Semiconductor Chip ◽  
Thermal Expansion Coefficients ◽  
Microelectronic Devices ◽  
Processing Cost

AbstractIn recent years, polyimide film has become a commonly used insulator for microelectronic devices including advanced semiconductor chip and high density packaging. It has the advantages of low dielectric constant, thermal stability and low processing cost. In general, it is important to understand both the thermal and mechanical properties of a microelectronic material. Thermal and mechanical properties play very important roles in terms of determining the device structural integrity. Mismatch of material properties could cause feasibility and reliability problems. These properties are also essential for mechanical stress and thermal stress modeling studies. Biphenyldianhydride-Phenylenediamine (BPDA-PDA) and Pyromellitic Dianhydride-Oxydianiline (PMDA-ODA) are two commonly used polyimide films in electronic industry. Their thermal expansion coefficients and mechanical properties were studied and reported here.

scholarly journals Flame-retardant MXene/Polyimide Film with Outstanding Thermal and Mechanical Properties Based on the Secondary Orientation Strategy

2021 ◽  
Author(s):  
Yue Zhu ◽  
Qingyu Peng ◽  
Haowen Zheng ◽  
Fuhua Xue ◽  
Pengyang Li ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Transition Metal ◽  
Mechanical Performance ◽  
Polyimide Film ◽  
Polymeric Films ◽  
Two Dimensional ◽  
Thermal And Mechanical Properties ◽  
Metal Carbides ◽  
Transition Metal Carbides

With the development of multifunction and miniaturization in modern electronics, polymeric films with strong mechanical performance and high thermal conductivity are urgently needed. Two-dimensional transition metal carbides and nitrides (MXenes)...

Dense γ-Alon Materials Derived from SHS Synthesized Powders

2006 ◽  
Vol 45 ◽  
pp. 1052-1057 ◽  
Author(s):  
Dariusz Zientara ◽  
Mirosław M. Bućko ◽  
Jerzy Lis
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Aluminium Nitride ◽  
Pure Nitrogen ◽  
Low Dielectric ◽  
High Temperature Mechanical Properties ◽  
Thermal Expansion Coefficients ◽  
High Temperature Reaction ◽  
Infrared Wavelengths ◽  
Aluminium Oxynitride

Dense polycrystalline aluminium oxynitride with spinel structure, γ-alon, is noted for its excellent thermal properties, high-temperature mechanical properties, low dielectric constant, thermal expansion coefficients and intrinsic transparency extending from ultraviolet to mid-infrared wavelengths. The conventional way for synthesis of γ-alon powder is high-temperature reaction of aluminium nitride and corundum in pure nitrogen or a vacuum. The dense materials are made by reactive pressureless sintering or hot-pressing of a powder compact. This work is focused on preparation of γ-alon materials derived from SHS synthesized powders. The powders for sintering were synthesized from mixtures of aluminium and corundum powders of different proportions. The products of the SHS synthesis were composed mostly of γ-alon and aluminium nitride with small amount of non-reacted substrates. Ground powders were hot-pressed at 1750, 1850 and 1950°C for 1 h under 25 MPa in nitrogen flow. Such procedure allowed dense material composed of pure γ-alon with good mechanical properties to obtain.

scholarly journals Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion

Crystals ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 1383
Author(s):  
Panpan Zhang ◽  
Lize Zhang ◽  
Ke Zhang ◽  
Jiupeng Zhao ◽  
Yao Li
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Phase Inversion ◽  
Polyimide Film ◽  
Porous Film ◽  
Breakdown Field ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Dielectric Performance ◽  
Fluorinated Graphene

Due to the high value of its dielectric constant, polyimide does not meet the requirements of the development of integrated circuits and high-frequency printed circuits. The development of novel low dielectric constant polyimide materials for the preparation of flexible copper clad laminates is of theoretical and practical significance in the application of polyimide for 5G communications. In this work, different fluorinated graphene/polyamic acids (FG/PAA) were used as the precursor, and the porous polyimide film was successfully prepared by phase inversion. The dielectric constant of the porous polyimide film is relatively low, being less than 1.7. When the content of fluorinated graphene is 0.5 wt%, the overall dielectric performance of the porous film is the best, with a dielectric constant of 1.56 (10 kHz) and a characteristic breakdown field strength of 56.39 kV/mm. In addition, the mechanical properties of the film are relatively poor, with tensile strengths of 13.87 MPa (0.2 wt%), 13.61 MPa (0.5 wt%), and 6.25 MPa (1.0 wt%), respectively. Therefore, further improving the breakdown resistance and mechanical properties of the porous film is essential for the application of porous ultra-low dielectric polyimide materials.

scholarly journals Enhancement of the Mechanical Properties of Polyimide Film by Microwave Irradiation

Polymers ◽  
2019 ◽  
Vol 11 (3) ◽  
pp. 477 ◽  
Author(s):  
Ju-Young Choi ◽  
Seung-Won Jin ◽  
Dong-Min Kim ◽  
In-Ho Song ◽  
Kyeong-Nam Nam ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Irradiation Time ◽  
Polyimide Film ◽  
Amic Acid ◽  
Polyimide Films ◽  
Inorganic Substance ◽  
Short Irradiation Time ◽  
Green Approach ◽  
Thermal Imidization ◽  
Mw Irradiation

Polyimide films have conventionally been prepared by thermal imidization of poly(amic acid)s (PAAs). Here we report that the improvement of tensile strength while increasing (or maintaining) film flexibility of polyimide films was accomplished by simple microwave (MW) irradiation of the PAAs. This improvement in mechanical properties can be attributed to the increase in molecular weight of the polyimides by MW irradiation. Our results show that the mechanical properties of polyimide films can be improved by MW irradiation, which is a green approach that requires relatively low MW power, very short irradiation time, and no incorporation of any additional inorganic substance.

Nanoporous Polyimide Films from Polyimide-Aliphatic Polyester or Polyimide-Aliphatic Polycarbonate Copolymers

1996 ◽  
Vol 431 ◽  
Author(s):  
K. R. Carter ◽  
J. L. Hedrick ◽  
R. Richter ◽  
P. T. Furuta ◽  
D. Mecerreyes ◽  
...  
Keyword(s):  
Ring Opening ◽  
Dielectric Constants ◽  
Foam Formation ◽  
Aliphatic Polyester ◽  
Trimethylene Carbonate ◽  
Polyimide Films ◽  
Low Dielectric ◽  
Microelectronic Devices ◽  
Aliphatic Polycarbonate ◽  
Film Dielectric

AbstractWe have explored polyimide foams created using a block copolymer approach as part of our research efforts to obtain thin film dielectric layers with very low dielectric constants for use in microelectronic devices. In these systems the pore sizes are in the nanometer range thus the term “nanofoam”, The polyimide foams are prepared from phase separated block copolymers consisting of thermally stabile and thermally labile blocks, the latter being the dispersed phase. Foam formation is effected by thermolysis of the labile block leaving pores the size and shape corresponding to the initial copolymer morphology. Polyimide nanofoams generated from thermolysis of polyimidealiphatic polyester and polyimide-aliphatic polycarbonate copolymers were investigated. The aliphatic co-blocks were synthesized by ring opening polymerization of the cyclic monomers, such as E-caprolactone, valerolactone, trimethylene carbonate, and L-lactide. The aliphatic blocks were designed in such a way as to allow for incorporation into polyimide copolymers. The foams were characterized by a variety of techniques including, TEM, SAXS, WAXD, DMTA, density and refractive index measurements.

An Interesting Result of Dielectric Property for Novel Polyimides with Fluorene Groups

2010 ◽  
Vol 663-665 ◽  
pp. 511-514 ◽  
Author(s):  
Yuan Yuan ◽  
Bing Xie ◽  
Yu Wang
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Dielectric Property ◽  
Dielectric Constants ◽  
The Other ◽  
Polyimide Films ◽  
Low Dielectric ◽  
High Dielectric ◽  
Biphenyltetracarboxylic Dianhydride

A series of polyimide thin films were prepared successfully based on bis[3,5-dimethyl-4- (4-aminophenoxy)phenyl]methane （BDAPM）, 9,9-bis（4-（4-aminophenoxy）phenyl）fluorene (BAOFL) and different dianhydrides. And an interesting result of dielectric property for polyimide thin films was found that the polyimide thin film prepared with 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) exhibited high dielectric constants of 5.7 at 1MHz. Conversely, the other polyimides possessing fluorene groups showed low dielectric constants. The structures and the mechanical properties of polyimide films also proved the reason for results of dielectric properties.

Effect of Alkali Treatment on the Mechanical Property of Polyimide Film

2017 ◽  
Vol 744 ◽  
pp. 364-369 ◽  
Author(s):  
Ming Yu Zhang ◽  
Li Zhu Liu ◽  
K.S. Hui ◽  
K.N. Hui
Keyword(s):  
Mechanical Properties ◽  
Ion Exchange ◽  
Treatment Time ◽  
Alkali Treatment ◽  
Polyimide Film ◽  
Polyimide Films ◽  
Future Studies ◽  
Polyimide Composites ◽  
First Time ◽  
Better Than

Polyimide films treated with an alkali and ion exchange undergo surface-confined hydrolysis to produce polyimide composites. On the other hand, it is unclear what impact this method has on the mechanical properties of PI films. This paper reports the effects of the mechanical properties of PI films exposed to an alkali (KOH) solution with different treatment time. The mechanical properties of the re-cycloimidization PI films were improved when the proper initial KOH treatment time was used. The reason might be that PI could effectively reduce the formation of the shear zone to cracks due to the increase in ductility after the proper KOH treatment and more ductile PI chains led to re-orientation at the drawing process. Therefore, the strength and elongation of the re-cycloimidization PI films were better than those of the pristine PI films. This study focused on the effects of the KOH treatment on the mechanical properties of the PI film for the first time and proposed a mechanism to explain the reason that the appropriate time of KOH treatment can enhance the mechanical properties. The results presented here can provide guidelines for preparing composite PI films via ion-exchange by the proper KOH treatment time in future studies.

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