High-Density, High-Speed Connectors Based on Flexible Etched Circuits

1993 ◽  
Vol 323 ◽  
Author(s):  
David B. Wrisley

AbstractWith advances in semiconductor technology straining the ability of packaging to keep pace, conventional electrical connectors cannot always meet emerging requirements in interconnection density and signal transmission speeds.Connectors using flexible etched circuits (FEC) can provide interconnection densities of up to 200 lines per inch and high transmission quality for signals with 250-picosecond risetimes. A practical connector design meeting these density and speed goals depends on careful consideration of connector and system tolerances, ease of application, manufacturability, and material properties.This paper discusses a practical approach to an FEC-based connector and the influence of material properties on connector performance.

2013 ◽  
Vol 760-762 ◽  
pp. 320-324
Author(s):  
Shi Lei Zhou ◽  
Ya Lin Guan ◽  
Xin Kun Tang

High-speed signal connector has become a key factor of the signal transmission quality in telecommunications and data communications system. Signal integrity of connector is an inevitable problem. This paper based on the theory of differential transmission lines and Multimode S-Parameters, analyzed the USB3.0 connector signal integrity. And use 3D simulation software CST to build model and analyze the relationship of signal integrity and connectors geometry.


2014 ◽  
Vol 2014 ◽  
pp. 1-11 ◽  
Author(s):  
Huiyong Li ◽  
Hongxu Jiang ◽  
Bo Li ◽  
Miyi Duan

The signal integrity of the circuit, as one of the important design issues in high-speed digital system, is usually seriously affected by the signal reflection due to impedance mismatch in the DDR3 bus. In this paper, a novel optimization method is proposed to optimize impedance mismatch and reduce the signal refection. Specifically, by applying the via parasitic, an equivalent model of DDR3 high-speed signal transmission, which bases on the match between the on-die-termination (ODT) value of DDR3 and the characteristic impedance of the transmission line, is established. Additionally, an improved particle swarm optimization algorithm with adaptive perturbation is presented to solve the impedance mismatch problem (IPSO-IMp) based on the above model. The algorithm dynamically judges particles’ state and introduces perturbation strategy for local aggregation, from which the local optimum is avoided and the ability of optimization-searching is activated. IPSO-IMp achieves higher accuracy than the standard algorithm, and the speed increases nearly 33% as well. Finally, the simulation results verify that the solution obviously decreases the signal reflection, with the signal transmission quality increasing by 1.3 dB compared with the existing method.


2013 ◽  
Vol 760-762 ◽  
pp. 298-301
Author(s):  
Zi Jing Zhong ◽  
Guang Dong Liu ◽  
Ying Yu ◽  
Chao Chen

To improve the quality of the signal transmission and increase the bandwidth in the photoelectric tracking equipment, a kind of mixed transmission design of low-speed digital signals and high-speed digital video signals in use of optical fiber has been carried out. And in the system the high-speed parallel and serial transmission cells realizes the serial and de-serial of the digital video signals in use of the Agilent chip of HDMP-1032/1034, the optical fiber transmits the high-speed optical signals as the transmission media. The signal transmission bandwidth can be up to over 500MHz in use of optical fiber, otherwise the signal transmission quality and environment adaptability has been improved greatly.


2007 ◽  
Vol 127 (10) ◽  
pp. 1033-1042
Author(s):  
Tamio Okutani ◽  
Nobuyuki Nakamura ◽  
Hisato Araki ◽  
Shouji Irie ◽  
Hiroki Osa ◽  
...  
Keyword(s):  

Author(s):  
J. Gallia ◽  
R. Landers ◽  
Ching-Hao Shaw ◽  
T. Blake ◽  
W. Banzhaf
Keyword(s):  

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