Fine-tuning of the interface in high-quality epitaxial silicon films deposited by plasma-enhanced chemical vapor deposition at 200 °C

2013 ◽  
Vol 28 (13) ◽  
pp. 1626-1632 ◽  
Author(s):  
Mario Moreno ◽  
Gilles Patriarche ◽  
Pere Roca i Cabarrocas

Abstract

2006 ◽  
Vol 910 ◽  
Author(s):  
Charles W. Teplin ◽  
Matthew Page ◽  
Eugene Iwaniczko ◽  
Kim M. Jones ◽  
Robert M. Ready ◽  
...  

AbstractWe grow epitaxial silicon films onto (100) silicon wafers from pure silane by hot-wire chemical vapor deposition (HWCVD). The films grow epitaxially for a thickness hepi before a Si:H cones nucleate and expand. We study the dependence of hepi on growth rate and the differences between Ta and W filaments. The surface morphology of thin but completely epitaxial films are studied in order to correlate the surface roughness during growth with the eventual epitaxial breakdown thickness. Surface roughness, strain and H at the wafer/film interface are not likely to cause the observed breakdown.


2009 ◽  
Vol 517 (12) ◽  
pp. 3496-3498 ◽  
Author(s):  
Ina T. Martin ◽  
Howard M. Branz ◽  
Paul Stradins ◽  
David L. Young ◽  
Robert C. Reedy ◽  
...  

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