A new flip-chip bonding technique using micromachined conductive polymer bumps

1999 ◽  
Vol 22 (4) ◽  
pp. 586-591 ◽  
Author(s):  
K.W. Oh ◽  
C.H. Ahn
Keyword(s):  
Flip Chip ◽  
Conductive Polymer ◽  
Flip Chip Bonding ◽  
Bonding Technique

15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications

2014 ◽  
Vol 53 (4S) ◽  
pp. 04EB04 ◽  
Author(s):  
Bui Thanh Tung ◽  
Fumiki Kato ◽  
Naoya Watanabe ◽  
Shunsuke Nemoto ◽  
Katsuya Kikuchi ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Flip Chip Bonding ◽  
Bonding Technique

40 Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection

1998 ◽  
Vol 34 (5) ◽  
pp. 493 ◽  
Author(s):  
Y. Miyamoto ◽  
M. Yoneyama ◽  
Y. Imai ◽  
K. Kato ◽  
H. Tsunetsugu
Keyword(s):  
Flip Chip ◽  
Optical Receiver ◽  
Flip Chip Bonding ◽  
Receiver Module ◽  
Bonding Technique

Inductance-controlled electroabsorption Modulator modules using the flip-chip bonding technique

2005 ◽  
Vol 23 (2) ◽  
pp. 582-587 ◽  
Author(s):  
T. Hatta ◽  
T. Miyahara ◽  
M. Ishizaki ◽  
N. Okada ◽  
S. Zaizen ◽  
...  
Keyword(s):  
Flip Chip ◽  
Electroabsorption Modulator ◽  
Flip Chip Bonding ◽  
Bonding Technique

Solder bump height dependence of Josephson chip‐to‐card interconnection inductance using flip‐chip bonding technique

1983 ◽  
Vol 54 (9) ◽  
pp. 5282-5286 ◽  
Author(s):  
Jiro Temmyo ◽  
Katsuhiko Aoki ◽  
Haruo Yoshikiyo ◽  
Shigeyuki Tsurumi ◽  
Yoshiaki Takeuchi
Keyword(s):  
Flip Chip ◽  
Solder Bump ◽  
Bump Height ◽  
Flip Chip Bonding ◽  
Height Dependence ◽  
Bonding Technique

scholarly journals Heterogeneous integration approach based on flip-chip bonding and misalignment self-correction elements for electronics-optics integration applications

2012 ◽  
Vol 34 (4) ◽  
pp. 289-297
Author(s):  
Bui Thanh Tung ◽  
Motohiro Suzuki ◽  
Fumiki Kato ◽  
Shunsuke Nemoto ◽  
Masahiro Aoyagi
Keyword(s):  
Mechanical Properties ◽  
Experimental Investigation ◽  
Flip Chip ◽  
Heterogeneous Integration ◽  
Micro Machining ◽  
Bond Properties ◽  
Face To Face ◽  
Integration Approach ◽  
Flip Chip Bonding ◽  
Bonding Technique

This paper presents a high precision bonding approach, capable of submicron alignment accuracy, based on the thermosonic flip-chip bonding technique and misalignment self-correction elements. The precision of the bonding technique is guaranteed by using of misalignment self-correction bump (convex) and hollow (concave) elements. Metal cone bump and conductive sloped hollow bonding pad elements are created using micro-machining techniques, on a chip specimen and substrate, respectively. The chip and substrate are bonded face-to-face using of an ultrasonic-enhanced flip-chip bonder. By introducing of misalignment self-correction elements, repeatable bonding accuracies of less than 500 nm were confirmed through experimental investigation. Bond properties, including electrical and mechanical properties, are also characterized to confirm the success of the bonding approach. With the obtained results, the proposed bonding approach is capable of being use in electronics-optics heterogeneous integration applications.

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