Using Weibull Statistics to Analyze Ion Beam Enhanced Adhesion as Measured by the pull Test

1991 ◽  
Vol 239 ◽  
Author(s):  
J. E. Pawel ◽  
W. E. Lever ◽  
D. J. Downing ◽  
C. J. Mchargue ◽  
L. J. Romana ◽  
...  
Keyword(s):  
Weibull Distribution ◽  
Failure Probability ◽  
Random Distribution ◽  
Ion Beam ◽  
Film Deposition ◽  
Test Results ◽  
Adhesion Test ◽  
Iron Films ◽  
Weibull Statistics ◽  
Pull Test

ABSTRACTThe adhesion of iron films to single crystal Al2O3 substrates was investigated using a pull test. Chromium (300 keV) or nickel (340 keV) ions were implanted to a fluence of 1 × 1015 ions-cm-2 after film deposition. The adhesion test results were widely scattered due to a random distribution of interfacial flaw sizes controlling the failure nucleation. Because Weibull statistics were developed to describe the failure probability due to a population of flaw-initiated cracks, the Weibull distribution was chosen to analyze the data. Modifications in the adhesion strength due to the ion implantation were reflected in the failure distributions. It was found that the chromium ions improved the adhesion of the Fe/Al2O3 system while the implantation of nickel did not.

The Role Of Ion Species On The Adhesion Enhancement Of ION Beam Mixed Fe/Al2O3 Systems

1991 ◽  
Vol 238 ◽  
Author(s):  
J. E. Pawel ◽  
C. J. Mchargue ◽  
L. J. Romana ◽  
L. L. Horton ◽  
J. J. Wert
Keyword(s):  
Interfacial Energy ◽  
Peak Concentration ◽  
Ion Beam ◽  
Scratch Test ◽  
Film Deposition ◽  
Ion Concentration ◽  
Concentration Profiles ◽  
Pull Test ◽  
Ion Species

ABSTRACTThe role of the ion species on the adhesion enhancement of ion beam mixed Fe/Al2O3 systems has been investigated. The ion implantations were carried out after film deposition using Cr (300 keV), Fe (320 keV), or Ni (340 keV) ions. The adhesion of the films was measured by a pull test and a scratch test. While the three types of implantation result in similar ion concentration profiles (with the peak concentration at the interface) and similar damage profiles, the three species were not equally effective in improving the adhesion. The effects are proposed to be due to changes in the interfacial energy resulting from both the damage and the presence of the ion species at the interface.

Carbon Film Deposition On Silicon Using Low Energy Ion Beams

1991 ◽  
Vol 223 ◽  
Author(s):  
Qin Fuguang ◽  
Yao Zhenyu ◽  
Ren Zhizhang ◽  
S.-T. Lee ◽  
I. Bello ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Ion Beam ◽  
Carbon Film ◽  
Carbon Films ◽  
Film Deposition ◽  
Ion Energy ◽  
Transmission Electron ◽  
Higher Temperature ◽  
Post Implantation ◽  
Beam Deposition

ABSTRACTDirect ion beam deposition of carbon films on silicon in the ion energy range of 15–500eV and temperature range of 25–800°C has been studied using mass selected C+ ions under ultrahigh vacuum. The films were characterized with X-ray photoelectron spectroscopy, Raman spectroscopy, and transmission electron microscopy and diffraction analysis. Films deposited at room temperature consist mainly of amorphous carbon. Deposition at a higher temperature, or post-implantation annealing leads to formation of microcrystalline graphite. A deposition temperature above 800°C favors the formation of microcrystalline graphite with a preferred orientation in the (0001) direction. No evidence of diamond formation was observed in these films.

Manufacturing In-Line Whole Wafer Focused Ion Beam (FIB) Memory Address Descramble Verification

2008 ◽  
Author(s):  
Steven B. Herschbein ◽  
Hyoung H. Kang ◽  
Scott L. Jansen ◽  
Andrew S. Dalton
Keyword(s):  
Flip Chip ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Random Access ◽  
Cell Counting ◽  
Test Results ◽  
Laboratory Procedure ◽  
Memory Array ◽  
Dual Beam ◽  
Process Level

Abstract Test engineers and failure analyst familiar with random access memory arrays have probably encountered the frustration of dealing with address descrambling. The resulting nonsequential internal bit cell counting scheme often means that the location of the failing cell under investigation is nowhere near where it is expected to be. A logical to physical algorithm for decoding the standard library block might have been provided with the design, but is it still correct now that the array has been halved and inverted to fit the available space in a new processor chip? Off-line labs have traditionally been tasked with array layout verification. In the past, hard and soft failures could be induced on the frontside of finished product, then bitmapped to see if the sites were in agreement. As density tightened, flip-chip FIB techniques to induce a pattern of hard fails on packaged devices came into practice. While the backside FIB edit method is effective, it is complex and expensive. The installation of an in-line Dual Beam FIB created new opportunities to move FA tasks out of the lab and into the FAB. Using a new edit procedure, selected wafers have an extensive pattern of defects 'written' directly into the memory array at an early process level. Bitmapping of the RAM blocks upon wafer completion is then used to verify correlation between the physical damaged cells and the logical sites called out in the test results. This early feedback in-line methodology has worked so well that it has almost entirely displaced the complex laboratory procedure of backside FIB memory array descramble verification.

Medium Density Particleboard with Addition of Impregnated Paper

2014 ◽  
Vol 1025-1026 ◽  
pp. 543-546
Author(s):  
Juliana Cortez Barbosa ◽  
Anderson Luiz da Silva Michelon ◽  
Elen Aparecida Martines Morales ◽  
Cristiane Inácio de Campos ◽  
André Luis Christoforo ◽  
...  
Keyword(s):  
Moisture Content ◽  
Modulus Of Elasticity ◽  
Mechanical Tests ◽  
Modulus Of Rupture ◽  
Medium Density ◽  
Test Results ◽  
Thickness Swelling ◽  
Adhesion Test ◽  
Layer Medium ◽  
Determine Moisture Content

The aim of this research was to produce three-layer Medium Density Particleboard (MDP), with the addition of impregnated paper, in the inner layer, in proportions of 1; 5 and 20%. In this study, MDP was composed with particles of small size in outer layers, and larger particles in internal layer. After panel manufacturing, physical and mechanical tests based on Brazilian Code ABNT NBR 14.810 were carried out to determine moisture content; density; thickness swelling; water absorption; modulus of rupture (MOR) and modulus of elasticity (MOE) in static bending and internal adhesion. Test results were compared to commercial panels, produced with 100% Eucalyptus, considering the requirements specified by Brazilian Code. Properties presented values close to normative specifications, indicating positively the possibility of production of MDP using addition of waste paper impregnated.

Ion beam pretreatment of polymeric substrates for ITO thin film deposition

2008 ◽  
Vol 10 (7) ◽  
pp. 941-949 ◽  
Author(s):  
Jun-Sik Cho ◽  
Younggun Han ◽  
Jerome J. Cuomo
Keyword(s):  
Thin Film ◽  
Ion Beam ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Polymeric Substrates

scholarly journals Probabilistic Fracture Energy Assessment of Natural Fibre Reinforced Concrete by Two Parameter Weibull Distribution

2018 ◽  
Vol 7 (3.12) ◽  
pp. 407
Author(s):  
Neha P Asrani ◽  
Murali G ◽  
Arthika J ◽  
Karthikeyan. K ◽  
Haridharan. M.K
Keyword(s):  
Weibull Distribution ◽  
Fracture Energy ◽  
Plain Concrete ◽  
Natural Fibre ◽  
Test Results ◽  
Specific Fracture Energy ◽  
Energy Assessment ◽  
Experimental Process ◽  
Specific Fracture ◽  
Two Parameter

Fracture energy is the post-crack energy absorption ability of the material that represents the energy absorbed by the structure at the time of failure. Its analysis has gained importance and hence requires a powerfulmethod for its development. A two parameter Weibull distribution proves to be an efficient tool in analysing the scattered experimental test results. In this paper, the specific fracture energy of plain concrete and concrete reinforced with natural fibres of hemp, wheat straw and elephant grass are statistically analysed by two parameter Weibull distribution by using graphical method. For determining Weibull parameters, 21 equations have been used and the best equation is taken for the reliability analysis. A Weibull reliability curve is plotted, which shows the specific fracture energy at each reliability level. This curve enables an engineer to choose the fracture energy of a particular mix based on its reliability requirement and safety limit. Therefore, reliability curves are a pioneer in statistical analysis as they eliminate the time-consuming and costly experimental process. This method can be applied in areas with similar uncertainties.  

TiOxCy Thin Film Deposition by CO2+-Ion Beam Sputtering of Titanium

1993 ◽  
Vol 316 ◽  
Author(s):  
BERTILO E. KEMPF
Keyword(s):  
Near Infrared ◽  
Ion Beam ◽  
Thin Film Deposition ◽  
Ion Source ◽  
Film Deposition ◽  
Refractive Indices ◽  
Ion Beam Sputtering ◽  
Infrared Wavelength ◽  
Beam Sputtering ◽  
Current Densities

ABSTRACTTitanium metal is sputtered by ion beams using a Kaufman-type ion source with carbondioxide as working gas. Deposition takes place on watercooled substrates of silicon and InP. The films obtained are amorphous; they adhere excellently. SEM-pictures reveal a featureless dense fracture and a smooth surface. Despite a carbon content of 9 at % the films are highly transparent in the visible and near infrared wavelength range. Refractive indices center around 2.15 at values typically found for amorphous TiO2. The electrical properties are characterized by dielectric constant of ε = 26 ± 3, leakage current densities at breakdown of jL = 3.65 . 10-3 A/cm2 and breakdown fields EB > 1 MeV/cm.

Thin-film deposition of (Ba/sub x/Sr/sub 1-x/)TiO/sub 3/ by pulsed ion beam evaporation

2000 ◽  
Vol 28 (5) ◽  
pp. 1545-1548 ◽  
Author(s):  
T. Sonegawa ◽  
K. Ohtomo ◽  
Weihua Jiang ◽  
K. Yatsui
Keyword(s):  
Thin Film ◽  
Ion Beam ◽  
Thin Film Deposition ◽  
Film Deposition
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