Flip-Chip Bonding Technique for Lead-Free Electronics

2012 ◽  
pp. 273-298
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Flip Chip Bonding ◽  
Bonding Technique

Novel flip-chip bonding technology for W-band interconnections using alternate lead-free solder bumps

2002 ◽  
Vol 12 (10) ◽  
pp. 372-374 ◽  
Author(s):  
K. Onodera ◽  
T. Ishii ◽  
S. Aoyama ◽  
S. Sugitani ◽  
M. Tokumitsu
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Lead Free Solder ◽  
Flip Chip Bonding ◽  
W Band ◽  
Solder Bumps ◽  
Bonding Technology ◽  
Free Solder

15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications

2014 ◽  
Vol 53 (4S) ◽  
pp. 04EB04 ◽  
Author(s):  
Bui Thanh Tung ◽  
Fumiki Kato ◽  
Naoya Watanabe ◽  
Shunsuke Nemoto ◽  
Katsuya Kikuchi ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Flip Chip Bonding ◽  
Bonding Technique

40 Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection

1998 ◽  
Vol 34 (5) ◽  
pp. 493 ◽  
Author(s):  
Y. Miyamoto ◽  
M. Yoneyama ◽  
Y. Imai ◽  
K. Kato ◽  
H. Tsunetsugu
Keyword(s):  
Flip Chip ◽  
Optical Receiver ◽  
Flip Chip Bonding ◽  
Receiver Module ◽  
Bonding Technique

Fluxless flip-chip bonding using a lead-free solder bumping technique

2017 ◽  
Vol 12 (09) ◽  
pp. T09006-T09006 ◽  
Author(s):  
K. Hansen ◽  
S. Kousar ◽  
D. Pitzl ◽  
S. Arab
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Lead Free Solder ◽  
Flip Chip Bonding ◽  
Free Solder

Inductance-controlled electroabsorption Modulator modules using the flip-chip bonding technique

2005 ◽  
Vol 23 (2) ◽  
pp. 582-587 ◽  
Author(s):  
T. Hatta ◽  
T. Miyahara ◽  
M. Ishizaki ◽  
N. Okada ◽  
S. Zaizen ◽  
...  
Keyword(s):  
Flip Chip ◽  
Electroabsorption Modulator ◽  
Flip Chip Bonding ◽  
Bonding Technique

Solder bump height dependence of Josephson chip‐to‐card interconnection inductance using flip‐chip bonding technique

1983 ◽  
Vol 54 (9) ◽  
pp. 5282-5286 ◽  
Author(s):  
Jiro Temmyo ◽  
Katsuhiko Aoki ◽  
Haruo Yoshikiyo ◽  
Shigeyuki Tsurumi ◽  
Yoshiaki Takeuchi
Keyword(s):  
Flip Chip ◽  
Solder Bump ◽  
Bump Height ◽  
Flip Chip Bonding ◽  
Height Dependence ◽  
Bonding Technique
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