Thermal and Mechanical Analysis of a Multichip Module

1992 ◽  
Vol 264 ◽  
Author(s):  
M. S. Hu
Keyword(s):  
High Speed ◽  
Mechanical Analysis ◽  
High Density ◽  
Electrical Performance ◽  
Multichip Module ◽  
Multichip Modules ◽  
Printed Wiring Board ◽  
Proper Design ◽  
Wiring Board ◽  
High Density Packaging

AbstractHigh speed, high density packaging requirements have made multichip modules (MCM) one of the most active areas of research in the electronic industry.High density printed wiring board (PWB) have low production cost and good electrical performance. However, the most questioned issue in application is the reliability. As a result, a thermal and mechanical analysis on a MCM has been conducted to understand its feasibility. The results indicate that with proper design, the components can operate under satisfactory conditions on PWB laminates.

Z-Interconnect Technology - A Reliable, Cost Efficient Solution for High Density, High Performance Electronic Packaging

2014 ◽  
Vol 2014 (1) ◽  
pp. 000141-000147 ◽  
Author(s):  
John M. Lauffer ◽  
Kevin Knadle
Keyword(s):  
Electronic Packaging ◽  
High Performance ◽  
Performance Enhancement ◽  
High Density ◽  
Consumer Electronics ◽  
Electrical Performance ◽  
Printed Wiring Board ◽  
Electrically Conductive Adhesive ◽  
Plated Through Hole ◽  
Interconnect Technology

Common themes across all segments of electronic packaging today are density and performance. High density interconnect (HDI) technology is one of the most commonly utilized methods for electronic package density improvement, while many different areas have been investigated for performance improvement, from low loss dielectric and conductor materials, to via design and via stub reduction. Electrical performance and density requirements are sometimes complementary, but often times, conflicting with one another. This paper will describe the design, materials, fabrication, and reliability of a new Z-Interconnect technology that addresses both high density and high performance demands simultaneously. Z-Interconnect technology uses an electrically conductive adhesive to electrically interconnect several cores (Full Z) or sub-composites (Sub Z) in a single lamination process. Z-Interconnect technology will be compared and contrasted to other commonly used solutions to the performance and density challenges. HDI or sequential build-up technology is a pervasive solution to the density demands in semiconductor packaging and consumer electronics (e.g. Smart phones), but has not caught hold in HPC or A&D printed wiring board (PWB) applications. One solution for PWB electrical performance enhancement is plated through hole (PTH) stub reduction by “back drilling” the unwanted portion of the PTH. Pb-free reflow and Current Induced Thermal Cycling (CITC) test results of product coupons and specially designed test vehicles, having component pitches down to 0.4mm, will be presented. Z-Interconnect test vehicles have survived 6X Pb-free (260C) reflow cycles, followed by greater than 3000 cycles of 23C–150C CITC cycles. Test vehicle and product coupons also easily survive 10 or more 23C–260C CITC cycles.

Large Form Factor Hybrid LGA Interconnects; Recent Applications and Technical Learning

2014 ◽  
Vol 2014 (1) ◽  
pp. 000550-000560 ◽  
Author(s):  
John Torok ◽  
Brian Beaman ◽  
William Brodsky ◽  
Shawn Canfield ◽  
Jason Eagle ◽  
...  
Keyword(s):  
Form Factor ◽  
System Integration ◽  
Mechanical Analysis ◽  
Electrical Performance ◽  
Bottom Surface ◽  
Printed Wiring Board ◽  
Module Design ◽  
External Cooling ◽  
Reliability Characteristics ◽  
Server Design

Recent high-end server design trends have continued to challenge electronic packaging engineers to design and integrate larger form factor land grid array (LGA) attached modules within their assemblies. These trends have included the application of larger, denser, organic packaged modules whose electrical performance and postencapsulation physical characteristics have been enabled by both the continued development of hybrid LGA connectors as well as new module actuation hardware designs. In this paper, we'll discuss these recent trends, including the specific technical attributes and challenges that need to be addressed to ensure a repeatable and reliable assembly design is developed. Initially, overviews of the latest connector and module design trends, including styles and physical sizes and their implications to the module's bottom surface metallurgy (BSM) flatness requirements, etc. are provided. Pursuant to this, recent system integration trending is reviewed; including both the module quantity per system assembly as well as module to module physical placements and how each of these impact printed wiring board (PWB) design (i.e., layer count, LGA site flatness, etc.) as well as the PWB assembly's solder processing characteristics (i.e., LGA pre- and post-solder attach contact co-planarity, etc.). Completing the application portion, is a description of some recent LGA actuation hardware and module external cooling apparatus designs (e.g., air-cooled heats sinks and water-cooling cold-plates and thermal interface materials (TIMs), etc.). The remaining portion of the paper is dedicated to the description of the mechanical analysis efforts completed to provide a fundamental understanding of the design's “as-assembled” attributes and a review of the associated evaluation completed to verify the integrated assembly's reliability characteristics. From the analysis methodology perspective, both the means of including each of the integrated assembly's key attributes (e.g., module mechanical construction and as encapsulated flatness, LGA contact compliance and stiffness as well as soldered contact coplanarity, TIM stiffness, actuation hardware, heat sink and cold-plate mechanical construction, etc.) and the resulting estimation of the predicted module internal TIM and hybrid-LGA's Pb-free soldered interface strains, actuation hardware stresses and LGA contact load variation are provided. Completing the discussion is a review of the variety of testing executed to validate the design's intended reliability. Included in this is a description of the test vehicle's design, the environmental stress testing conducted (i.e., mechanical pre-conditioning, accelerated thermal cycling (ATC), mixed flowing gas (MFG) and heat aging (HA), etc.) and the resulting data.

The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules

1992 ◽  
Vol 15 (4) ◽  
pp. 465-477 ◽  
Author(s):  
G.-W. Pan ◽  
J.A. Prentice ◽  
S.K. Zahn ◽  
A.J. Staniszewski ◽  
W.L. Walters ◽  
...  
Keyword(s):  
High Speed ◽  
High Density ◽  
Multichip Modules ◽  
Single Chip
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