Neutron-Transmutation-Doped Silicon (3rd International Conference, Copenhagen, August 27–29, 1980)

1983 ◽  
Vol 62 (1) ◽  
pp. 122-124
Author(s):  
Heinz Herzer
1984 ◽  
Vol 35 ◽  
Author(s):  
C J Pollard ◽  
K G Barraclough ◽  
M S Skolnick

ABSTRACTScanning electron beam annealing has been used to study the annealing of NTD silicon in the temperature range 600-1180°C. The annealing process has been found to be very rapid above 800°C, a 30 second anneal producing highly uniform n-type material. Below this temperature, an initial drop followed by a progressive rise in sample resistivity with increasing anneal time is consistent with phosphorus dopant activation and the formation of a defect-related acceptor complex.


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