Photopolymerizable liquid encapsulants for microelectronic devices: Thermal and mechanical properties of systems with reduced in-mold cure times

2001 ◽  
Vol 81 (14) ◽  
pp. 3449-3461 ◽  
Author(s):  
Kiran K. Baikerikar ◽  
Alec B. Scranton
Keyword(s):  
Mechanical Properties ◽  
Thermal And Mechanical Properties ◽  
Microelectronic Devices

Thermal And Mechanical Properties Of Polyimide Films

1995 ◽  
Vol 381 ◽  
Author(s):  
S. T. Chen
Keyword(s):  
Mechanical Properties ◽  
Structural Integrity ◽  
Polyimide Film ◽  
Thermal And Mechanical Properties ◽  
Polyimide Films ◽  
Low Dielectric ◽  
Semiconductor Chip ◽  
Thermal Expansion Coefficients ◽  
Microelectronic Devices ◽  
Processing Cost

AbstractIn recent years, polyimide film has become a commonly used insulator for microelectronic devices including advanced semiconductor chip and high density packaging. It has the advantages of low dielectric constant, thermal stability and low processing cost. In general, it is important to understand both the thermal and mechanical properties of a microelectronic material. Thermal and mechanical properties play very important roles in terms of determining the device structural integrity. Mismatch of material properties could cause feasibility and reliability problems. These properties are also essential for mechanical stress and thermal stress modeling studies. Biphenyldianhydride-Phenylenediamine (BPDA-PDA) and Pyromellitic Dianhydride-Oxydianiline (PMDA-ODA) are two commonly used polyimide films in electronic industry. Their thermal expansion coefficients and mechanical properties were studied and reported here.

Polyamides containing a biorenewable aromatic monomer based on coumalate esters: from synthesis to evaluation of the thermal and mechanical properties

2021 ◽  
Vol 12 (16) ◽  
pp. 2379-2388
Author(s):  
Jules Stouten ◽  
Aleksandra A. Wróblewska ◽  
Glenn Grit ◽  
Jurrie Noordijk ◽  
Bert Gebben ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Propionic Acid ◽  
Terephthalic Acid ◽  
Thermal And Mechanical Properties ◽  
Aromatic Polyamides ◽  
Aromatic Monomer

A new biobased alternative for terephthalic acid (TPA) in (semi-)aromatic polyamides is proposed, namely 4-carboxybenzene propionic acid (4CBPA).

scholarly journals Thermal and mechanical properties of epoxy resin reinforced with modified iron oxide nanoparticles

2021 ◽  
pp. 50533
Author(s):  
Yasmine N. Baghdadi ◽  
Lucia Youssef ◽  
Kamal Bouhadir ◽  
Mohammad Harb ◽  
Samir Mustapha ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Iron Oxide ◽  
Epoxy Resin ◽  
Iron Oxide Nanoparticles ◽  
Oxide Nanoparticles ◽  
Thermal And Mechanical Properties

scholarly journals Effect of Organic Modifier Types on the Physical–Mechanical Properties and Overall Migration of Post-Consumer Polypropylene/Clay Nanocomposites for Food Packaging

Polymers ◽  
2021 ◽  
Vol 13 (9) ◽  
pp. 1502
Author(s):  
Eliezer Velásquez ◽  
Sebastián Espinoza ◽  
Ximena Valenzuela ◽  
Luan Garrido ◽  
María José Galotto ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Food Packaging ◽  
Clay Nanocomposites ◽  
Organic Modifier ◽  
Thermal And Mechanical Properties ◽  
Chemical Safety ◽  
Elongation At Break ◽  
Fatty Food ◽  
Recycled Plastics ◽  
Thermal Stability Of

The deterioration of the physical–mechanical properties and loss of the chemical safety of plastics after consumption are topics of concern for food packaging applications. Incorporating nanoclays is an alternative to improve the performance of recycled plastics. However, properties and overall migration from polymer/clay nanocomposites to food require to be evaluated case-by-case. This work aimed to investigate the effect of organic modifier types of clays on the structural, thermal and mechanical properties and the overall migration of nanocomposites based on 50/50 virgin and recycled post-consumer polypropylene blend (VPP/RPP) and organoclays for food packaging applications. The clay with the most hydrophobic organic modifier caused higher thermal stability of the nanocomposites and greater intercalation of polypropylene between clay mineral layers but increased the overall migration to a fatty food simulant. This migration value was higher from the 50/50 VPP/RPP film than from VPP. Nonetheless, clays reduced the migration and even more when the clay had greater hydrophilicity because of lower interactions between the nanocomposite and the fatty simulant. Conversely, nanocomposites and VPP/RPP control films exhibited low migration values in the acid and non-acid food simulants. Regarding tensile parameters, elongation at break values of PP film significantly increased with RPP addition, but the incorporation of organoclays reduced its ductility to values closer to the VPP.

scholarly journals Thermal and mechanical properties of investment casting pattern material based on paraffin wax fortified with LLDPE and filled with PMMA

2020 ◽  
Author(s):  
Robert Kimutai Tewo ◽  
Hilary Limo Rutto ◽  
Walter Wilhelm Focke ◽  
Shatish Ramjee ◽  
Tumisang Seodigeng
Keyword(s):  
Mechanical Properties ◽  
Investment Casting ◽  
Paraffin Wax ◽  
Thermal And Mechanical Properties
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