Atomic Layer Epitaxy of GaAs and InAs

1989 ◽  
Vol 145 ◽  
Author(s):  
Weon G. Jeong ◽  
E.P. Menu ◽  
P.D. Dapkus

AbstractThe saturation behavior of growth of GaAs and InAs by atomic layer epitaxy is studied. The growth rate is found to be strongly dependent on alkyl exposure time for the same total alkyl exposure per cycle. The longer the exposure time, the higher the saturated growth rate is. For short exposure, the growth rate saturates to a value less than one monolayer (ML)/cycle. Strong saturation of the growth rate to one ML/cycle is achieved for InAs at a growth temperature of 340°C with 3 sec of trimethylindium exposure. For GaAs, saturation of the growth rate to one ML/cycle is achieved at the growth temperature of 400°C with 10 sec of trimethylgallium exposure. At higher growth temperatures, the growth rate does not saturate but increases slowly with increasing exposure. The large physical size and finite decomposition time of the initial adsorbate are suggested as the cause for the dependence of ALE growth rate on alkyl exposure time.

1991 ◽  
Vol 59 (12) ◽  
pp. 1440-1442 ◽  
Author(s):  
P. C. Colter ◽  
S. A. Hussien ◽  
A. Dip ◽  
M. U. Erdoǧan ◽  
W. M. Duncan ◽  
...  

1991 ◽  
Vol 240 ◽  
Author(s):  
H. Liu ◽  
P. A. Zawadzki ◽  
P. E. Norris

ABSTRACTCurrent difficulties of Atomic Layer Epitaxy (ALE) include relatively low growth rates and narrow process windows. Gas phase reaction, complex behavior of valve switching and purging times are suggested as the major causes [1,2]. We have used a movable X-shaped mechanical barrier to divide the growth chamber into four zones. Each zone supplies either source gas or purging hydrogen. If the barrier is positioned 0.5–2 mm from the wafer carrier, it can efficiently shear off the boundary layer and therefore reduce gas phase reactions. The substrate, constantly rotating beneath the barrier, is alternately exposed to group III or V sources by purging zones. The result is that process times are significantly reduced, saturated growth rate of 1 μm/hour is obtained and a relatively wide process window is observed. It was found that the growth mode was not purely ALE, due to source gas mixing which contributes an additional, possible kinetically limited, component of growth rate. However, this was also found to result in uniform film.


1996 ◽  
Vol 74 (S1) ◽  
pp. 85-88 ◽  
Author(s):  
R. Arès ◽  
C. A. Tran ◽  
S. P. Watkins

Reflectance difference spectroscopy (RDS) has been used to monitor the anisotropy of the surface of InAs and GaAs grown by atomic layer epitaxy (ALE). Saturation of the RDS signal is observed when the surface is fully covered with one monolayer of the impinging surface species. This property is used to optimize the growth interruptions for the ALE cycle. Good correlation of the RDS saturation is observed with growth-rate measurements obtained by X-ray diffraction (XRD). When exposure times are sufficiently long for saturation to be observed in the RDS signal, a growth rate of one monolayer per cycle (1 ML/cycle) is achieved. In principle all the different growth parameters such as exposure and purge times as well as gas flows can be determined in a few cycles performed on a single substrate. Without RDS the same results would require several growth runs and time consuming X-ray characterization.


1991 ◽  
Vol 222 ◽  
Author(s):  
M. Leskela ◽  
L. Niinistö ◽  
E. Nykänen ◽  
P. Soininen ◽  
M. Tiitta

ABSTRACTThe growth of strontium sulfide thin films in a flow-type Atomic Layer Epitaxy reactor from Sr(thd)2 (thd = 2,2,6,6-tetramethyl-3,5-heptanedione) and H2S has been studied. The growth is independent on flow rate and duration of the purge gas (N2) pulse and it does not depend on the Sr(thd)2 and H2S pulses either provided their amounts are sufficient to saturate the surface. The variables significantly affecting the growth rate are the substrate temperature and source temperature for Sr(thd)2. The observed lower than one monolayer growth rate is mainly due to the large size of the Sr(thd)2 molecule.


Author(s):  
A. Jablansky ◽  
Jorge I. Rossero A. ◽  
G. Jursich ◽  
C.G. Takoudis

As microelectronic devices shrink, thinner diffusion barrier layers are needed to separate the copper and silicon substrates while leaving the copper vias open for conduction. Selective atomic layer deposition (ALD) of titanium dioxide(TiO2), a good barrier layer, onto silicon was studied by minimizing the exposure time to air of these substrates immediately before deposition. The minimized exposure time mimicked industrial conditions, where waiting before deposition is costly. Tetrakis(diethylamido)titanium (TDEAT) was used as the precursor, and water was the oxidizing agent. TDEAT was first deposited on silicon wafers using ALD to verify a steady, linear growth rate reported in the literature, and the measured rate of 0.9 ± 0.1 Å/cycle is consistent with values previously reported. Minimized exposure to air had no effect on the growth rate of TiO2 on silicon, and the effect on copper has yet to be determined.


2011 ◽  
Author(s):  
S. L. Li ◽  
H. Wang ◽  
J. Zhang ◽  
Y.-Y. Fang ◽  
W. Fan ◽  
...  

1993 ◽  
Vol 62 (19) ◽  
pp. 2378-2380 ◽  
Author(s):  
Anthony Dip ◽  
Gamal M. Eldallal ◽  
Peter C. Colter ◽  
N. Hayafuji ◽  
S. M. Bedair

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