scholarly journals Reflection Reduction on DDR3 High-Speed Bus by Improved PSO

2014 ◽  
Vol 2014 ◽  
pp. 1-11 ◽  
Author(s):  
Huiyong Li ◽  
Hongxu Jiang ◽  
Bo Li ◽  
Miyi Duan
Keyword(s):  
High Speed ◽  
Signal Transmission ◽  
Characteristic Impedance ◽  
Optimization Method ◽  
Equivalent Model ◽  
Local Optimum ◽  
Impedance Mismatch ◽  
Local Aggregation ◽  
Transmission Quality ◽  
Important Design

The signal integrity of the circuit, as one of the important design issues in high-speed digital system, is usually seriously affected by the signal reflection due to impedance mismatch in the DDR3 bus. In this paper, a novel optimization method is proposed to optimize impedance mismatch and reduce the signal refection. Specifically, by applying the via parasitic, an equivalent model of DDR3 high-speed signal transmission, which bases on the match between the on-die-termination (ODT) value of DDR3 and the characteristic impedance of the transmission line, is established. Additionally, an improved particle swarm optimization algorithm with adaptive perturbation is presented to solve the impedance mismatch problem (IPSO-IMp) based on the above model. The algorithm dynamically judges particles’ state and introduces perturbation strategy for local aggregation, from which the local optimum is avoided and the ability of optimization-searching is activated. IPSO-IMp achieves higher accuracy than the standard algorithm, and the speed increases nearly 33% as well. Finally, the simulation results verify that the solution obviously decreases the signal reflection, with the signal transmission quality increasing by 1.3 dB compared with the existing method.

scholarly journals Design Impedance Mismatch Physical Unclonable Functions for IoT Security

2017 ◽  
Vol 2017 ◽  
pp. 1-8 ◽  
Author(s):  
Xiaomin Zheng ◽  
Yuejun Zhang ◽  
Jiaweng Zhang ◽  
Wenqi Hu
Keyword(s):  
Transmission Line ◽  
Printed Circuit Board ◽  
Signal Transmission ◽  
Characteristic Impedance ◽  
Circuit Board ◽  
Physical Factors ◽  
Current Feedback ◽  
Impedance Mismatch ◽  
Feedback Amplifier ◽  
Current Feedback Amplifier

We propose a new design, Physical Unclonable Function (PUF) scheme, for the Internet of Things (IoT), which has been suffering from multiple-level security threats. As more and more objects interconnect on IoT networks, the identity of each thing is very important. To authenticate each object, we design an impedance mismatch PUF, which exploits random physical factors of the transmission line to generate a security unique private key. The characteristic impedance of the transmission line and signal transmission theory of the printed circuit board (PCB) are also analyzed in detail. To improve the reliability, current feedback amplifier (CFA) method is applied on the PUF. Finally, the proposed scheme is implemented and tested. The measure results show that impedance mismatch PUF provides better unpredictability and randomness.

High-Density, High-Speed Connectors Based on Flexible Etched Circuits

1993 ◽  
Vol 323 ◽  
Author(s):  
David B. Wrisley
Keyword(s):  
Material Properties ◽  
High Speed ◽  
Signal Transmission ◽  
Careful Consideration ◽  
High Density ◽  
Practical Approach ◽  
Semiconductor Technology ◽  
High Transmission ◽  
Transmission Quality ◽  
Electrical Connectors

AbstractWith advances in semiconductor technology straining the ability of packaging to keep pace, conventional electrical connectors cannot always meet emerging requirements in interconnection density and signal transmission speeds.Connectors using flexible etched circuits (FEC) can provide interconnection densities of up to 200 lines per inch and high transmission quality for signals with 250-picosecond risetimes. A practical connector design meeting these density and speed goals depends on careful consideration of connector and system tolerances, ease of application, manufacturability, and material properties.This paper discusses a practical approach to an FEC-based connector and the influence of material properties on connector performance.

Signal Integrity Analysis of High-Speed Signal Connector USB3.0

2013 ◽  
Vol 760-762 ◽  
pp. 320-324
Author(s):  
Shi Lei Zhou ◽  
Ya Lin Guan ◽  
Xin Kun Tang
Keyword(s):  
Transmission Lines ◽  
High Speed ◽  
Signal Integrity ◽  
Signal Transmission ◽  
Simulation Software ◽  
Key Factor ◽  
Transmission Quality ◽  
Integrity Analysis ◽  
Relationship Of ◽  
The Relationship

High-speed signal connector has become a key factor of the signal transmission quality in telecommunications and data communications system. Signal integrity of connector is an inevitable problem. This paper based on the theory of differential transmission lines and Multimode S-Parameters, analyzed the USB3.0 connector signal integrity. And use 3D simulation software CST to build model and analyze the relationship of signal integrity and connectors geometry.

scholarly journals Electrical and Mechanical Analysis of Different TSV Geometries

Metals ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 467
Author(s):  
Il Ho Jeong ◽  
Alireza Eslami Majd ◽  
Jae Pil Jung ◽  
Nduka Nnamdi Ekere
Keyword(s):  
Integrated Circuits ◽  
High Speed ◽  
High Performance ◽  
Signal Transmission ◽  
Characteristic Impedance ◽  
Electrical Signal ◽  
Electrical Performance ◽  
Mechanical Reliability ◽  
Silicon Chips ◽  
The Impact

Through-silicon via (TSV) is an important component for implementing 3-D packages and 3-D integrated circuits as the TSV technology allows stacked silicon chips to interconnect through direct contact to help facilitate high-speed signal processing. By facilitating the stacking of silicon chips, the TSV technology also helps to meet the increasing demand for high density and high performance miniaturized electronic products. Our review of the literature shows that very few studies have reported on the impact of TSV bump geometry on the electrical and mechanical characteristics of the TSV. This paper reports on the investigation of different TSV geometries with the focus on identifying the ideal shapes for improved electrical signal transmission as well as for improved mechanical reliability. The cylindrical, quadrangular (square), elliptical, and triangular shapes were investigated in our study and our results showed that the quadrangular shape had the best electrical performance due to good characteristic impedance. Our results also showed that the quadrangular and cylindrical shapes provided improved mechanical reliability as these two shapes lead to high Cu protrusion of TSV after the annealing process.

Study of Signal Transmission for SIP and POP

2012 ◽  
Vol 220-223 ◽  
pp. 2297-2300 ◽  
Author(s):  
Ling Feng Shi ◽  
Cheng Shan Cai ◽  
Yuan Ming Xiao ◽  
Li Ye Cheng ◽  
Chen Meng ◽  
...  
Keyword(s):  
Signal Integrity ◽  
Signal Transmission ◽  
Equivalent Model ◽  
Signal Quality ◽  
Eye Diagram ◽  
Noise Interference ◽  
Transmission Quality ◽  
Simulation Results ◽  
Return Path ◽  
Diagram Analysis

With the electronic toward miniaturization and multifunctional development, such as System-in-Package (SIP), Package-on-Package (POP), these packages have been widely used. Signal speeds increase and then require that signal has a good transmission quality. Therefore the design of signal integrity should take into account these issues from the beginning design. In this paper, a model about the wire bonding transmission problem between the upper and lower levels of chip is proposed. The simulation results are shown at the different height and radius of the equivalent model. Meanwhile, researching in different cases, noise interference source makes the influence on signal quality. Finally, by adding the signal return path, signal integrity is achieved well by the eye diagram analysis.

The High-Speed Video Signals Fiber Transmission Design Using of Optical Fiber in Photoelectric Tracking Equipment

2013 ◽  
Vol 760-762 ◽  
pp. 298-301
Author(s):  
Zi Jing Zhong ◽  
Guang Dong Liu ◽  
Ying Yu ◽  
Chao Chen
Keyword(s):  
Optical Fiber ◽  
High Speed ◽  
Digital Video ◽  
Signal Transmission ◽  
Digital Signals ◽  
Optical Signals ◽  
Video Signals ◽  
Transmission Design ◽  
Transmission Quality

To improve the quality of the signal transmission and increase the bandwidth in the photoelectric tracking equipment, a kind of mixed transmission design of low-speed digital signals and high-speed digital video signals in use of optical fiber has been carried out. And in the system the high-speed parallel and serial transmission cells realizes the serial and de-serial of the digital video signals in use of the Agilent chip of HDMP-1032/1034, the optical fiber transmits the high-speed optical signals as the transmission media. The signal transmission bandwidth can be up to over 500MHz in use of optical fiber, otherwise the signal transmission quality and environment adaptability has been improved greatly.

High Speed Information Network Planning using Stochastic Optimization Method

2013 ◽  
Author(s):  
Ki-Sang Song ◽  
Arun K. Somani
Keyword(s):  
Stochastic Optimization ◽  
Network Design ◽  
Multimedia Information ◽  
High Speed ◽  
Minimum Cost ◽  
Optimization Method ◽  
Multimedia Communication ◽  
Network Design Problem ◽  
Information Network ◽  
Traffic Characteristics

From the 1994 CAIS Conference: The Information Industry in Transition McGill University, Montreal, Quebec. May 25 - 27, 1994.Broadband integrated services digital network (B-ISDN) based on the asynchronous transmission mode (ATM) is becoming reality to provide high speed, multi bit rate multimedia communications. Multimedia communication network has to support voice, video and data traffics that have different traffic characteristics, delay sensitive or loss sensitive features have to be accounted for designing high speed multimedia information networks. In this paper, we formulate the network design problem by considering the multimedia communication requirements. A high speed multimedia information network design alogrithm is developed using a stochastic optimization method to find good solutions which meet the Quality of Service (QoS) requirement of each traffic class with minimum cost.

Parameter study and optimization design of a hat oblique tunnel portal

2021 ◽  
pp. 095440972110140
Author(s):  
Zijian Guo ◽  
Tanghong Liu ◽  
Wenhui Li ◽  
Yutao Xia
Keyword(s):  
High Speed ◽  
Optimization Design ◽  
Pareto Front ◽  
Optimization Problem ◽  
Optimization Method ◽  
Design Parameters ◽  
Parameter Study ◽  
Buffer Structure ◽  
Tunnel Entrance ◽  
The Ideal

The present work focuses on the aerodynamic problems resulting from a high-speed train (HST) passing through a tunnel. Numerical simulations were employed to obtain the numerical results, and they were verified by a moving-model test. Two responses, [Formula: see text] (coefficient of the peak-to-peak pressure of a single fluctuation) and[Formula: see text] (pressure value of micro-pressure wave), were studied with regard to the three building parameters of the portal-hat buffer structure of the tunnel entrance and exit. The MOPSO (multi-objective particle swarm optimization) method was employed to solve the optimization problem in order to find the minimum [Formula: see text] and[Formula: see text]. Results showed that the effects of the three design parameters on [Formula: see text] were not monotonous, and the influences of[Formula: see text] (the oblique angle of the portal) and [Formula: see text] (the height of the hat structure) were more significant than that of[Formula: see text] (the angle between the vertical line of the portal and the hat). Monotonically decreasing responses were found in [Formula: see text] for [Formula: see text] and[Formula: see text]. The Pareto front of [Formula: see text] and[Formula: see text]was obtained. The ideal single-objective optimums for each response located at the ends of the Pareto front had values of 1.0560 for [Formula: see text] and 101.8 Pa for[Formula: see text].

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